公开(公告)号：US07414422B2

公开(公告)日：2008-08-19

申请号：US11108861

申请日：2005-04-19

申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

IPC分类号： G01R31/26

CPC分类号： G01R31/2822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

摘要翻译： 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置， 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板， 连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。

公开(公告)号：US20070273377A1

公开(公告)日：2007-11-29

申请号：US11418456

申请日：2006-05-05

申请人： Xiaoyu Yang ,  Hiroyuki Fujita ,  Tsinghua Zheng

发明人： Xiaoyu Yang ,  Hiroyuki Fujita ,  Tsinghua Zheng

IPC分类号： G01V3/00

CPC分类号： G01R33/3415 ,  G01R33/365

摘要： An MRI RF transmit system uses a plurality of RF transmit coils, each being driven with separately controllable RF magnitude and phase. The magnitude and phase of each coil drive are separately and independently controlled so that the RF transmit coils act as if they are decoupled from each other. The controlled magnitude and phase values may be based on empirically derived information relating to self and mutual coupling of RF transmit coils.

摘要翻译： MRI RF发射系统使用多个RF发射线圈，每个射频发射线圈分别由可控的RF幅度和相位驱动。 每个线圈驱动器的幅度和相位被单独和独立地控制，使得RF发射线圈的作用就好像它们彼此解耦一样。 受控幅度和相位值可以基于与RF发射线圈的自耦合和相互耦合有关的经验导出的信息。

公开(公告)号：US07221161B2

公开(公告)日：2007-05-22

申请号：US10761854

申请日：2004-01-21

申请人： Hiroyuki Fujita ,  Mark Xueming Zou ,  Dan K. Spence

发明人： Hiroyuki Fujita ,  Mark Xueming Zou ,  Dan K. Spence

IPC分类号： G01V3/00

CPC分类号： G01R33/3415

摘要： A system and method for configuring coils in a coil array are provided. The system includes a coil arrangement for a medical imaging system. The coil arrangement includes a plurality of coil elements for a medical imaging system and a plurality of twisted portions in combination with at least one of the plurality of coil elements.

摘要翻译： 提供一种用于配置线圈阵列中的线圈的系统和方法。 该系统包括用于医疗成像系统的线圈装置。 线圈装置包括用于医学成像系统的多个线圈元件和与多个线圈元件中的至少一个组合的多个扭转部分。

公开(公告)号：US07220147B2

公开(公告)日：2007-05-22

申请号：US10541237

申请日：2004-01-26

申请人： Hiroyuki Fujita ,  Hiroto Mochizuki

发明人： Hiroyuki Fujita ,  Hiroto Mochizuki

IPC分类号： H01R24/00

CPC分类号： H01R12/57

摘要： A microconnector in which elastic contact force is improved and a manufacturing method of a socket therefore, are provided.The microconnector includes: the socket 10 in which plural cantilever terminal blocks 14 having pressure receiving parts 16 are integrally formed on a board 11 made of single crystal silicon, and socket leads 15 are disposed on the terminal blocks 14; and a plug 20 in which plug leads 21 corresponding to the socket leads 15 are provided on a plug board 23. The manufacturing method of the socket 10 includes: a step of applying a resist to one surface of the board 11; a step of patterning the terminal blocks 14 by photolithography; a step of performing anisotropic etching to form the terminal blocks 14 to predetermined heights while a bottom is made to remain; a step of applying a resist to the other surface of the board 11; a step of patterning the pressure receiving parts 16 by photolithography; and a step of performing isotropic etching to remove the bottom.

摘要翻译： 提供了弹性接触力提高的微型连接器及其插座的制造方法。 微型连接器包括：插座10，其中具有受压部分16的多个悬臂端子块14一体地形成在由单晶硅制成的板11上，并且插座引线15设置在端子块14上; 并且在插头板23上设置有与插座引线15对应的插头引线21的插头20。插座10的制造方法包括：将抗蚀剂涂布在基板11的一个面上的工序; 通过光刻对端子块14进行构图的步骤; 在保持底部的同时进行各向异性蚀刻以形成端子块14至预定高度的步骤; 将抗蚀剂施加到板11的另一个表面的步骤; 通过光刻对压力接收部16进行图案化的步骤; 以及进行各向同性蚀刻以去除底部的步骤。

公开(公告)号：US07136578B2

公开(公告)日：2006-11-14

申请号：US10607166

申请日：2003-06-26

申请人： Norikazu Ito ,  Satoshi Yoneya ,  Masakazu Yoshimoto ,  Satoshi Katsuo ,  Jun Yoshikawa ,  Satoshi Yutani ,  Koichi Sato ,  Tomohisa Shiga ,  Hiroyuki Fujita ,  Masaki Hirose

发明人： Norikazu Ito ,  Satoshi Yoneya ,  Masakazu Yoshimoto ,  Satoshi Katsuo ,  Jun Yoshikawa ,  Satoshi Yutani ,  Koichi Sato ,  Tomohisa Shiga ,  Hiroyuki Fujita ,  Masaki Hirose

IPC分类号： H04N5/91

CPC分类号： G06F11/1076 ,  G06F2211/1016 ,  G06F2211/1057

摘要： A data recording and reproducing apparatus (11) which generates a plurality of divided data through dividing input data D1 using a distributor (22) if recording data, while generating redundancy-code data P1 and P2 using Read-Solomon-code data which can perform error-correcting on a plurality of divided data, and records the divided data and the redundancy-code data P1, P2 on HDDs 211 to 21K, 281 and 28Z. The data recording and reproducing apparatus (11) reproduces the divided data and the redundancy-code data from the HDDs 211 to 21K, 281 and 28Z, performs error-correcting processing on the divided data based on the redundancy-code data by an error corrector (31), and outputs the divided data which have been error-corrected after multiplying the divided data by a data multiplier (32) if reproducing data.

摘要翻译： 一种数据记录和再现装置，用于在产生冗余码数据P 1和P 2的同时，通过使用分配器（22）分割输入数据D＆lt; 1＆gt; 使用可以在多个分割数据上进行纠错的读取 - 所罗门码数据，并将划分的数据和冗余码数据P 1，P 2记录在HDD 21的21 < 28＆gt;和28＆lt; Z＆gt;。 数据记录和再现装置（11）从HDD 21的第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个，第二个 并且通过误差校正器（31）基于冗余码数据对划分的数据进行纠错处理，并且将乘法后的已经被纠错的分割数据输出 如果再现数据，则由数据乘法器（32）分割数据。

公开(公告)号：US20050236717A1

公开(公告)日：2005-10-27

申请号：US11108861

申请日：2005-04-19

申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

IPC分类号： G01R1/073 ,  G01R31/28 ,  H01L23/48

CPC分类号： G01R31/2822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

摘要翻译： 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置， 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板， 连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。

公开(公告)号：US06925862B2

公开(公告)日：2005-08-09

申请号：US10189802

申请日：2002-07-08

申请人： Hiroyuki Fujita ,  Katsuhiko Kawanaka

发明人： Hiroyuki Fujita ,  Katsuhiko Kawanaka

IPC分类号： F01N3/00 ,  F01N13/00 ,  F01N13/10 ,  F01N99/00 ,  F02D35/00 ,  G01M15/00

CPC分类号： F01N13/08 ,  F01N13/008 ,  F01N13/102 ,  F01N13/1805 ,  F01N13/1888 ,  F01N2260/18 ,  F01N2450/22 ,  F01N2450/24

摘要： An engine oxygen concentration sensor mounting structure in which an oxygen concentration sensor is mounted in a collector exhaust pipe connected to an outlet of an exhaust manifold having a plurality of exhaust single pipes. When a straight line is drawn from a detection part of the oxygen concentration sensor positioned within the collector exhaust pipe so as to be parallel to a section of a centerline of the exhaust pipe closest to the detection part, the straight line passes outside the outlet of the exhaust manifold. This allows the exhaust gases discharged from the exhaust manifold to be sufficiently mixed within the curved exhaust pipe and differences in length of the plurality of the exhaust single pipes to be compensated for. Thus, accurate detection by the oxygen concentration sensor can be secured, even if the lengths of a plurality of exhaust single pipes of the exhaust manifold are nonuniform.

摘要翻译： 一种发动机氧浓度传感器安装结构，其中氧浓度传感器安装在与具有多个排气单管的排气歧管的出口连接的收集器排气管中。 当从位于收集器排气管内的氧浓度传感器的检测部分平行于最靠近检测部分的排气管的中心线的一段的直线被拉出时，直线通过 排气歧管。 由此，能够使排气歧管排出的废气在弯曲的排气管内充分混合，并且能够补偿多个排气单管的长度差。 因此，即使排气歧管的多个排气单管的长度不均匀，也能够确保氧浓度传感器的精确检测。

公开(公告)号：US06850065B1

公开(公告)日：2005-02-01

申请号：US10205794

申请日：2002-07-26

申请人： Hiroyuki Fujita ,  Mark Xueming Zou

发明人： Hiroyuki Fujita ,  Mark Xueming Zou

IPC分类号： G01R33/341 ,  G01V3/00

CPC分类号： G01R33/3678

摘要： A RF receive coil system for imaging a breast on a human chest with a horizontal field MRI system includes a volume saddle coil adapted to be contoured about the chest; and a Helmholtz coil having a lower portion adapted to be contoured about the chest and an upper portion adapted to be above the chest The coils are operable in quadrature mode.

摘要翻译： 用于使用水平场MRI系统对人胸部的乳房进行成像的RF接收线圈系统包括适于围绕胸部轮廓的体积鞍座线圈; 以及亥姆霍兹线圈，其具有适于围绕胸部轮廓的下部和适于在胸部上方的上部。线圈可以正交模式操作。

公开(公告)号：US06831657B2

公开(公告)日：2004-12-14

申请号：US10225386

申请日：2002-08-21

申请人： Kazumasu Tsutsumi ,  Hajime Asahira ,  Tomoaki Makino ,  Hiroyuki Fujita

发明人： Kazumasu Tsutsumi ,  Hajime Asahira ,  Tomoaki Makino ,  Hiroyuki Fujita

IPC分类号： G09G502

CPC分类号： H04S1/007

摘要： Musical sound signal is input to an electronic volume control unit, which in turn adjusts the gain of the input musical signal and outputs the resultant gain-adjusted signal to an amplifier. CPU supplies the electronic volume control unit with a sound volume setting level corresponding to an output of a rotary encoder. At the same time, the CPU generates, with reference to stored data of a ROM table, a hue control signal for changing a displaying hue of a three-color light-emitting diode in accordance with the sound volume setting level supplied by the CPU. The CPU takes in a current sound volume setting level when an upper-limit setting switch is activated, and it retains the taken-in level as an upper limit value of various sound volume setting levels that are to be used to change the displaying hue of the light-emitting diode between purple and red hues. As the sound volume setting level is changed from zero to the upper limit value, the displaying hue changes in a stepwise manner.

摘要翻译： 音乐信号被输入到电子音量控制单元，电子音量控制单元进而调节输入音乐信号的增益，并将所得的增益调节信号输出到放大器。 CPU向电子音量控制单元提供与旋转编码器的输出相对应的音量设定水平。 同时，CPU根据存储的ROM表的数据，根据由CPU提供的音量设定电平，生成用于改变三色发光二极管的显示色调的色调控制信号。 当上限设置开关被激活时，CPU接收当前音量设置级别，并且将采用级别保持为用于改变显示色调的各种音量设置级别的上限值 紫色和红色之间的发光二极管。 当音量设定值从0变为上限值时，显示色调以逐步的方式变化。

公开(公告)号：US06576023B2

公开(公告)日：2003-06-10

申请号：US09791085

申请日：2001-02-22

申请人： Mitsutoshi Nakajima ,  Hiroyuki Fujita ,  Yuji Kikuchi ,  Isao Kobayashi

发明人： Mitsutoshi Nakajima ,  Hiroyuki Fujita ,  Yuji Kikuchi ,  Isao Kobayashi

IPC分类号： B01J1302

CPC分类号： B01F13/0059 ,  B01F3/0807 ,  B01F5/0475 ,  B01F5/0485 ,  B01J13/04

摘要： A method and an apparatus are provided for efficiently manufacturing microspheres having a uniform particle diameter. The apparatus comprises: case 1 having a lower body 1a and an upper body 1b. A seal ring 3, a first plate 4 which is comprised of a transparent plate such as a glass plate or a plastic plate, an annular spacer 5, an intermediate plate 6 which is comprised of a silicon substrate or the like, an annular spacer 7, a second plate 8 and a seal ring 9 are inserted in this order into a concave portion 2 formed in the lower body 1a. The upper body 1b is superposed thereon. Further, the upper body 1b is attached to the lower body 1a with bolts or the like.

摘要翻译： 提供了一种有效制造具有均匀粒径的微球的方法和装置。 该装置包括：具有下主体1a和上主体1b的壳体1。 密封环3，由透明板如玻璃板或塑料板构成的第一板4，环形间隔件5，由硅衬底等构成的中间板6，环形间隔件7 ，第二板8和密封环9依次插入形成在下体1a中的凹部2中。 上身1b叠置在其上。 此外，上身1b通过螺栓等附接到下身1a。