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11.发明授权Transmission line apparatus having conductive strips coupled by at least one additional capacitance element 有权具有通过至少一个附加电容元件耦合的导电条的传输线设备公开(公告)号：US07403080B2
公开(公告)日：2008-07-22
申请号：US11504722
申请日：2006-08-16
Applicant: Hiroshi Kanno , Kazuyuki Sakiyama , Ushio Sangawa , Tomoyasu Fujishima
Inventor： Hiroshi Kanno , Kazuyuki Sakiyama , Ushio Sangawa , Tomoyasu Fujishima
IPC: H01P3/08
CPC classification number: H01P1/201 , H01P1/203 , H05K1/0219 , H05K1/0237 , H05K2201/09236 , H05K2201/09781
Abstract: A transmission line apparatus includes: a substrate 101 with a ground conductor plane; and first and second signal strips 102a, 102b supported on the substrate 101 in parallel with each other. The apparatus further includes at least one additional capacitance element 301 that connects the first and second signal strips 102a, 102b together. The element 301 includes: a first additional conductor 303 spaced from the first signal strip 102a; a second additional conductor 305 spaced from the second signal strip 102b; and a third additional conductor 307 connected to the first and second additional conductors 303, 305 at respective points. When measured in a signal transmission direction, the smallest width W3a of the third additional conductor 307 is shorter than the length L1 or L2 of the first or second additional conductor 303 or 305. And the additional capacitance element 301 has a resonant frequency that is higher than the frequency of a signal being transmitted.
Abstract translation: 传输线装置包括：具有接地导体平面的基板101; 以及彼此平行地支撑在基板101上的第一和第二信号条102a，102b。 该装置还包括将第一和第二信号条带102a，102b连接在一起的至少一个附加电容元件301。 元件301包括：与第一信号条102a间隔开的第一附加导体303; 与第二信号条带102b间隔开的第二附加导体305; 以及在各个点处连接到第一和第二附加导体303,305的第三附加导体307。 当在信号传输方向上测量时，第三附加导体307的最小宽度W 3 a比第一或第二附加导体303或305的长度L 1或L 2短。 并且附加电容元件301具有高于正被发送的信号的频率的谐振频率。
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公开(公告)号：US20070056764A1
公开(公告)日：2007-03-15
申请号：US11504722
申请日：2006-08-16
Applicant: Hiroshi Kanno , Kazuyuki Sakiyama , Ushio Sangawa , Tomoyasu Fujishima
Inventor： Hiroshi Kanno , Kazuyuki Sakiyama , Ushio Sangawa , Tomoyasu Fujishima
IPC: H05K1/00
CPC classification number: H01P1/201 , H01P1/203 , H05K1/0219 , H05K1/0237 , H05K2201/09236 , H05K2201/09781
Abstract: A transmission line apparatus includes: a substrate 101 with a ground conductor plane; and first and second signal strips 102a, 102b supported on the substrate 101 in parallel with each other. The apparatus further includes at least one additional capacitance element 301 that connects the first and second signal strips 102a, 102b together. The element 301 includes: a first additional conductor 303 spaced from the first signal strip 102a; a second additional conductor 305 spaced from the second signal strip 102b; and a third additional conductor 307 connected to the first and second additional conductors 303, 305 at respective points. When measured in a signal transmission direction, the smallest width W3a of the third additional conductor 307 is shorter than the length L1 or L2 of the first or second additional conductor 303 or 305. And the additional capacitance element 301 has a resonant frequency that is higher than the frequency of a signal being transmitted.
Abstract translation: 传输线装置包括：具有接地导体平面的基板101; 以及彼此平行地支撑在基板101上的第一和第二信号条102a，102b。 该装置还包括将第一和第二信号条带102a，102b连接在一起的至少一个附加电容元件301。 元件301包括：与第一信号条102a间隔开的第一附加导体303; 与第二信号条带102b间隔开的第二附加导体305; 以及在各个点处连接到第一和第二附加导体303,305的第三附加导体307。 当在信号传输方向上测量时，第三附加导体307的最小宽度W 3 a比第一或第二附加导体303或305的长度L 1或L 2短。 并且附加电容元件301具有高于正被发送的信号的频率的谐振频率。
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公开(公告)号：US20030062972A1
公开(公告)日：2003-04-03
申请号：US10236416
申请日：2002-09-06
Applicant: TDK Corporation
Inventor： Arun Chandra Kundu
IPC: H01P001/20
CPC classification number: H01P1/201
Abstract: A highly compact band pass filter that has excellent mechanical strength is disclosed. A band pass filter according to the present invention employs a dielectric block of substantially rectangular prismatic shape constituted of a first portion lying between a first cross-section of the dielectric block and a second cross-section of the dielectric block substantially parallel to the first cross-section and second and third portions divided by the first portion and metal plates formed on surfaces of the dielectric block. The first portion of the dielectric block and the metal plates formed thereon are enabled to act as an evanescent waveguide. The second portion of the dielectric block and the metal plates formed thereon are enabled to act as a first resonator. The third portion of the dielectric block and the metal plates formed thereon are enabled to act as a second resonator. The metal plates include at least one exciting electrode formed on a first surface of the dielectric block which has the widest area. Thus a wide band characteristics can be obtained whereas the very thin dielectric block is used. Further, a high unloaded quality factor (Q0) can be obtained because the radiation loss is lowered when the thickness of the dielectric block is reduced.
Abstract translation: 公开了一种具有优异机械强度的高度紧凑的带通滤波器。 根据本发明的带通滤波器采用基本上为矩形棱柱形状的介电块，该绝缘块由位于介质块的第一截面之间的第一部分和基本上平行于第一十字的介质块的第二横截面构成 并且由形成在介质块的表面上的第一部分和金属板划分的第二和第三部分。 介质块和形成在其上的金属板的第一部分能够用作ev逝波导。 介质块的第二部分和其上形成的金属板能够用作第一谐振器。 介质块和形成在其上的金属板的第三部分能够用作第二谐振器。 金属板包括形成在介质块的具有最宽面积的第一表面上的至少一个激励电极。 因此，可以获得宽带特性，而使用非常薄的介电块。 此外，由于当介质块的厚度减小时辐射损耗降低，因此可以获得高的卸载品质因数（Q0）。
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公开(公告)号：US20030025577A1
公开(公告)日：2003-02-06
申请号：US10210569
申请日：2002-07-31
Applicant: TDK Corporation
Inventor： Arun Chandra Kundu
IPC: H01P001/20
CPC classification number: H01P1/201
Abstract: A highly compact bandpass filter that has excellent mechanical strength is disclosed. A bandpass filter according to the present invention employs a dielectric block of substantially rectangular prismatic shape constituted of a first portion lying between a first cross-section of the dielectric block and a second cross-section of the dielectric block substantially parallel to the first cross-section and second and third portions divided by the first portion and metal plates formed on surfaces of the dielectric block. The first portion of the dielectric block and the metal plates formed thereon are enabled to act as an evanescent waveguide. The second portion of the dielectric block and the metal plates formed thereon are enabled to act as a first resonator. The third portion of the dielectric block and the metal plates formed thereon are enabled to act as a second resonator. The metal plates include an inductive stub formed on the surface of the first portion of the dielectric block.
Abstract translation: 公开了一种具有优异机械强度的高度紧凑的带通滤波器。 根据本发明的带通滤波器采用基本上为矩形棱柱形状的介电块，该绝缘块由位于介质块的第一横截面之间的第一部分和基本上平行于第一截面的介质块的第二横截面构成， 第二部分和第三部分由形成在介质块表面上的第一部分和金属板分隔开。 介质块和形成在其上的金属板的第一部分能够用作ev逝波导。 介质块的第二部分和其上形成的金属板能够用作第一谐振器。 介质块和形成在其上的金属板的第三部分能够用作第二谐振器。 金属板包括形成在介质块的第一部分的表面上的电感短截线。
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公开(公告)号：US20020158718A1
公开(公告)日：2002-10-31
申请号：US10005724
申请日：2001-11-02
Inventor： Arun Chandra Kundu
IPC: H01P001/20
CPC classification number: H01P1/2084 , H01P1/201
Abstract: A highly compact and easily fabricated band pass filter is disclosed. A band pass filter according to the present invention employs a first half-wave (null/2) resonator having a first open end on which an input terminal is formed and a second open end opposite to the first open end, a second half-wave (null/2) resonator having a third open end on which an output terminal is formed and a fourth open end opposite to the third open end, and an evanescent waveguide interposed between the second open end of the first resonator and the fourth open end of the second resonator. The first half-wave (null/2) resonator, the second half-wave (null/2) resonator, and the evanescent waveguide being single-unit. An air gap does not have to be formed by mounting components on a printed circuit board. Therefore, the overall size of the band pass filter can be miniaturized and fabrication of the band pass filter is simplified.
Abstract translation: 公开了一种非常紧凑且容易制造的带通滤波器。 根据本发明的带通滤波器采用第一半波（匝/ 2）谐振器，其具有形成有输入端的第一开路端和与第一开路端相对的第二开路端，第二半波 （lambd / 2）谐振器，其具有形成有输出端子的第三开口端和与第三开口端相对的第四开口端，以及插入在第一谐振器的第二开路端和第一开口端之间的ev逝波导管， 第二谐振器。 第一个半波（lambd / 2）谐振器，第二个半波（lambd / 2）谐振器，ev逝波导是单个单元。 不必通过将组件安装在印刷电路板上而形成气隙。 因此，带通滤波器的总体尺寸可以小型化，并且带通滤波器的制造被简化。
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Patent Agency Ranking
公开(公告)号：US3644850A
公开(公告)日：1972-02-22
申请号：US3644850D
申请日：1969-06-11
Applicant: IBM
Inventor： HO IRVING T
IPC: H03H7/06 , H01L21/822 , H01L27/04 , H01P1/201 , H01P3/08
CPC classification number: H01P1/201
Abstract: A semiconductor band pass filter is disclosed. The filter is an integrated circuit device having a semiconductor layer with a ground plane on one face and an insulating layer and an overlying conductive line on the other face. The semiconductor layer includes near the insulating layer a highly doped region which may have substantially the same pattern as the conductive line. The passed band can be selected by varying the doping level of the doped region.
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公开(公告)号：US3411114A
公开(公告)日：1968-11-12
申请号：US45204965
申请日：1965-04-30
Applicant: ALLEN BRADLEY CO
Inventor： SCHMID PIERRE E , SCHLICKE HEINZ M , DUDLEY HORACE S , NEUENS RICHARD F
CPC classification number: H01P1/201 , H01P1/2133
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公开(公告)号：US3096493A
公开(公告)日：1963-07-02
申请号：US4383260
申请日：1960-07-19
Applicant: GEN ELECTRIC CO LTD
Inventor： MAURICE GARDINER
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公开(公告)号：US09968004B2
公开(公告)日：2018-05-08
申请号：US15271635
申请日：2016-09-21
Applicant: LAIRD TECHNOLOGIES, INC.
Inventor： Mohammadali Khorrami , Paul Francis Dixon
CPC classification number: H05K7/2039 , H01L23/34 , H01L23/3737 , H01P1/201 , H01P3/12 , H05K1/0203 , H05K1/0216 , H05K9/0032 , H05K9/0081 , H05K2201/10371
Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.
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公开(公告)号：US09761921B2
公开(公告)日：2017-09-12
申请号：US14962855
申请日：2015-12-08
Applicant: HUAWEI TECHNOLOGIES CANADA CO., LTD.
Inventor： Raafat R. Mansour , Kevin Yang , Vahid Miraftab
Abstract: The tunable bandpass filter is used for filtering an electromagnetic signal, has a system passband between a first and a second tunable cutoff frequencies, and has a first subfilter and a second subfilter connected to one another in series between an input port and an output port and being complementary to one another in the tunable bandpass filter. At least one of the first subfilter and the second subfilter being connected to operate in reflection.
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