METHOD FOR SENSOR FABRICATION AND RELATED SENSOR AND SYSTEM
    11.
    发明申请
    METHOD FOR SENSOR FABRICATION AND RELATED SENSOR AND SYSTEM 有权
    传感器制造方法及相关传感器及系统

    公开(公告)号:US20090193903A1

    公开(公告)日:2009-08-06

    申请号:US12362741

    申请日:2009-01-30

    摘要: A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.

    摘要翻译: 一种方法包括在第一晶片中形成多个沟槽,在第二晶片的第一表面上形成传感器结构,以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波(SAW)谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。

    Quartz SAW sensor based on direct quartz bonding
    12.
    发明申请
    Quartz SAW sensor based on direct quartz bonding 审中-公开
    石英SAW传感器基于直接石英粘接

    公开(公告)号:US20070164633A1

    公开(公告)日:2007-07-19

    申请号:US11331632

    申请日:2006-01-13

    IPC分类号: H03H9/145

    CPC分类号: G01L9/008 G01L9/0025

    摘要: A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.

    摘要翻译: SAW传感器模块可以使用附着在基板上的真正的所有石英传感器封装(TAQSP)来生产。 TAQSP具有石英盖直接石英结合到石英基板上的SAW传感器。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英粘合到具有许多传感器的石英传感器晶片上进行批量生产,从而制造晶圆串联。 晶圆串联可以进一步处理,因为焊接保护传感器内部。 可以通过从盖晶片上切割条纹,露出SAW传感器接合焊盘,然后将晶片串联切割来获得各个传感器封装。 当传感器封装安装在天线轴承衬底上,然后密封时,会产生SAW传感器模块。

    SENSING DEVICES AND METHODS
    13.
    发明申请
    SENSING DEVICES AND METHODS 有权
    感应装置和方法

    公开(公告)号:US20120036917A1

    公开(公告)日:2012-02-16

    申请号:US13208107

    申请日:2011-08-11

    IPC分类号: G01N7/00 H01L41/22

    摘要: Embodiments of the present disclosure include devices and methods for humidity and temperature sensing. For example, in one embodiment, a sensing device can include a first surface acoustic wave (SAW) component, wherein the first SAW component is a temperature component, a second SAW component, wherein the second SAW component is a humidity component, a third SAW component, wherein the third SAW component is a reference component, and a piezoelectric layer, wherein the first SAW component, the second. SAW component, and the third SAW component are on a surface of the piezoelectric layer.

    摘要翻译: 本公开的实施例包括用于湿度和温度感测的装置和方法。 例如,在一个实施例中,感测装置可以包括第一表面声波(SAW)部件,其中第一SAW部件是温度部件,第二SAW部件,其中第二SAW部件是湿度分量,第三SAW 分量,其中所述第三SAW分量是参考分量,以及压电层,其中所述第一SAW分量,第二SAW分量。 SAW分量和第三SAW分量在压电层的表面上。

    Method for sensor fabrication and related sensor and system
    14.
    发明授权
    Method for sensor fabrication and related sensor and system 有权
    传感器制造方法及相关传感器及系统

    公开(公告)号:US07891252B2

    公开(公告)日:2011-02-22

    申请号:US12362741

    申请日:2009-01-30

    IPC分类号: G01L7/00

    摘要: A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.

    摘要翻译: 一种方法包括在第一晶片中形成多个沟槽,在第二晶片的第一表面上形成传感器结构,以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波(SAW)谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。

    SURFACE ACOUSTIC WAVE BASED SENSOR APPARATUS AND METHOD UTILIZING SEMI-SYNCHRONOUS SAW RESONATORS
    15.
    发明申请
    SURFACE ACOUSTIC WAVE BASED SENSOR APPARATUS AND METHOD UTILIZING SEMI-SYNCHRONOUS SAW RESONATORS 审中-公开
    基于表面声波的传感器装置和利用同步SAW谐振器的方法

    公开(公告)号:US20100141087A1

    公开(公告)日:2010-06-10

    申请号:US12332064

    申请日:2008-12-10

    IPC分类号: H01L41/047

    摘要: A SAW based sensor apparatus utilizing semi-synchronous SAW resonator having a single resonance at Bragg frequency with very high quality factor is disclosed. The semi-synchronous SAW resonator includes at least one inter-digital transducer, which generates and receives surface acoustic wave and a number of grating reflectors, which reflect the surface acoustic wave and generate a standing wave between the reflectors, The interdigital transducer and the grating reflectors can be fabricated on a substrate (e.g., quartz) by photolithographic process. The resonance condition is independent of transducer directivity and reflection coefficient per finger. Such a SAW based sensor apparatus having three semi-synchronous SAW resonators can be utilized for measuring pressure and temperature for a wireless tire-pressure monitoring system.

    摘要翻译: 公开了一种利用具有非常高品质因数的布拉格频率具有单个谐振的半同步SAW谐振器的基于SAW的传感器装置。 半同步SAW谐振器包括至少一个数字间换能器,其产生和接收表面声波和多个反射表面声波并在反射器之间产生驻波的光栅反射器。叉指式换能器和光栅 可以通过光刻工艺在基板(例如石英)上制造反射器。 谐振条件与传感器方向性和每个手指的反射系数无关。 具有三个半同步SAW谐振器的这种基于SAW的传感器装置可用于测量无线轮胎压力监测系统的压力和温度。

    Multifunctional multichip system for wireless sensing
    16.
    发明申请
    Multifunctional multichip system for wireless sensing 有权
    多功能多芯片无线传感系统

    公开(公告)号:US20070164859A1

    公开(公告)日:2007-07-19

    申请号:US11331722

    申请日:2006-01-13

    IPC分类号: G08B1/08 G08B13/14

    CPC分类号: G06K19/0723 G06K19/0716

    摘要: A multifunctional multichip system can operate in a passive mode by using at least one antenna to receive electromagnetic energy and using that energy to perform system functions. The system includes a sensor, an impedance matching circuit and an RFID module. The sensor produces a sensor signal containing a measurement. The RFID can produce an identification signal containing identification information. Alternatively, the RFID chip can be used in an addressing mode wherein the system only produces a signal in response to an addressing signal containing addressing information. The addressing signal is received from the electromagnetic field. In either mode, the sensor signal is coupled from the antenna into the electromagnetic field from which a receiver can obtain it. The signal can contain the identification information as well as the measurement. A matching network minimizes the effects of impedance mismatches between the system elements.

    摘要翻译: 多功能多芯片系统可以通过使用至少一个天线来接收电磁能并使用该能量来执行系统功能,以无源模式操作。 该系统包括传感器,阻抗匹配电路和RFID模块。 传感器产生包含测量值的传感器信号。 RFID可以产生包含识别信息的识别信号。 或者,RFID芯片可以以寻址模式使用,其中系统仅响应于包含寻址信息的寻址信号产生信号。 从电磁场接收寻址信号。 在任一模式中,传感器信号从天线耦合到电磁场中,接收器可从该电磁场获得它。 该信号可以包含识别信息以及测量。 匹配网络可以最大限度地减少系统元件之间阻抗失配的影响。

    PHOTOACOUSTIC METHOD FOR OXYGEN SENSING
    17.
    发明申请
    PHOTOACOUSTIC METHOD FOR OXYGEN SENSING 审中-公开
    氧气感测方法

    公开(公告)号:US20130174645A1

    公开(公告)日:2013-07-11

    申请号:US13345176

    申请日:2012-01-06

    IPC分类号: G01N9/00

    摘要: A method for photoacoustically sensing oxygen in a gaseous sample is disclosed, together with an apparatus for practicing the present method. Efficient and cost-effective oxygen sensing is provided by the use of a light source in the form of a light-emitting diode, which can be selected to correspond with the absorption spectra exhibited by oxygen in a gaseous sample. Filtering can be employed in order to control and narrow the wavelength of light emitted by the light source. An apparatus is disclosed which facilitates practice of the present method, including an arrangement by which ambient noise and vibration can be canceled.

    摘要翻译: 公开了一种用于光气体感测气态样品中的氧的方法,以及用于实施本方法的设备。 通过使用发光二极管形式的光源来提供高效且具成本效益的氧气感测,其可以被选择为与气态样品中的氧所示的吸收光谱相对应。 可以采用滤波来控制和缩小由光源发出的光的波长。 公开了一种便于实施本方法的装置,包括可以消除环境噪声和振动的装置。

    DETECTING ETHANOL AND WATER CONCENTRATIONS IN FUEL
    18.
    发明申请
    DETECTING ETHANOL AND WATER CONCENTRATIONS IN FUEL 审中-公开
    检测燃料中的乙醇和水浓度

    公开(公告)号:US20120223515A1

    公开(公告)日:2012-09-06

    申请号:US13039960

    申请日:2011-03-03

    IPC分类号: B60K15/03 G01J3/00 G01N21/59

    摘要: A device comprises a fuel line that carries a combustible fuel including gasoline, a first optical channel that evaluates a degree of absorption at a first wavelength spectrum of light transmitted through the combustible fuel within the fuel line, and a second optical channel that evaluates a degree of absorption at a second wavelength spectrum. The first and second wavelength spectrums consists of wavelengths of between about 800 nanometers (nm) and about 1200 nm. The device further comprises a controller configured to receive inputs from the first and second optical channels representing the degrees of absorption at the first and second wavelength spectrums, correlate the degrees of absorption with proportions of ethanol and water in the combustible fuel, and output data corresponding to the proportions of ethanol and water to a controller of a combustion engine fed with the combustible fuel.

    摘要翻译: 一种装置包括载有包括汽油的可燃燃料的燃料管线,评估在燃料管线内透过可燃燃料的光的第一波长光谱的吸收度的第一光学通道,以及评价程度的第二光学通道 在第二波长光谱下的吸收。 第一和第二波长光谱由约800纳米(nm)和约1200nm之间的波长组成。 该装置还包括控制器,其被配置为从第一和第二光学通道接收表示第一和第二波长光谱吸收度的输入,将吸收度与可燃燃料中乙醇和水的比例相关联,并输出对应的数据 到乙醇和水的比例到供给可燃燃料的内燃机的控制器。

    SURFACE ACOUSTIC WAVE PRESSURE SENSORS
    19.
    发明申请
    SURFACE ACOUSTIC WAVE PRESSURE SENSORS 失效
    表面声波式压力传感器

    公开(公告)号:US20070126072A1

    公开(公告)日:2007-06-07

    申请号:US11164845

    申请日:2005-12-07

    IPC分类号: H01L29/84 H01L21/00

    摘要: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

    摘要翻译: 改进的SAW压力传感器及其制造方法。 可以提供包括设置在其上的多个SAW换能器的SAW晶片。 还可以提供覆盖晶片,其中玻璃壁位于盖晶片和SAW晶片之间。 覆盖晶片可以固定到SAW晶片,使得玻璃壁围绕SAW换能器。 在一些情况下,玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。 也可以在盖晶片和SAW晶片之间提供一个或多个轮廓,使得当盖晶片相对于SAW晶片设置在上方并且被固定时,轮廓中的至少一个围绕至少一个SAW换能器。

    Vacuum sealed surface acoustic wave pressure sensor
    20.
    发明申请
    Vacuum sealed surface acoustic wave pressure sensor 有权
    真空密封声表面波压力传感器

    公开(公告)号:US20060086188A1

    公开(公告)日:2006-04-27

    申请号:US10971140

    申请日:2004-10-21

    IPC分类号: B23P17/04 G01R3/00

    摘要: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.

    摘要翻译: 本文公开了一种真空密封的SAW压力传感器,其包括被配置为由薄隔膜支撑的SAW器件(例如,SAW谐振器或SAW延迟线)的感测元件。 衬底材料可以实现为石英晶片(即,“基底”晶片)。 SAW器件可以配置在晶片的一侧,并且隔膜在相对侧蚀刻。 因此可以实现基于位于薄隔膜上的SAW器件的表面波速度的变化而操作的石英微加工压力传感器。 SAW传感器通常在真空中密封并且隔膜维持传感器,从而在晶片秤上实现传感器,同时允许每个芯片的成本降低。