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公开(公告)号:US11859806B2
公开(公告)日:2024-01-02
申请号:US17971371
申请日:2022-10-21
申请人: Crosman Corporation
CPC分类号: F21V29/70 , F21V23/006 , F41G1/35 , F41H13/0087 , F21V29/507 , F21V29/76 , F21V33/0076
摘要: Deterrent device attachments are provided each having a light emitting thermal source positioned by a support board to emit light from within a housing of the deterrent device, with the support board bent to provide surface areas to dissipate heat generated by the light emitter.
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公开(公告)号:US20230408068A1
公开(公告)日:2023-12-21
申请号:US18144869
申请日:2023-05-09
发明人: Hongge WU
CPC分类号: F21V15/01 , F21V29/76 , F21V3/0625 , F21V23/005 , F21V19/0035 , F21V17/12
摘要: A light source module provided includes a heat sink, a circuit board, a lamp shade, and a fixing member. The circuit board is provided with one side tightly attached to the heat sink, and the other side is provided with a plurality of light sources. The lamp shade is provided with a plurality of optical lenses, the plurality of the optical lenses are respectively formed by a plurality of recesses forming on a front surface of the lamp shade, and a plurality of arc protrusions corresponding to the plurality of the recess forming on a back surface of the lamp shade. The fixing member is configured to fix the lamp shade on the heat sink to receive the circuit board in a space defined by the lamp shade and heat sink. Further, a lighting apparatus is also provided.
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公开(公告)号:US20230392779A1
公开(公告)日:2023-12-07
申请号:US18268429
申请日:2021-05-26
发明人: Kyoichi MURAYAMA , Keita UMENO
CPC分类号: F21V29/83 , F21V29/76 , F21V29/713 , F21V29/60 , F21Y2115/10
摘要: A heatsink includes: a base plate thermally connected to a heat-generating unit; a plurality of heat radiation fins erected on a surface of the base plate, and arranged with gaps in a first direction along the surface; and a partition member provided to intersect the plurality of heat radiation fins, and partitioning the plurality of heat radiation fins in a second direction along the surface and intersecting the first direction. The partition member partitions the plurality of heat radiation fins such that more air passes through in the second direction between the plurality of heat radiation fins on a base plate side than on a side opposite to the base plate side.
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公开(公告)号:US11813119B2
公开(公告)日:2023-11-14
申请号:US17950425
申请日:2022-09-22
申请人: Clifton Learn
发明人: Clifton Learn
IPC分类号: F21V33/00 , A61B90/30 , F21L4/04 , F21V29/76 , F21V14/06 , F21V29/67 , F21V29/77 , A61B90/50 , A41D1/00 , A41D13/002 , A41D20/00 , F21L4/00 , F21V15/01 , F21V17/16 , F21V23/04 , H01M10/48 , F21V29/89 , F21Y115/10
CPC分类号: A61B90/30 , A41D1/002 , A41D13/0025 , A41D20/005 , A61B90/50 , F21L4/00 , F21L4/04 , F21V14/065 , F21V15/01 , F21V17/164 , F21V23/0414 , F21V29/673 , F21V29/767 , F21V29/773 , H01M10/482 , H01M10/488 , A61B2090/502 , F21V29/89 , F21Y2115/10 , H01M2220/30
摘要: A lighting apparatus for use as a surgical headlamp is disclosed. A light emitting diode is positioned in a recess within a frustoconical, thermally-conductive heat sink that has a several circumferential ridges to provide a desired surface area for heat transfer. The diode and the heat sink are provided in a housing that also includes a fan for drawing ambient air into the housing to contact the heat sink and exhausting heated air. A lens is snap-fit into a slide that frictionally engages the interior of the housing, allowing a user to adjust the spacing between the light emitting diode and the lens as desired. Personal cooling apparatuses usable with the lighting apparatus are also described. Auxiliary undergown switches are also described as are personal cooling apparatuses.
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公开(公告)号:US11754265B2
公开(公告)日:2023-09-12
申请号:US17902345
申请日:2022-09-02
IPC分类号: F21V21/088 , F21S6/00 , F21S9/02 , F21V29/76 , F21L4/00 , F21S8/00 , F21V3/00 , F21V17/02 , F21V23/04 , F21V21/28 , F21V21/30 , F21W111/10 , F21W131/402 , F21Y115/10 , F21W131/10
CPC分类号: F21V21/0885 , F21L4/00 , F21S6/004 , F21S8/003 , F21S9/02 , F21V3/00 , F21V17/02 , F21V23/0414 , F21V29/76 , F21V21/28 , F21V21/30 , F21W2111/10 , F21W2131/10 , F21W2131/402 , F21Y2115/10
摘要: A light includes a housing with a top face, a bottom face, a first side face, a second side face, and a surface arranged adjacent to the bottom face. The light also includes a head pivotally coupled to the housing, with a diffuser and a plurality of LEDs configured to emit light through the diffuser. The light also includes a power source configured to provide power to the plurality of LEDs. The top face, the bottom face, the first side face, the second side face, and the surface are each configured to support the light, and the surface is oriented at an oblique angle with respect to the bottom face.
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公开(公告)号:US11754260B2
公开(公告)日:2023-09-12
申请号:US17304673
申请日:2021-06-24
申请人: Musco Corporation
发明人: Myron Gordin , Nathan E. Herz , Kenneth G. Lewis, Jr. , Chris P. Lickiss , Luke C. McKee , Philip D. Hol , Joel D. Deboef
CPC分类号: F21V14/04 , F21S8/08 , F21V3/02 , F21V5/002 , F21V5/04 , F21V29/763 , F21Y2115/10
摘要: Lighting applications which are particularly difficult to light because of “non-standard” target areas (or otherwise) would benefit from advancements in lighting design. That being said, conventional wisdom in lighting design has practical limitations—conventional means of visors at/on lighting fixtures (i.e., local visoring) can only become so long to provide beam cutoff before becoming prohibitively heavy or costly, for example. Local visoring can only be pivoted so far before beam shift occurs (e.g., shifting the physical location of maximum candela or photometric center), as another example. Conventional wisdom can only buy so much cutoff and beam control before the overall lighting design is impacted—and so an alternative approach is warranted. One such alternative approach which relies upon a combination of remote visoring and local visoring is discussed; additional approaches are also discussed.
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公开(公告)号:US11747008B2
公开(公告)日:2023-09-05
申请号:US17197721
申请日:2021-03-10
申请人: BOLB INC.
发明人: Jianping Zhang , Ling Zhou , Ying Gao , Huazhong Deng , Alex Lunev , Cuong Le
IPC分类号: F21V29/60 , F21V7/04 , F21V29/51 , F21V29/76 , H01L33/48 , H01L33/62 , H01L33/58 , H01L25/075 , F21Y105/10 , F21Y115/10
CPC分类号: F21V29/60 , F21V7/041 , F21V29/51 , F21V29/767 , H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , F21Y2105/10 , F21Y2115/10
摘要: A DUV light source module includes a print circuit board, an array of DUV light-emitting diodes (LEDs), a plurality of DUV LED drivers for driving the DUV light-emitting diodes, and a pair of electrical connectors for connecting the DUV LED drivers hence the DUV light-emitting diodes to a power source, and A DUV light source device includes the DUV light source module, a reflector, a heat sink, a heat pipe, a radiator and a fan.
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公开(公告)号:US11732878B2
公开(公告)日:2023-08-22
申请号:US17526701
申请日:2021-11-15
申请人: JLC-Tech LLC
发明人: Silvio Porciatti
IPC分类号: F21S8/00 , F21V29/76 , E04B9/00 , E04B9/06 , F21V33/00 , F24F3/056 , F21S4/28 , F21V23/02 , F21S8/02 , F21V29/503 , F21V29/74 , F21S8/04 , F21Y105/10 , F21Y115/10 , F21S2/00
CPC分类号: F21V29/767 , E04B9/006 , E04B9/067 , F21S4/28 , F21V23/023 , F21V23/026 , F21V29/763 , F21V33/006 , F24F3/056 , E04B9/064 , F21S2/005 , F21S8/02 , F21S8/026 , F21S8/04 , F21S8/043 , F21V29/503 , F21V29/74 , F21V33/0088 , F21Y2105/10 , F21Y2115/10
摘要: The T-bar includes an elongate rigid spine extending between terminal ends including either a fixed anchor or adjustable anchor for attachment to adjacent T-bars or other supports. An upper heat sink is provided on an upper portion of the spine to enhance heat transfer from the T-bar to air surrounding upper portions of the T-bar. A light housing is provided on a lower portion of the T-bar which is configured to support a lighting module therein, such as a light emitting diode (LED) light. A lower heat sink is provided above this light housing and integrated into a rest shelf which supports ceiling tiles adjacent the T-bar. A power supply is provided which can be removably attached to the T-bar and provide appropriately conditioned power for the lighting module.
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公开(公告)号:US11674679B2
公开(公告)日:2023-06-13
申请号:US17553994
申请日:2021-12-17
申请人: LEDVANCE LLC
发明人: Anil Jeswani , Renaud Richard , Ahmed Eissa , Valeriy Zolotykh
IPC分类号: F21V23/06 , F21V23/00 , F21V23/04 , F21Y115/10 , F21S8/02 , F21V29/76 , F21Y105/18
CPC分类号: F21V23/06 , F21S8/026 , F21V23/003 , F21V23/0435 , F21V29/76 , F21Y2105/18 , F21Y2115/10
摘要: A lighting test method that includes connecting a housing including driver electronics and a junction box to a main power source. The main power source is connected to a main power connector in the junction box. The driver electronics includes a first terminal. The method further includes connecting a power testing module to the first terminal to the driver electronics to determine whether the main power source is correctly connected to the main power connector in the junction box. The method further includes replacing the power testing module with a second terminal of a light engine housing. Connecting the first and second terminals provides that the driver electronics are in electrical communication with a light engine within the light engine housing.
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公开(公告)号:US11662087B2
公开(公告)日:2023-05-30
申请号:US17809560
申请日:2022-06-29
发明人: Zhaowei Chai , Xinghua Zhang , Xiaoping Fu , Yong Hu
IPC分类号: F21V29/508 , F21V29/76 , F21V23/02 , F21W131/406
CPC分类号: F21V29/508 , F21V23/023 , F21V29/76 , F21W2131/406
摘要: The present disclosure provides a power supply device and a high-power illumination system. The power supply device includes: a housing, where the housing includes a first bottom plate having a first surface on which a first heat sink is provided and a second surface on which a thermal conductive potting layer is provided; and a printed circuit board, where the printed circuit board is located in the housing, the printed circuit board includes a circuit board body and multiple electronic components arranged on the circuit board body, at least part of the multiple electronic components is arranged facing the second surface of the first bottom plate, and the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component.
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