公开(公告)号：US10751822B2

公开(公告)日：2020-08-25

申请号：US16141628

申请日：2018-09-25

申请人： OK International, Inc.

发明人： Hoa Dinh Nguyen

IPC分类号： B23K3/00 ,  B23K3/03 ,  B23K3/02

摘要： A smart soldering iron tip of a handheld soldering iron comprises a hollow cylindrical base; a pointed distal end; and a proximal end with an ID feedback device, which when read provides authentication information on the smart soldering iron tip.

公开(公告)号：US10088075B2

公开(公告)日：2018-10-02

申请号：US14831730

申请日：2015-08-20

申请人： DELAWARE CAPITAL FORMATION, INC.

发明人： Mario Velinov ,  Andrew Parker ,  Charles Lam ,  Lawrence Martin ,  Can T La

IPC分类号： F16K27/02 ,  F04B53/10 ,  F04B15/02 ,  F16K99/00 ,  F16K7/12 ,  B05C5/02

摘要： A valve for dispensing fluid as a bead or a dot having a housing with an internal cavity and a disposable insert positioned within the cavity of the housing having a fluid inlet, a fluid chamber, a fluid outlet and a diaphragm adjacent the fluid chamber between the fluid inlet and the fluid outlet. The replaceable insert further has a latching mechanism adjacent the diaphragm for receipt of a reciprocating actuator to actuate the diaphragm to dispense fluid from the fluid chamber.

公开(公告)号：US09511439B2

公开(公告)日：2016-12-06

申请号：US15096035

申请日：2016-04-11

申请人： OK INTERNATIONAL, INC.

发明人： Kenneth D. Marino ,  Hoa Nguyen

IPC分类号： B23K31/00 ,  B23K31/02 ,  B23K3/06 ,  B23K1/00 ,  B23K3/03 ,  B23K3/02 ,  B23K3/08

CPC分类号： H05K3/34 ,  B23K1/0016 ,  B23K3/02 ,  B23K3/025 ,  B23K3/03 ,  B23K3/033 ,  B23K3/0353 ,  B23K3/0471 ,  B23K3/0478 ,  B23K3/0615 ,  B23K3/08 ,  B23K31/125 ,  B23K2101/42 ,  G01B21/08 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/306 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2203/04 ,  H05K2203/163

摘要： An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

公开(公告)号：US10751823B2

公开(公告)日：2020-08-25

申请号：US16216676

申请日：2018-12-11

申请人： OK International, Inc.

发明人： Hoa Dinh Nguyen

IPC分类号： B23K3/00 ,  B23K3/03 ,  B23K3/02

摘要： A smart soldering iron tip of a handheld soldering iron comprises a hollow cylindrical base; a pointed distal end; and a proximal end with an ID feedback device including a conductive material coating, which when read provides authentication information on the smart soldering iron tip.

公开(公告)号：US09516762B2

公开(公告)日：2016-12-06

申请号：US14794678

申请日：2015-07-08

申请人： DELAWARE CAPITAL FORMATION, INC.

发明人： Kenneth D. Marino ,  Hoa Nguyen

IPC分类号： B23K1/00 ,  B23K3/00 ,  B23K3/02 ,  B23K31/00 ,  B23K31/02 ,  H05K3/34 ,  B23K3/08 ,  B23K3/03 ,  B23K31/12 ,  H05K3/22

CPC分类号： H05K13/08 ,  B23K1/0016 ,  B23K3/033 ,  B23K3/08 ,  B23K31/125 ,  G01K7/16 ,  G01N21/27 ,  H05K3/225 ,  H05K3/34 ,  H05K2203/163

摘要： A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.

摘要翻译： 一种用于焊接接头连接验证的烙铁站及其方法，所述方法包括：识别正在使用的所述焊接盒的类型; 在焊接事件开始之后，通过测量烙铁头温度来进行初步验证; 监测输送到烙铁头的功率水平以检测液相线发生; 确定焊接接头的金属间部件（IMC）的厚度; 在预定的冷却时间段内确定IMC的厚度是否在预定的范围内; 并且表示当IMC的厚度在预定的范围内时，在预定的冷却时间段内形成可靠的焊接连接。

公开(公告)号：US10645817B1

公开(公告)日：2020-05-05

申请号：US16773829

申请日：2020-01-27

申请人： OK International, Inc.

发明人： Hoa Nguyen

IPC分类号： B23K1/00 ,  B23K3/00 ,  H05K3/34 ,  B23K3/047 ,  B23K3/03 ,  B23K3/02 ,  B23K3/06 ,  B23K31/12 ,  B23K3/08 ,  H05K1/02 ,  H05K3/30 ,  B23K101/42 ,  G01B21/08

摘要： A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

公开(公告)号：US20160221098A1

公开(公告)日：2016-08-04

申请号：US15096035

申请日：2016-04-11

申请人： OK INTERNATIONAL, INC.

发明人： Kenneth D. Marino ,  Hoa Nguyen

IPC分类号： B23K3/06 ,  B23K3/03 ,  B23K3/02 ,  B23K1/00

CPC分类号： H05K3/34 ,  B23K1/0016 ,  B23K3/02 ,  B23K3/025 ,  B23K3/03 ,  B23K3/033 ,  B23K3/0353 ,  B23K3/0471 ,  B23K3/0478 ,  B23K3/0615 ,  B23K3/08 ,  B23K31/125 ,  B23K2101/42 ,  G01B21/08 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/306 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2203/04 ,  H05K2203/163

摘要： An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

摘要翻译： 一种智能型软管，包括：壳体; 焊头; 用于加热焊料尖端的加热器; 存储装置，用于存储关于盒的特性的信息; 用于检索关于盒的特性的信息的处理器，监测传送到焊料尖端的功率水平以检测焊点处的液相线发生，使用一些检索到的信息确定焊点的金属间化合物（IMC）的厚度 确定IMC的厚度是否在预定范围内，并且当IMC的厚度在预定范围内时，产生指示形成可靠的焊点连接的指示信号; 以及用于发送指示信号的接口。