公开(公告)号：US07777198B2

公开(公告)日：2010-08-17

申请号：US11686881

申请日：2007-03-15

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： H01J37/20

CPC分类号： B05D3/0209 ,  B05D3/0493 ,  B05D3/067 ,  H01L21/31058 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US07566891B2

公开(公告)日：2009-07-28

申请号：US11686878

申请日：2007-03-15

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Andrzei Kaszuba ,  Tom K. Cho

IPC分类号： G01N21/00 ,  G01N21/33 ,  B01J19/08 ,  B29C35/08

CPC分类号： B05D3/067

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US20090162259A1

公开(公告)日：2009-06-25

申请号：US12393851

申请日：2009-02-26

申请人： Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Andrzej Kaszuba ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Sanjeev Baluja ,  Tom Cho ,  Josephine Chang ,  Hichem M'saad

发明人： Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Andrzej Kaszuba ,  Scott A. Hendrickson ,  Dustin W. Ho ,  Sanjeev Baluja ,  Tom Cho ,  Josephine Chang ,  Hichem M'saad

IPC分类号： B01J19/08

CPC分类号： B05D3/067 ,  B05D3/0209 ,  B05D3/0493 ,  H01L21/31058

摘要： An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV sources per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV sources can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.

摘要翻译： 紫外线（UV）固化室可固化设置在基底上的电介质材料并进行原位清洁。 串联处理室提供由覆盖有盖的主体限定的两个单独的和相邻的过程区域，所述盖子具有分别位于每个处理区域上方的窗口。 每个处理区域的一个或多个UV源被耦合到盖的壳体覆盖，将通过窗口的UV光发射到位于处理区域内的衬底上。 UV源可以是利用诸如微波或射频之类的源的发光二极管或灯泡阵列。 紫外光可以在固化过程中被脉冲。 使用远程生成的氧自由基/臭氧和/或原位实现清洁室。 灯阵列的使用，基板和灯头的相对运动以及灯反射器形状和/或位置的实时修改可以增强基板照明的均匀性。

公开(公告)号：US20070295012A1

公开(公告)日：2007-12-27

申请号：US11556642

申请日：2006-11-03

申请人： Dustin W. Ho ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Scott A. Hendrickson ,  Sanjeev Baluja ,  Ndanka O. Mukuti

发明人： Dustin W. Ho ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Scott A. Hendrickson ,  Sanjeev Baluja ,  Ndanka O. Mukuti

IPC分类号： F25D3/12

CPC分类号： H01L21/67109 ,  H01L21/67115

摘要： A re-circulating cooling system can be used with a curing system in order to reduce the exhaust requirements for the system. Further, using a cooling fluid such as nitrogen reduces the production of ozone and the sealing requirements for the system. A simple heat exchanger can be used between return and supply reservoirs in order to remove heat added to the re-circulating fluid during circulation past the curing radiation source. The nitrogen can come from a nitrogen source, or from a membrane or other device operable to split feed gas into its molecular components to provide a source of gas rich in nitrogen. An ozone destruction unit can be used with such a cooling system to reduce the amount of ozone to acceptable levels, and to minimize consumption of the nitrogen. A catalyst can be used to deplete the ozone that does not get consumed during the reaction.

摘要翻译： 再循环冷却系统可以与固化系统一起使用，以减少系统的排气要求。 此外，使用诸如氮气的冷却流体减少臭氧的产生和系统的密封要求。 在回流和供应储存器之间可以使用简单的热交换器，以便在循环通过固化辐射源之前除去添加到再循环流体中的热量。 氮气可以来自氮源，或者来自可以将进料气体分解成其分子组分以提供富含氮的气体源的膜或其它装置。 臭氧破坏装置可与这种冷却系统一起使用，以将臭氧的量减少至可接受的水平，并最大限度地减少氮的消耗。 可以使用催化剂来消耗在反应期间不消耗的臭氧。

公开(公告)号：US20070298167A1

公开(公告)日：2007-12-27

申请号：US11556787

申请日：2006-11-06

申请人： DUSTIN W. HO ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Scott A. Hendrickson ,  Sanjeev Baluja ,  Ndanka O. Mukuti

发明人： DUSTIN W. HO ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Scott A. Hendrickson ,  Sanjeev Baluja ,  Ndanka O. Mukuti

IPC分类号： B05D7/22

CPC分类号： B05D3/067 ,  B01D53/8675 ,  B01D2255/1023 ,  B01D2255/2073 ,  B01D2255/20761 ,  B05D3/0486

摘要： A re-circulating cooling system can be used with a curing system in order to reduce the exhaust requirements for the system. Further, using a cooling fluid such as nitrogen reduces the production of ozone and the sealing requirements for the system. A simple heat exchanger can be used between return and supply reservoirs in order to remove heat added to the re-circulating fluid during circulation past the curing radiation source. The nitrogen can come from a nitrogen source, or from a membrane or other device operable to split feed gas into its molecular components to provide a source of gas rich in nitrogen. An ozone destruction unit can be used with such a cooling system to reduce the amount of ozone to acceptable levels, and to minimize consumption of the nitrogen. A catalyst can be used to deplete the ozone that does not get consumed during the reaction.

摘要翻译： 再循环冷却系统可以与固化系统一起使用，以减少系统的排气要求。 此外，使用诸如氮气的冷却流体减少臭氧的产生和系统的密封要求。 在回流和供应储存器之间可以使用简单的热交换器，以便在循环通过固化辐射源之前除去添加到再循环流体中的热量。 氮气可以来自氮源，或者来自可以将进料气体分解成其分子组分以提供富含氮的气体源的膜或其它装置。 臭氧破坏装置可与这种冷却系统一起使用，以将臭氧的量减少至可接受的水平，并最大限度地减少氮的消耗。 可以使用催化剂来消耗在反应期间不消耗的臭氧。

公开(公告)号：US08274017B2

公开(公告)日：2012-09-25

申请号：US12641819

申请日：2009-12-18

申请人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

发明人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

IPC分类号： H05B3/68

CPC分类号： H01L21/67109 ,  H01L21/68792

摘要： Embodiments of the invention generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one embodiment, a pedestal for a semiconductor processing chamber is provided. The pedestal comprises a substrate support comprising a conductive material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to the substrate support at a first end and a mating interface at an opposing end, the hollow shaft comprising a shaft body having a hollow core, and a cooling channel assembly encircling the hollow core and disposed within the shaft body for removing heat from the pedestal via an internal cooling path, wherein the substrate support has a heat control gap positioned between the heating element and the ring-shaped cooling channel.

摘要翻译： 本发明的实施例一般涉及半导体处理室，更具体地说，涉及用于半导体处理室的加热支撑基座。 在一个实施例中，提供了一种用于半导体处理室的基座。 基座包括基板支撑件，该基板支撑件包括导电材料并且具有用于接收基板的支撑表面，封装在基板支撑件内的电阻加热器，在第一端处耦合到基板支撑件的中空轴和在相对端处的配合接口， 所述空心轴包括具有中空芯的轴体和围绕所述中空芯的冷却通道组件，所述冷却通道组件设置在所述轴体内，用于经由内部冷却路径从所述基座移除热量，其中所述基板支撑件具有位于 加热元件和环形冷却通道。

公开(公告)号：US20120090691A1

公开(公告)日：2012-04-19

申请号：US13248656

申请日：2011-09-29

申请人： Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Alexandros T. Demos ,  Thomas Nowak ,  Jianhua Zhou

发明人： Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Alexandros T. Demos ,  Thomas Nowak ,  Jianhua Zhou

IPC分类号： F17D1/16 ,  B08B5/00 ,  C23C16/48

CPC分类号： C23C16/56 ,  C23C16/4405 ,  C23C16/45565 ,  C23C16/482 ,  H01L21/6719 ,  H01L21/67742 ,  Y10T137/0391

摘要： Embodiments of the invention generally provide apparatuses and methods for controlling the gas flow profile within a processing chamber. In one embodiment, a processing tool includes an ultraviolet processing chamber defining a processing region, a substrate support, a window disposed between a UV radiation source and the substrate support, and a transparent showerhead disposed within the processing region between the window and the substrate support and having one or more transparent showerhead passages between upper and lower processing regions. The processing tool also includes a gas distribution ring having one or more gas distribution ring passages between a gas distribution ring inner channel and the upper processing region and a gas outlet ring positioned below the gas distribution ring, the gas outlet ring having one or more gas outlet passages between a gas outlet ring inner channel within the gas outlet ring and the lower processing region.

摘要翻译： 本发明的实施例通常提供用于控制处理室内的气流分布的装置和方法。 在一个实施例中，处理工具包括限定处理区域的紫外线处理室，衬底支撑件，设置在UV辐射源和衬底支撑件之间的窗口，以及布置在窗口和衬底支撑件之间的处理区域内的透明花洒 并且在上下处理区域之间具有一个或多个透明花洒通道。 处理工具还包括气体分配环，气体分配环具有在气体分配环内部通道和上部加工区域之间的一个或多个气体分配环通道和位于气体分配环下方的气体出口环，气体出口环具有一个或多个气体 气体出口环内的气体出口环内部通道和下部加工区域之间的出口通道。

公开(公告)号：US20070298362A1

公开(公告)日：2007-12-27

申请号：US11562043

申请日：2006-11-21

申请人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Sanjeev Baluja ,  Andrzej Kaszuba ,  Ndanka O. Mukuti

发明人： Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Sanjeev Baluja ,  Andrzej Kaszuba ,  Ndanka O. Mukuti

IPC分类号： F27D3/00 ,  F27D11/00

CPC分类号： F27B17/0025 ,  H01L21/67115

摘要： A pump liner is used to direct a laminar flow of purge gas across a workpiece to remove contaminants or species outgassed or otherwise produced by the workpiece during processing. The pump liner can take the form of a ring having a plurality of injection ports, such as slits of a variety of shapes and/or sizes, opposite a plurality of receiving ports in order to provide the laminar flow. The flow of purge gas is sufficient to carry a contaminant or outgassed species from the processing chamber in order to prevent the collection of the contaminants on components of the chamber. The pump liner can be heated, via conduction and irradiation from a radiation source, for example, in order to prevent the condensation of species on the liner. The pump liner also can be anodized or otherwise processed in order to increase the emissivity of the liner.

摘要翻译： 泵衬套用于引导吹扫气体的层流穿过工件以去除在加工过程中由工件脱气或以其它方式产生的污染物或物质。 泵衬套可以采取具有多个注入口的环的形式，例如与多个接收端口相对的各种形状和/或尺寸的狭缝，以提供层流。 吹扫气体的流动足以承载来自处理室的污染物或去气物质，以便防止在室的部件上收集污染物。 可以通过例如辐射源的传导和辐射来加热泵衬垫，以防止物质在衬套上的冷凝。 泵衬垫也可以被阳极化处理或以其它方式加工，以便增加衬套的发射率。

公开(公告)号：US20120003398A1

公开(公告)日：2012-01-05

申请号：US12976746

申请日：2010-12-22

申请人： Andrzei Kaszuba ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Sanjeev Baluja ,  Ashish Shah ,  Inna Shmurun

发明人： Andrzei Kaszuba ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Sanjeev Baluja ,  Ashish Shah ,  Inna Shmurun

IPC分类号： B29C35/08 ,  G21K5/00

CPC分类号： B05D3/067 ,  B29C71/04 ,  B29C2035/0827 ,  F26B3/28 ,  H01L21/67115

摘要： Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.

摘要翻译： 本发明的实施方案一般涉及用于固化设置在基底上的介电材料的紫外（UV）固化室和使用UV辐射固化电介质材料的方法。 根据一个实施例的基板处理工具包括限定基板处理区域的主体; 衬底支撑件，适于支撑衬底处理区域内的衬底; 与衬底支撑件间隔开的紫外线辐射灯，所述灯被配置为将紫外线辐射透射到位于所述衬底支撑件上的衬底; 以及可操作地耦合以使所述紫外线辐射灯或衬底支撑体中的至少一个相对于彼此旋转至少180度的电动机。 衬底处理工具还可以包括一个或多个反射器，其适于在衬底上产生具有互补的高和低强度区域的紫外线辐射的泛化图案，其结合以在旋转时产生基本上均匀的辐照度图案。 还公开了其他实施例。

公开(公告)号：US20110147363A1

公开(公告)日：2011-06-23

申请号：US12641819

申请日：2009-12-18

申请人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

发明人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

IPC分类号： H05B3/68

CPC分类号： H01L21/67109 ,  H01L21/68792

摘要： Embodiments of the invention generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one embodiment, a pedestal for a semiconductor processing chamber is provided. The pedestal comprises a substrate support comprising a conductive material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to the substrate support at a first end and a mating interface at an opposing end, the hollow shaft comprising a shaft body having a hollow core, and a cooling channel assembly encircling the hollow core and disposed within the shaft body for removing heat from the pedestal via an internal cooling path, wherein the substrate support has a heat control gap positioned between the heating element and the ring-shaped cooling channel.

摘要翻译： 本发明的实施例一般涉及半导体处理室，更具体地说，涉及用于半导体处理室的加热支撑基座。 在一个实施例中，提供了一种用于半导体处理室的基座。 基座包括基板支撑件，该基板支撑件包括导电材料并且具有用于接收基板的支撑表面，封装在基板支撑件内的电阻加热器，在第一端处耦合到基板支撑件的中空轴和在相对端处的配合接口， 所述空心轴包括具有中空芯的轴体和围绕所述中空芯的冷却通道组件，所述冷却通道组件设置在所述轴体内，用于经由内部冷却路径从所述基座移除热量，其中所述基板支撑件具有位于 加热元件和环形冷却通道。