公开(公告)号：US20090075063A1

公开(公告)日：2009-03-19

申请号：US12232576

申请日：2008-09-19

申请人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

发明人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

IPC分类号： B32B5/16 ,  C08L37/00 ,  C09D5/02 ,  B05D3/02

CPC分类号： C09D133/06 ,  B05D7/532 ,  C08G65/3322 ,  C08L33/06 ,  C08L33/062 ,  C08L33/064 ,  C08L67/00 ,  C09D5/36 ,  C09D133/066 ,  C09D167/00 ,  Y10T428/254 ,  C08L2666/04 ,  C08L2666/18

摘要： This invention provides an automobile water-based paint capable of forming coating film of little metallic mottling and excellent flip-flop property and smoothness, which comprises hydroxyl-containing resin, viscosity-regulating agent and hydrophobic solvent, the viscosity-regulating agent being a copolymer obtained by copolymerizing a monomeric mixture containing a (meth)acrylic acid (salt), monomer represented by the following formula (1) [in which R1 stands for hydrogen or methyl, R2 and R3 stand for hydrogen, methyl or ethyl, R4 stands for C8-24 hydrocarbon group, and n is an integer of 3-60], alkyl (meth)acrylate of which alkyl moiety has 1-4 carbons and a monomer having at least two polymerizable unsaturated groups per molecule, at specific ratios.

摘要翻译： 本发明提供一种汽车水性涂料，其能够形成少量金属斑点和优异的触发性和平滑性的涂膜，其包含含羟基的树脂，粘度调节剂和疏水性溶剂，粘度调节剂为共聚物 通过共聚含有（甲基）丙烯酸（盐）的单体混合物，由下式（1）表示的单体[其中R1代表氢或甲基，R2和R3代表氢，甲基或乙基，R4代表 C8-24烃基，n为3-60的整数），烷基部分为1-4个碳原子的（甲基）丙烯酸烷基酯和每分子具有至少两个可聚合不饱和基团的单体。

公开(公告)号：US07169216B2

公开(公告)日：2007-01-30

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US5645364A

公开(公告)日：1997-07-08

申请号：US406100

申请日：1995-03-16

申请人： Yasuo Hodozuka ,  Tadashi Iida ,  Yoshikazu Yamaga ,  Satoshi Ueda ,  Yasuo Imaizumi

发明人： Yasuo Hodozuka ,  Tadashi Iida ,  Yoshikazu Yamaga ,  Satoshi Ueda ,  Yasuo Imaizumi

IPC分类号： B23K9/02 ,  B23K9/025 ,  F16B5/08

CPC分类号： F16B5/08 ,  B23K9/02 ,  B23K9/025 ,  B23K2201/16 ,  Y10T403/477

摘要： In order to join a first plate element such as a rear quarter panel of an automobile and a second plate element such as a roof panel together, an edge portion of the first plate element is provided with a joggled portion. The joggled portion is formed integrally with a general portion of the first plate element by way of a shoulder. The joggled portion includes an offset reinforcing portion having a band-shaped recess along the shoulder. A major portion lying closer to the terminal edge of the joggled portion than the reinforcing portion includes a joining surface to which an edge portion of the second plate element is joined in a face-to-face contact in such a manner that a gap is defined between an terminal edge of the edge portion and the shoulder. A welding material is built up into the recess of the reinforcing portion through the gap to thereby join the first and second plate elements together. The welding material within the recess reaches the back side of the second plate element so that the welding area is increased by the welding material and that the rigidity and strength of the joined structure is increased due to the cooperation of the reinforcing portion and the welding material. The structure prevents a local heating, suppresses thermal strains and concave thermal deformation of the two plate elements after cooling, and hence omits the hammering after the welding.

摘要翻译： 为了将诸如汽车的后四分之一面板的第一板元件和诸如屋顶板的第二板元件结合在一起，第一板元件的边缘部分设有翘曲部分。 该弯曲部分通过肩部与第一板元件的一般部分一体地形成。 弯曲部分包括具有沿着肩部的带状凹部的偏移加强部分。 位于比加强部分更靠近弯曲部分的末端边缘的主要部分包括接合表面，第二板状元件的边缘部分以面对面接触的方式接合到该接合表面，使得间隙被限定 在边缘部分的终端边缘和肩部之间。 通过间隙将焊接材料积聚在加强部的凹部中，从而将第一和第二板状部件接合在一起。 凹部内的焊接材料到达第二板状元件的背面，焊接面积增加，并且由于加强部和焊接材料的配合，接合结构的刚性和强度增加 。 该结构防止局部加热，在冷却后抑制两个板状元件的热应变和凹形热变形，因此省略了焊接后的锤击。

公开(公告)号：US08008393B2

公开(公告)日：2011-08-30

申请号：US12232576

申请日：2008-09-19

申请人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

发明人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

IPC分类号： C08L33/00

CPC分类号： C09D133/06 ,  B05D7/532 ,  C08G65/3322 ,  C08L33/06 ,  C08L33/062 ,  C08L33/064 ,  C08L67/00 ,  C09D5/36 ,  C09D133/066 ,  C09D167/00 ,  Y10T428/254 ,  C08L2666/04 ,  C08L2666/18

摘要： This invention provides an automobile water-based paint capable of forming coating film of little metallic mottling and excellent flip-flop property and smoothness, which comprises hydroxyl-containing resin, viscosity-regulating agent and hydrophobic solvent, the viscosity-regulating agent being a copolymer obtained by copolymerizing a monomeric mixture containing a (meth)acrylic acid (salt), monomer represented by the following formula (1) [in which R1 stands for hydrogen or methyl, R2 and R3 stand for hydrogen, methyl or ethyl, R4 stands for C8-24 hydrocarbon group, and n is an integer of 3-60], alkyl (meth)acrylate of which alkyl moiety has 1-4 carbons and a monomer having at least two polymerizable unsaturated groups per molecule, at specific ratios.

摘要翻译： 本发明提供一种汽车水性涂料，其能够形成少量金属斑点和优异的触发性和平滑性的涂膜，其包含含羟基的树脂，粘度调节剂和疏水性溶剂，粘度调节剂为共聚物 通过共聚含有（甲基）丙烯酸（盐）的单体混合物，由下式（1）表示的单体[其中R1代表氢或甲基，R2和R3代表氢，甲基或乙基，R4代表 C8-24烃基，n为3-60的整数），烷基部分为1-4个碳原子的（甲基）丙烯酸烷基酯和每分子具有至少两个可聚合不饱和基团的单体。

公开(公告)号：US20100322506A1

公开(公告)日：2010-12-23

申请号：US12819514

申请日：2010-06-21

申请人： Yoshinori MURAMATSU ,  Ryoji Shiwaku ,  Tadashi Iida

发明人： Yoshinori MURAMATSU ,  Ryoji Shiwaku ,  Tadashi Iida

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30141

摘要： An inspection system is disclosed, which inspects a wiring pattern on a high multilayer printed wiring board while determining a calibration position with a smaller number of error reports, and predicts the verification work time by evaluating the inspection property. Based on the CAD data of each layer of the printed wiring board to be inspected and the layer structure information, an intensity composition map viewed through the inspection surface is generated. A plurality of sets of the intensity components of the inspection surface are determined, and after determining at least one intensity evaluation region covering all the sets, the intensity evaluation region is imaged by an inspection unit and the statistical intensity value corresponding to each intensity component is determined and substituted into the intensity composition map. The inspection is conducted by determining the optimal calibration position for determining an inspection threshold value in this way.

摘要翻译： 公开了一种检查系统，其在通过较少数量的错误报告确定校准位置的同时检查高多层印刷线路板上的布线图案，并且通过评估检查性能来预测验证工作时间。 基于要检查的印刷线路板的各层的CAD数据和层结构信息，生成通过检查面观察的强度组成图。 确定检查表面的多组强度分量，并且在确定了覆盖所有集合的至少一个强度评估区域之后，通过检查单元对强度评估区域进行成像，并且对应于每个强度分量的统计强度值为 确定并代入强度组成图。 通过以这种方式确定用于确定检查阈值的最佳校准位置来进行检查。

公开(公告)号：US06989329B2

公开(公告)日：2006-01-24

申请号：US10959073

申请日：2004-10-07

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H01L21/44

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US20050079280A1

公开(公告)日：2005-04-14

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40 ,  C23C28/02 ,  C25D7/00 ,  H05K3/18 ,  C23C16/00

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06805915B2

公开(公告)日：2004-10-19

申请号：US10076536

申请日：2002-02-19

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： B05D118

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。