公开(公告)号：US5248852A

公开(公告)日：1993-09-28

申请号：US600803

申请日：1990-10-22

申请人： Koichi Kumagai

发明人： Koichi Kumagai

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28

CPC分类号： H01L24/96 ,  H01L24/24 ,  H05K1/185 ,  H05K3/284 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/09118 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/28

摘要： A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes. A method for manufacturing the resin circuit substrate includes the steps of: positioning the electronic parts on a base having a flat surface so that surfaces of the electrodes contact the flat surface of the base; molding the electronic parts so as to be integrated with the resin on the flat surface thereof to form a molded part; hardening, drying or aging the molded part integrated with the electronic parts; removing the base from the molded part; printing a conductive resin onto the molded part to form a circuit pattern in such a manner that the conductive resin is laminated on a surface, of the molded part, including the surfaces of the electrodes; and hardening or drying the conductive resin.

摘要翻译： 树脂电路基板包括：具有彼此电连接的电极的多个电子部件，电极的表面彼此齐平设置; 用于使电子部件的除电极表面之外的表面一体成形以使电子部件与树脂保持的树脂; 以及用于将电极彼此电连接的电路图案，电路图案层压在电极的暴露表面上。 制造树脂电路基板的方法包括以下步骤：将电子部件定位在具有平坦表面的基底上，使得电极的表面与基体的平坦表面接触; 将电子部件模制成与其平坦表面上的树脂一体化以形成模制部件; 硬化，干燥或老化与电子部件集成的模制零件; 从模制部件移除基部; 将导电树脂印刷到模制部件上以形成电路图案，使得导电树脂层压在包括电极表面的模制部件的表面上; 并硬化或干燥导电树脂。

公开(公告)号：US5043223A

公开(公告)日：1991-08-27

申请号：US513041

申请日：1990-04-23

申请人： Koichi Kumagai ,  Shinji Shimazaki

发明人： Koichi Kumagai ,  Shinji Shimazaki

IPC分类号： H05K3/46 ,  C03C3/07 ,  C03C14/00 ,  C04B35/111 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L23/49894 ,  C03C14/004 ,  C03C3/07 ,  C04B35/111 ,  H05K1/0306 ,  C03C2214/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/16 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/31815

摘要： A multilayer ceramic substrate comprises plural conductive layers and insulation layer for insulating the plural conductive layers, and the insulation layer is made of an inorganic composition comprising at least one member selected from the group of Al.sub.2 O.sub.3 and ZrO.sub.2, SiO.sub.2, PbO, and at least one member selected from the group of BaO, CaO and ZnO in predetermined range. The multilayer ceramic substrate can be sintered at low temperature in the air and is splendid in a heat resistance, a solderability and resistance value of the insulation layer and furthermore, a microcrack is not caused in a laser trimming of a top resistance film.

摘要翻译： 多层陶瓷基板包括多个导电层和用于绝缘多个导电层的绝缘层，并且绝缘层由包含选自Al 2 O 3和ZrO 2，SiO 2，PbO和至少一种的至少一种的无机组合物制成 选自BaO，CaO和ZnO组的成员在预定范围内。 多层陶瓷基板可以在空气中的低温下烧结，并且在绝缘层的耐热性，可焊性和电阻值方面是辉煌的，此外，在顶层电阻膜的激光修整中不会引起微裂纹。