公开(公告)号：US20110017080A1

公开(公告)日：2011-01-27

申请号：US12935976

申请日：2009-03-31

Applicant: Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

Inventor： Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

IPC: B41F15/08 ,  B41F15/42

CPC classification number: B41F15/0818 ,  B41P2215/10 ,  B41P2215/50 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/3484

Abstract: There is provided a screen printer capable of concurrently, efficiently subjecting a plurality of substrates, including different types of substrates, to printing operation. In a screen printer 2 that makes up an electronic component mounting line 1 and that prints electronic component bonding paste on a substrate, a substrate conveyance section 8 that conveys a substrate 5 forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section 7A and a second screen printing section 7B arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate 5 from a downstream machine to an upstream side of the screen printer 2 and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine. The plurality of substrates 5, including different types of substrates, can concurrently, efficiently undergo printing operation.

Abstract translation: 提供了能够同时有效地对包括不同类型的基板的多个基板进行打印操作的丝网印刷机。 在构成电子部件安装线1的丝网印刷机2中，在基板上印刷电子部件粘接膏的情况下，在基板的输送方向上将基板5向前方或后方输送的基板搬送部8配置在 在相对于中心线CL对称配置的第一丝网印刷部7A和第二丝网印刷部7B之间的中间位置。 从而可以根据需要采用各种基板输送形式，例如用于将基板5从下游机器返回到丝网印刷机2的上游侧的返回输送和用于使从上游侧发送的基板的旁路输送 通过丝网印刷机，从而被输送到下游机器。 包括不同类型的基板的多个基板5可以同时有效地进行打印操作。

公开(公告)号：US06865803B2

公开(公告)日：2005-03-15

申请号：US10452613

申请日：2003-06-02

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/5193 ,  Y10T29/53 ,  Y10T29/53022 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract translation: 组件安装器，从组件供料器托架中对准的两个或更多个送料器拾取组件，并将它们安装在一个板上。 用于真空保持部件的吸嘴在X方向（送带器排列方向）上以预定的基准间距设置在转印头上，以形成喷嘴线。 两条以上的喷嘴线在Y方向（垂直于X方向）排列。 这些吸嘴同时从带式进料器拾取两个或更多个部件，从而可以减少安装贴装机所需的空间，并使贴片机更紧凑。 同时拾取多个组件的可行性提高也提高了安装效率。

公开(公告)号：US5033185A

公开(公告)日：1991-07-23

申请号：US336903

申请日：1989-04-12

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: B23P21/00 ,  H05K13/00 ,  H05K13/04

CPC classification number: H05K13/0452 ,  H05K13/0413 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53191

Abstract: By providing an electronic component mounting apparatus which an adjusting mechanism for adjusting the amount of drive in a path of transmission of drive from a drive unit, which is used for driving each component mounting head between elevated and lowered positions, to each component mounting head, the limit of position to which each component mounting head can be lowered is made adjustable. The provision of a control unit is also made to control the lowered position of each component mounting head according to the height of each of the electronic components to be mounted by the apparatus. The control unit is also operable to determine the lowered position of each component mounting head for the mounting of subsequent electronic components with the height of a first mounted one of the electronic components taken as a reference value so that a correction value can be added to the reference value when the succeeding electronic components are to be mounted.

Abstract translation: 通过提供一种电子部件安装装置，该电子部件安装装置用于将驱动装置的驱动装置的驱动量调整到各部件安装头部的调整机构， 可以使每个部件安装头可以降低的位置限制是可调节的。 还设置控制单元以根据要由设备安装的每个电子部件的高度来控制每个部件安装头的降低的位置。 控制单元还可操作以确定用于安装后续电子部件的每个部件安装头的下降位置，其中第一安装的一个电子部件的高度作为参考值，使得校正值可以被添加到 当要安装后续电子部件时的参考值。

公开(公告)号：US08499688B2

公开(公告)日：2013-08-06

申请号：US12935976

申请日：2009-03-31

Applicant: Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

Inventor： Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

IPC: B05C17/04 ,  B41F5/16

CPC classification number: B41F15/0818 ,  B41P2215/10 ,  B41P2215/50 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/3484

Abstract: There is provided a screen printer capable of concurrently, efficiently subjecting a plurality of substrates, including different types of substrates, to printing operation. In a screen printer 2 that makes up an electronic component mounting line 1 and that prints electronic component bonding paste on a substrate, a substrate conveyance section 8 that conveys a substrate 5 forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section 7A and a second screen printing section 7B arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate 5 from a downstream machine to an upstream side of the screen printer 2 and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine. The plurality of substrates 5, including different types of substrates, can concurrently, efficiently undergo printing operation.

Abstract translation: 提供了能够同时有效地对包括不同类型的基板的多个基板进行打印操作的丝网印刷机。 在构成电子部件安装线1的丝网印刷机2中，在基板上印刷电子部件粘接膏的情况下，在基板的输送方向上将基板5向前方或后方输送的基板搬送部8配置在 在相对于中心线CL对称配置的第一丝网印刷部7A和第二丝网印刷部7B之间的中间位置。 从而可以根据需要采用各种基板输送形式，例如用于将基板5从下游机器返回到丝网印刷机2的上游侧的返回传送和用于使从上游侧发送的基板的旁路输送 通过丝网印刷机，从而被输送到下游机器。 包括不同类型的基板的多个基板5可以同时有效地进行打印操作。

公开(公告)号：US20120090484A1

公开(公告)日：2012-04-19

申请号：US13267453

申请日：2011-10-06

Applicant: Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

Inventor： Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

IPC: B05C17/04

CPC classification number: B41F15/0818 ,  B41P2215/10 ,  B41P2215/50 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/3484

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract translation: 一种能够同时有效地对多种不同类型的基板进行打印操作的丝网印刷机。 丝网印刷机构成电子部件安装线，并将电子部件粘合膏印刷在基板上。 在基板的输送方向上向前或向后输送基板的基板输送部配置在相对于中心线CL对称配置的第一丝网印刷部和第二丝网印刷部之间的中间位置。 从而可以根据需要采用各种基板输送形式，例如用于将基板从下游机器返回到丝网印刷机的上游侧的返回传送器和用于使从上游侧发送的基板通过的旁路输送 丝网印刷机，从而被输送到下游机器。

公开(公告)号：US07243420B2

公开(公告)日：2007-07-17

申请号：US10838442

申请日：2004-05-04

Applicant: Hiroshi Haji ,  Wataru Hidese

Inventor： Hiroshi Haji ,  Wataru Hidese

IPC: H05K3/30

CPC classification number: H01L21/67253 ,  H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

Abstract: In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated from an upper area of the component. The image taken by the camera is processed by a recognition processing unit to acquire a position of the component. A mounting head transporting mechanism positions the mounting head to the component based upon the recognition processing unit, and the component is picked up by the mounting head. Another camera transporting mechanism transports another camera over a board to take an image of the board. Thereafter, the camera is evacuated from an upper area of the board. The image taken of the board is processed by another recognition processing unit to determine a mounting position. The mounting head then positions the component on the board based upon the determined mounting position.

Abstract translation: 在电子部件安装方法中，相机传送机构将照相机传送到部件供应单元以拍摄部件的图像。 此后，照相机从组件的上部区域排出。 由摄像机拍摄的图像由识别处理单元处理以获取该组件的位置。 安装头传送机构基于识别处理单元将安装头定位到部件上，并且部件被安装头拾起。 另一台摄像机传输机构将另一台摄像机传输到一块板上，以拍摄该板的图像。 此后，相机从板的上部区域排出。 通过另一识别处理单元处理由该板拍摄的图像以确定安装位置。 然后，安装头基于所确定的安装位置将组件定位在板上。

公开(公告)号：US07059043B2

公开(公告)日：2006-06-13

申请号：US10998470

申请日：2004-11-29

Applicant: Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

Inventor： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC: H05K3/30

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

Abstract: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract translation: 一种用于通过转印头9从零件供应部分3中取出电子部件并将电子部件运输和安装到板2上的电子部件安装装置具有独立于转印头9移动并前进到 并且从位于传送通道1上的板2退回以拾取板2的图像以检测其位置。 同时执行由板识别摄像机15进行的板2的图像拾取步骤以及由转印头9在零件供给部中取出步骤的部分。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US06839960B2

公开(公告)日：2005-01-11

申请号：US10216126

申请日：2002-08-08

Applicant: Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

Inventor： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC: H01L21/00 ,  H01L21/68 ,  H05K13/04 ,  H05K3/30

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

Abstract: Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract translation: 通过转印头从零件供应部分取出电子零件的方法，并将电子零件运送并安装在位于输送通道上的板上。 在图像拾取步骤中，电路板识别摄像机独立于转印头移动，并从板上移动和退出以拾取板的图像，以在位置检测步骤中检测其位置。 通过板识别摄像机进行的板的图像拾取步骤以及通过转印头从部件供给部分中取出步骤的部件同时进行。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US06606790B2

公开(公告)日：2003-08-19

申请号：US09885887

申请日：2001-06-20

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: H05K330

CPC classification number: H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/5193 ,  Y10T29/53 ,  Y10T29/53022 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

公开(公告)号：US06453548B1

公开(公告)日：2002-09-24

申请号：US09345754

申请日：1999-07-01

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: H05K330

CPC classification number: H05K13/0061 ,  Y10T29/4913 ,  Y10T29/49828 ,  Y10T29/49829 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/5337

Abstract: An upstream side first conveyor 5 and a downstream side second conveyor 6 are disposed in a mounting area A capable of mounting electronic components P by a transfer head 23. When mounting electronic components P on a large substrate 30A, the large substrate 30A is positioned on the first conveyor 5 and second conveyor 6 which are used as the mounting stage, and the electronic components P are mounted by the transfer head 23. When mounting electronic components on small substrates, the second conveyor 6 is used as the mounting stage, and the small substrate is positioned, and electronic components P are mounted by the transfer head 23, while the first conveyor 5 is used as a waiting stage, and next small substrate is waiting thereon, so that efficient mounting depending on the size of substrates may be realized.

Abstract translation: 上游侧第一输送机5和下游侧第二输送机6设置在能够通过转印头23安装电子元件P的安装区域A.当在大基板30A上安装电子元件P时，大基板30A位于 用作安装台的第一输送机5和第二输送机6以及电子部件P由转印头23安装。当将电子部件安装在小基板上时，第二输送机6用作安装台， 小基板被定位，并且电子部件P由转印头23安装，而第一输送机5用作等待台，下一个小基板正在等待，从而可以实现根据基板尺寸的有效安装 。