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229 条记录 (耗时 0.019 秒)

    Engine oxygen concentration sensor mounting structure
    1.
    发明授权
    Engine oxygen concentration sensor mounting structure 失效
    发动机氧浓度传感器安装结构

    公开(公告)号：US06925862B2

    公开(公告)日：2005-08-09

    申请号：US10189802

    申请日：2002-07-08

    申请人： Hiroyuki Fujita ,  Katsuhiko Kawanaka

    发明人： Hiroyuki Fujita ,  Katsuhiko Kawanaka

    IPC分类号： F01N3/00 ,  F01N13/00 ,  F01N13/10 ,  F01N99/00 ,  F02D35/00 ,  G01M15/00

    CPC分类号： F01N13/08 ,  F01N13/008 ,  F01N13/102 ,  F01N13/1805 ,  F01N13/1888 ,  F01N2260/18 ,  F01N2450/22 ,  F01N2450/24

    摘要： An engine oxygen concentration sensor mounting structure in which an oxygen concentration sensor is mounted in a collector exhaust pipe connected to an outlet of an exhaust manifold having a plurality of exhaust single pipes. When a straight line is drawn from a detection part of the oxygen concentration sensor positioned within the collector exhaust pipe so as to be parallel to a section of a centerline of the exhaust pipe closest to the detection part, the straight line passes outside the outlet of the exhaust manifold. This allows the exhaust gases discharged from the exhaust manifold to be sufficiently mixed within the curved exhaust pipe and differences in length of the plurality of the exhaust single pipes to be compensated for. Thus, accurate detection by the oxygen concentration sensor can be secured, even if the lengths of a plurality of exhaust single pipes of the exhaust manifold are nonuniform.

    摘要翻译： 一种发动机氧浓度传感器安装结构，其中氧浓度传感器安装在与具有多个排气单管的排气歧管的出口连接的收集器排气管中。 当从位于收集器排气管内的氧浓度传感器的检测部分平行于最靠近检测部分的排气管的中心线的一段的直线被拉出时，直线通过 排气歧管。 由此，能够使排气歧管排出的废气在弯曲的排气管内充分混合，并且能够补偿多个排气单管的长度差。 因此，即使排气歧管的多个排气单管的长度不均匀，也能够确保氧浓度传感器的精确检测。

    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards
    3.
    发明授权
    Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards 失效
    具有符合不兼容通信标准的无线通信功能的无线通信装置

    公开(公告)号：US08005504B2

    公开(公告)日：2011-08-23

    申请号：US11560170

    申请日：2006-11-15

    申请人： Eiichi Sano ,  Hiroyuki Fujita

    发明人： Eiichi Sano ,  Hiroyuki Fujita

    IPC分类号： H04M1/00

    CPC分类号： H04W52/42 ,  H04B7/0602 ,  H04B7/0805 ,  H04B7/0825 ,  H04M2250/02 ,  H04M2250/06

    摘要： A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.

    摘要翻译： 提供一种无线通信装置。 无线通信装置包括符合不兼容的第一和第二通信标准的无线通信功能。 无线通信装置包括执行符合第一通信标准的无线通信操作的第一收发器，并且包括第一发送/接收端口，执行符合第二通信标准的无线通信操作的第二收发器，并且包括第二发送/ 接收端口，由第一和第二收发器共享的共享天线，连接共享天线与第一和第二发送/接收端口的天线连接单元，以及控制单元，其控制第一和第二收发器中的通信操作 收发器

    ELECTROMAGNETIC RELAY
    9.
    发明申请
    ELECTROMAGNETIC RELAY 有权
    电磁继电器

    公开(公告)号：US20090096559A1

    公开(公告)日：2009-04-16

    申请号：US12297393

    申请日：2007-05-11

    申请人： Keisuke Yano ,  Masayuki Noda ,  Hiroshi Ono ,  Hiroyuki Fujita

    发明人： Keisuke Yano ,  Masayuki Noda ,  Hiroshi Ono ,  Hiroyuki Fujita

    IPC分类号： H01H50/54

    CPC分类号： H01H50/546 ,  H01H9/443 ,  H01H49/00 ,  H01H50/023 ,  H01H50/045 ,  H01H50/36 ,  H01H50/443 ,  H01H2050/025

    摘要： An electromagnetic relay has a solenoid formed from a wound coil, a movable iron core that is reciprocated upwardly and downwardly in an axial hole of the solenoid, and a movable contact point that reciprocates together with the movable iron core. The movable contact point is contacted and separated with and from a fixed contact point for opening and closing a contact point. An arc generated at a time of opening and closing of the contact point is flowed, in a predetermined direction, by the magnetic field of at least a single permanent magnet placed at a side of the fixed contact point and the movable contact point that are contacted and separated with and from each other. Coil terminals are connected to leader lines of the coil, at least at a single side of the flow of the arc.

    摘要翻译： 电磁继电器具有由绕线圈形成的螺线管，在螺线管的轴向孔中往复运动的可动铁芯和与可动铁芯往复运动的可动接点。 活动触点与固定触点接触和分离，用于打开和关闭触点。 在接触点的打开和关闭时产生的电弧在预定方向上通过放置在接触点的固定触点和可动触点的一侧的至少一个永磁体的磁场流动 并与彼此分离。 线圈端子连接到线圈的引线，至少在电弧流的单侧。

    System in-package test inspection apparatus and test inspection method
    10.
    发明授权
    System in-package test inspection apparatus and test inspection method 失效
    系统包装试验检验装置及试验检验方法

    公开(公告)号：US07414422B2

    公开(公告)日：2008-08-19

    申请号：US11108861

    申请日：2005-04-19

    申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

    发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hiroyuki Fujita ,  Kenichi Kobayashi

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

    摘要翻译： 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置， 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板， 连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。