公开(公告)号：US20050264880A1

公开(公告)日：2005-12-01

申请号：US11051641

申请日：2005-01-27

申请人： Jong Kim ,  Sang Han ,  Deok Kim

发明人： Jong Kim ,  Sang Han ,  Deok Kim

IPC分类号： G03B21/60 ,  G03B21/62

CPC分类号： G03B21/625

摘要： Disclosed is a lenticular sheet obtained by the method comprising the steps of: forming lenticular lens section on the input side of the sheet; forming an irregular section having a plurality of depressions and protrusions on the output side of the sheet; forming a light-absorbing layer on each protrusion; and filling each depression with a light-transmittable resin. The lenticular sheet provides a tolerance needed for fine pitch pattern processing and can be manufactured by using a conventional printing process as it is, thereby providing excellent contrast characteristics as well as excellent moldability.

摘要翻译： 公开了一种通过该方法获得的透镜片，包括以下步骤：在片材的输入侧上形成双凸透镜部分; 在片材的输出侧形成具有多个凹凸的不规则部分; 在每个突起上形成光吸收层; 并用可透光树脂填充每个凹陷。 透镜片提供细间距图案处理所需的公差，并且可以通过使用常规的印刷方法来制造，从而提供优异的对比特性以及优异的成型性。

公开(公告)号：US20050098802A1

公开(公告)日：2005-05-12

申请号：US11002100

申请日：2004-12-03

申请人： Deok Kim ,  John Reche

发明人： Deok Kim ,  John Reche

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L23/00 ,  H01L27/14 ,  H01L27/148 ,  H01L29/40 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.

摘要翻译： 提供了一种感光器件封装及其封装方法。 所述包装包括具有由对预定波长范围内的光基本上透明的材料形成的基板的组装部分; 感测部分，包括在预定波长范围内光电转换光的至少一个感光芯片; 以及连接感测和组装部分的多个第一焊接接头。 组装部分形成有至少第一金属层，其设置在基板的前表面区域上; 以及形成为在第一金属层上延伸的至少一个钝化层。 图案化钝化层以限定多个第一和第二存取开口，其分别在第一金属层上描述多个第一和第二焊料凸块焊盘，每个焊料凸块与第二焊料凸块焊盘中的至少一个互连。 感测部分的光敏裸片位于其感光区域与组件部分基板的前表面区域相对的位置，并且在其上形成有多个焊接凸块焊盘，电焊接电极与光敏区域耦合。 每个第一焊接接头在感测部分的焊料凸块焊盘之一和组件部分的第一焊料凸块之一之间延伸。

公开(公告)号：US20050070083A1

公开(公告)日：2005-03-31

申请号：US10672165

申请日：2003-09-26

申请人： Michael Johnson ,  Peter Elenius ,  Deok Kim

发明人： Michael Johnson ,  Peter Elenius ,  Deok Kim

IPC分类号： H01L20060101 ,  H01L21/44 ,  H01L21/60 ,  H01L21/66 ,  H01L23/31 ,  H01L23/485

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11334 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00

摘要： A wafer-level CSP (200) includes at least one die (202) from a wafer. The wafer-level CSP has a plurality of solder ball pads (206), a solder ball (308) at each solder ball pad and a polymer collar (310) around each solder ball. A moat (204) is formed in the surface of a polymer layer (412) disposed on the wafer during manufacturing of the wafer-level CSP. A temporarily liquified residual (502) from the polymer collar, which occurs while the wafer is heated to the reflow temperature of the solder ball, flows from the polymer collar. The moat acts as a barrier to material flow, limiting the distance that the residual spreads while liquified. The residual from the polymer collar remains within a region (314) defined by the moat. A full-depth moat (312) extends completely through the polymer layer. Alternatively, a partial-depth moat (712 and 912) extends partially through the polymer layer. The abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims pursuant to 37 C.F.R. §1.72(b).

摘要翻译： 晶片级CSP（200）包括来自晶片的至少一个管芯（202）。 晶片级CSP具有多个焊球垫（206），每个焊球垫处的焊球（308）和围绕每个焊球的聚合物环（310）。 在晶片级CSP的制造期间，在设置在晶片上的聚合物层（412）的表面中形成护城河（204）。 当晶片被加热到焊球的回流温度时，从聚合物套环的临时液化残余物（502）从聚合物套环流出。 护城河充当材料流动的障碍，限制了液化时残留物扩散的距离。 来自聚合物套环的残余物保留在由护城河限定的区域（314）内。 全深的护城河（312）完全延伸穿过聚合物层。 或者，部分深度护城河（712和912）部分地延伸穿过聚合物层。 提交摘要的理解是，根据37 C.F.R.不会将其用于解释或限制权利要求的范围或含义。 §1.72（b）。