公开(公告)号：US20120156877A1

公开(公告)日：2012-06-21

申请号：US12973845

申请日：2010-12-20

申请人： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

发明人： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

IPC分类号： H01L21/302 ,  B08B7/00 ,  B05C5/00 ,  H01L21/31 ,  B05B7/16 ,  H01L21/306

CPC分类号： C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  C23C16/45574 ,  C23C16/5096

摘要： A top assembly for a processing chamber having a back plate and a hub is provided. The back plate has a first portion and a second portion. The first portion is connected to the second portion through a central region of the back plate, wherein a gap is defined between opposing surfaces of the first and second portions outside the central region. The first portion includes an embedded heating element. The hub is affixed to a top surface of the second portion of the back plate over the central region. The hub has a top surface with a plurality of channel openings defined within a central region of the hub and a bottom surface having a central extension with a plurality of channels defined therethrough. The bottom surface includes an annular extension spaced apart from the central extension.

摘要翻译： 提供了具有背板和毂的用于处理室的顶部组件。 背板具有第一部分和第二部分。 第一部分通过背板的中心区域连接到第二部分，其中在中心区域外部的第一和第二部分的相对表面之间限定间隙。 第一部分包括嵌入式加热元件。 轮毂在中心区域上固定在背板的第二部分的顶表面上。 毂具有顶表面，其具有限定在毂的中心区域内的多个通道开口，底面具有中心延伸部，多个通道限定在其中。 底表面包括与中心延伸部间隔开的环形延伸部。

公开(公告)号：US20110147363A1

公开(公告)日：2011-06-23

申请号：US12641819

申请日：2009-12-18

申请人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

发明人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

IPC分类号： H05B3/68

CPC分类号： H01L21/67109 ,  H01L21/68792

摘要： Embodiments of the invention generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one embodiment, a pedestal for a semiconductor processing chamber is provided. The pedestal comprises a substrate support comprising a conductive material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to the substrate support at a first end and a mating interface at an opposing end, the hollow shaft comprising a shaft body having a hollow core, and a cooling channel assembly encircling the hollow core and disposed within the shaft body for removing heat from the pedestal via an internal cooling path, wherein the substrate support has a heat control gap positioned between the heating element and the ring-shaped cooling channel.

摘要翻译： 本发明的实施例一般涉及半导体处理室，更具体地说，涉及用于半导体处理室的加热支撑基座。 在一个实施例中，提供了一种用于半导体处理室的基座。 基座包括基板支撑件，该基板支撑件包括导电材料并且具有用于接收基板的支撑表面，封装在基板支撑件内的电阻加热器，在第一端处耦合到基板支撑件的中空轴和在相对端处的配合接口， 所述空心轴包括具有中空芯的轴体和围绕所述中空芯的冷却通道组件，所述冷却通道组件设置在所述轴体内，用于经由内部冷却路径从所述基座移除热量，其中所述基板支撑件具有位于 加热元件和环形冷却通道。

公开(公告)号：US20090314208A1

公开(公告)日：2009-12-24

申请号：US12490168

申请日：2009-06-23

申请人： Jianhua Zhou ,  Lipyeow Yap ,  Dmitry Sklyar ,  Mohamad Ayoub ,  Karthik Janakiraman ,  Juan Carlos Rocha-Alvarez

发明人： Jianhua Zhou ,  Lipyeow Yap ,  Dmitry Sklyar ,  Mohamad Ayoub ,  Karthik Janakiraman ,  Juan Carlos Rocha-Alvarez

IPC分类号： C23C16/54

CPC分类号： C23C16/4586 ,  C23C16/46 ,  C23C16/52 ,  H01L21/67103 ,  H01L21/68792

摘要： A method and apparatus for providing power to a heated support pedestal is provided. In one embodiment, a process kit is described. The process kit includes a hollow shaft made of a conductive material coupled to a substrate support at one end and a base assembly at an opposing end, the base assembly adapted to couple to a power box disposed on a semiconductor processing tool. In one embodiment, the base assembly comprises at least one exposed electrical connector disposed in an insert made of a dielectric material, such as a plastic resin.

摘要翻译： 提供了一种用于向加热的支撑台提供电力的方法和装置。 在一个实施方案中，描述了处理试剂盒。 该处理套件包括一个空心轴，该导电材料由一端连接到一基板支撑件，一相对端连接一底座组件，该基座组件适于耦接至设置在半导体加工工具上的动力箱。 在一个实施例中，基座组件包括至少一个暴露的电连接器，其设置在由电介质材料（例如塑料树脂）制成的插入件中。

公开(公告)号：US08733280B2

公开(公告)日：2014-05-27

申请号：US12973845

申请日：2010-12-20

申请人： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

发明人： Lipyeow Yap ,  Jay DeDontney ,  Shouqian Shao ,  Jason Wright

IPC分类号： C23C16/455 ,  C23C16/505 ,  H01L21/3065

CPC分类号： C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  C23C16/45574 ,  C23C16/5096

摘要： A top assembly for a processing chamber having a back plate and a hub is provided. The back plate has a first portion and a second portion. The first portion is connected to the second portion through a central region of the back plate, wherein a gap is defined between opposing surfaces of the first and second portions outside the central region. The first portion includes an embedded heating element. The hub is affixed to a top surface of the second portion of the back plate over the central region. The hub has a top surface with a plurality of channel openings defined within a central region of the hub and a bottom surface having a central extension with a plurality of channels defined therethrough. The bottom surface includes an annular extension spaced apart from the central extension.

摘要翻译： 提供了具有背板和毂的用于处理室的顶部组件。 背板具有第一部分和第二部分。 第一部分通过背板的中心区域连接到第二部分，其中在中心区域外部的第一和第二部分的相对表面之间限定间隙。 第一部分包括嵌入式加热元件。 轮毂在中心区域上固定在背板的第二部分的顶表面上。 毂具有顶表面，其具有限定在毂的中心区域内的多个通道开口，底面具有中心延伸部，多个通道限定在其中。 底表面包括与中心延伸部间隔开的环形延伸部。

公开(公告)号：US08274017B2

公开(公告)日：2012-09-25

申请号：US12641819

申请日：2009-12-18

申请人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

发明人： Lipyeow Yap ,  Tuan Anh Nguyen ,  Dale R. Du Bois ,  Sanjeev Baluja ,  Thomas Nowak ,  Juan Carlos Rocha-Alvarez ,  Jianhua Zhou

IPC分类号： H05B3/68

CPC分类号： H01L21/67109 ,  H01L21/68792

摘要： Embodiments of the invention generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one embodiment, a pedestal for a semiconductor processing chamber is provided. The pedestal comprises a substrate support comprising a conductive material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to the substrate support at a first end and a mating interface at an opposing end, the hollow shaft comprising a shaft body having a hollow core, and a cooling channel assembly encircling the hollow core and disposed within the shaft body for removing heat from the pedestal via an internal cooling path, wherein the substrate support has a heat control gap positioned between the heating element and the ring-shaped cooling channel.

摘要翻译： 本发明的实施例一般涉及半导体处理室，更具体地说，涉及用于半导体处理室的加热支撑基座。 在一个实施例中，提供了一种用于半导体处理室的基座。 基座包括基板支撑件，该基板支撑件包括导电材料并且具有用于接收基板的支撑表面，封装在基板支撑件内的电阻加热器，在第一端处耦合到基板支撑件的中空轴和在相对端处的配合接口， 所述空心轴包括具有中空芯的轴体和围绕所述中空芯的冷却通道组件，所述冷却通道组件设置在所述轴体内，用于经由内部冷却路径从所述基座移除热量，其中所述基板支撑件具有位于 加热元件和环形冷却通道。

公开(公告)号：US20110034034A1

公开(公告)日：2011-02-10

申请号：US12851794

申请日：2010-08-06

申请人： Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Ganesh Balasubramanian ,  Lipyeow Yap ,  Jianhua Zhou ,  Thomas Nowak

发明人： Dale R. Du Bois ,  Juan Carlos Rocha-Alvarez ,  Sanjeev Baluja ,  Ganesh Balasubramanian ,  Lipyeow Yap ,  Jianhua Zhou ,  Thomas Nowak

IPC分类号： H01L21/46 ,  B05C13/00 ,  B23Q3/00

CPC分类号： H01L21/68 ,  B05C13/00 ,  C23C16/4585 ,  H01J37/32091 ,  H01L21/324 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/6875

摘要： A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering members for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering members are movably disposed along a periphery of the support surface, and each of the plurality of centering members comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.

摘要翻译： 提供了一种用于加热室中的衬底的方法和装置。 用于将基板定位在处理室中的装置。 在一个实施例中，该装置包括基板支撑组件，该基板支撑组件具有适于接收基板的支撑表面和用于在平行于支撑表面的距离处支撑基板的多个定心构件，并且用于使基板相对于参考轴线基本垂直 到支撑面。 多个定心构件沿着支撑表面的周边可移动地设置，并且多个定心构件中的每一个包括用于接触或支撑衬底的周缘的第一端部。