公开(公告)号：US12271069B2

公开(公告)日：2025-04-08

申请号：US17933779

申请日：2022-09-20

Applicant: Raytheon Company

Inventor： Andrew M. Kowalevicz

IPC: G02F1/09 ,  G02B6/036 ,  G02B6/27 ,  G02B27/28 ,  H04B10/112 ,  H04B10/61

Abstract: An apparatus includes multiple dual cladding waveguides each having a single-mode interior section that transports one of multiple outgoing optical signals and a multimode section at least partially surrounding the interior section that transports one of multiple incoming optical signals. Different outgoing signals have different polarizations, and different incoming signals have different polarizations. The apparatus also includes a polarization beamsplitter that combines the multiple outgoing signals to produce transmit optical signals and separates receive optical signals to produce the multiple incoming signals.

公开(公告)号：US12270896B2

公开(公告)日：2025-04-08

申请号：US17341952

申请日：2021-06-08

Applicant: Raytheon Company

Inventor： Raymond Samaniego ,  Aaron C. Wallace

IPC: G01S13/90

Abstract: A multi-hypothesis spatially-variant autofocus system for processing and focusing radar images, such as synthetic aperture radar (SAR) imagery, is configured to compute phase corrections and apply multiple autofocus strategies to overlapping image tiles for progressively smaller image tile sizes. Correction factors for the image tiles may be selected on a per-tile basis based on various metrics. In some embodiments, one or more phase-gradient autofocus (PGA) algorithms may be applied to window-size weighted versions of the overlapping image tiles for the progressively smaller image tile sizes.

公开(公告)号：US20250112380A1

公开(公告)日：2025-04-03

申请号：US18477594

申请日：2023-09-29

Applicant: Raytheon Company

Inventor： Robert S. Isom ,  Randy L. Smith ,  Kelsey Joe Viani-Wittwer ,  Paul Raymond Winniford

IPC: H01Q21/00 ,  H01Q5/335

Abstract: A wideband antenna array includes a wide angle impedance matching (waim) board, a manifold board including multiple tower receiving features and at least one conductive tower extending outward from the manifold board and received in a corresponding tower receiving feature. Each of the at least one conductive towers including at least one metalized component. The metalized component forms a circuit connecting the manifold board to the waim board. The waim board is adhered to a first end of the at least one conductive tower opposite the manifold board.

公开(公告)号：US12266629B2

公开(公告)日：2025-04-01

申请号：US17169098

申请日：2021-02-05

Applicant: Raytheon Company

Inventor： Patrick E. Boyle ,  James E. Benedict ,  Erika Klek ,  Mikhail Pevzner

IPC: H01L23/00

Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.

公开(公告)号：US20250107006A1

公开(公告)日：2025-03-27

申请号：US18471385

申请日：2023-09-21

Applicant: Raytheon Company

Inventor： Angelo M. Puzella ,  Philip M. Henault ,  Alexander B. Brailovsky

IPC: H05K3/00 ,  H01Q9/04 ,  H05K1/02 ,  H05K3/24

Abstract: A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.

公开(公告)号：US20250102563A1

公开(公告)日：2025-03-27

申请号：US18371895

申请日：2023-09-22

Applicant: Raytheon Company

Inventor： Gregory L. Bass ,  Vincent A. Pinedo

IPC: G01R31/28

Abstract: An event detection system response controller for an electrical system includes at least one event detector (ED) digital filter submodule having a signal input and a signal output. The at least one ED digital filter submodule is configured to receive at least one event signal output from one or more event detectors at the signal input. Each of the at least one ED digital filter submodule includes a signal synchronizer, a signal filter, an interface validator, an interface validation filter, and a pulse shaper sequentially arranged from the signal input to the signal output.

公开(公告)号：US12261186B2

公开(公告)日：2025-03-25

申请号：US17212085

申请日：2021-03-25

Applicant: Raytheon Company

Inventor： David J. Gulbransen ,  Sean P. Kilcoyne ,  Eric Miller ,  Matthew D. Chambers ,  Eric J. Beuville ,  Andrew E. Gin ,  Adam M. Kennedy

IPC: H01L25/00 ,  H01L21/66 ,  H01L23/00 ,  H01L27/146

Abstract: A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.

公开(公告)号：US20250066263A1

公开(公告)日：2025-02-27

申请号：US18455568

申请日：2023-08-24

Applicant: Raytheon Company

Inventor： James E. Foreman

IPC: C04B41/45 ,  C04B35/76 ,  C04B41/00

Abstract: A refractory material can include a refractory filament and an interface coating applied to the refractory filament. The interface coating can include a refractory metal or semi-metal oxide, metal or semi-metal nitride, metal or semi-metal carbide, metal or semi-metal oxynitride, metal or semi-metal carbonitride, and/or metal or semi metal oxycarbide formed by depositing an organometallic precursor onto the refractory filament by supercritical fluid deposition and heat treating the organometallic precursor in the presence of an atmospheric condition so that the organometallic precursor forms an interface coating that is an oxidized, pyrolyzed, or carbidized form of the organometallic precursor and is present at a surface and beneath the surface of the refractory filament.

公开(公告)号：US12222438B1

公开(公告)日：2025-02-11

申请号：US18485029

申请日：2023-10-11

Applicant: Raytheon Company

Inventor： Derek P. Rocca ,  Michael T. Borkowski ,  Thomas Lulsdorf ,  Kenneth P. Walsh, Jr. ,  Christopher J. Yafrate ,  Michael P. Martinez ,  Erin K. Nolan ,  Kassam K. Bellahrossi ,  Bryan J. Cavener

IPC: G01S7/03 ,  H05K7/20 ,  G01S7/02

Abstract: A system and apparatus is provided for a modular radar system. The modular radar system can include a plurality of radar system modules that can be detachably coupled and can include a configurable number of radio-frequency (RF) transmit and receive assemblies. The RF transmit and receive assemblies can include radiating element(s) that emit electromagnetic radiation. The plurality of radar system modules can also include at least one processor coupled to control power of the electromagnetic radiation and/or at least one controller to control the RF transmit and receive assembly, the power unit and the digital receiver and exciter module, at least one digital receiver and exciter to convert RF to digital in receive mode, and digital to RF in transmit mode, and/or at least one RF beamformer to generate one or more RF beams.

公开(公告)号：US12221925B1

公开(公告)日：2025-02-11

申请号：US18635986

申请日：2024-04-15

Applicant: Raytheon Company

Inventor： Timothy O'Brien

IPC: F02C7/04 ,  B64D33/02 ,  F02C7/045 ,  F02C7/057 ,  F02C7/24 ,  F02K1/82 ,  F02K7/10 ,  F02K7/14 ,  F02K7/18

Abstract: A passive bypass for an inlet to a supersonic or hypersonic air-breathing engine allows airflow in the inlet to exit through the cowling when the inlet supplies more airflow than the air-breathing engine demands. The air-breathing engine may be the only form of propulsion or a secondary form of propulsion to reach higher speeds. The passive bypass includes a plurality of lower channels in the cowling that are operatively coupled to the inlet diffuser at an inner surface of the cowling and swept forward towards the throat, a plenum in the cowling operatively coupled to the plurality of lower openings and a plurality of upper channels in the cowling that are operatively coupled to the plenum and swept back away from the throat to an outer surface of the cowling. A serpentine path through the plurality of lower openings, the plenum and the plurality of upper openings allows airflow in the inlet to exit through the cowling when the inlet supplies more airflow than the air-breathing engine demands.