公开(公告)号：US20170170394A1

公开(公告)日：2017-06-15

申请号：US14967386

申请日：2015-12-14

Applicant: Winbond Electronics Corp.

Inventor： Frederick Chen ,  Ping-Kun Wang ,  Shao-Ching Liao ,  Po-Yen Hsu ,  Yi-Hsiu Chen ,  Ting-Ying Shen ,  Bo-Lun Wu ,  Meng-Hung Lin

IPC: H01L45/00

CPC classification number: H01L45/1266 ,  H01L45/08 ,  H01L45/085 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/124 ,  H01L45/146

Abstract: A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The bottom electrode is disposed over a substrate. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer as an oxygen supply layer is at least disposed at sidewalls of the oxygen exchange layer.