公开(公告)号：US11237090B2

公开(公告)日：2022-02-01

申请号：US16807698

申请日：2020-03-03

Applicant: Infineon Technologies AG

Inventor： Michael Schneider ,  Alfons Dehe ,  Manuel Dorfmeister ,  Christoph Glacer ,  Ulrich Krumbein ,  Ulrich Schmid ,  David Tumpold

IPC: G01N15/06

Abstract: A sensor element includes a membrane structure suspended on a frame structure, wherein the membrane structure includes a membrane element and an actuator. The membrane structure is deflectable in a first stable deflection state and in a second stable deflection state and is operable in a resonance mode in at least one of the first and the second stable deflection states. The actuator is configured to deflect the membrane structure in a first actuation state into one of the first and the second stable deflection states, and to operate the membrane structure in a second actuation state in a resonance mode having an associated resonance frequency.

公开(公告)号：US11211298B2

公开(公告)日：2021-12-28

申请号：US16654165

申请日：2019-10-16

Applicant: Infineon Technologies AG

Inventor： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC: H01L23/053 ,  H01L21/20 ,  H01L21/18 ,  H01L21/762 ,  H01L23/31 ,  H01L23/057 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00 ,  H01L21/306 ,  H01L21/02 ,  H01L21/302 ,  H01L33/00 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18

Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US20210323813A1

公开(公告)日：2021-10-21

申请号：US17357146

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Gunar Lorenz ,  Alfons Dehe ,  Marc Fueldner ,  Bernd Goller ,  Ulrich Krumbein ,  Andreas Wiesbauer

IPC: B81B7/00 ,  B81B3/00 ,  B81B7/02 ,  H04R19/04 ,  H04R1/02 ,  G01L9/00

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

公开(公告)号：US11115755B2

公开(公告)日：2021-09-07

申请号：US16779203

申请日：2020-01-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H04R7/00

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

公开(公告)号：US10926999B2

公开(公告)日：2021-02-23

申请号：US16540625

申请日：2019-08-14

Applicant: Infineon Technologies AG

Inventor： Christian Bretthauer ,  Alfons Dehe ,  Alfred Sigi

IPC: H01L41/18 ,  B81B3/00 ,  H04R19/00 ,  H04R17/02 ,  H04R19/02 ,  H04R19/04 ,  B81B7/02 ,  B81C1/00 ,  H01L41/113 ,  B81B7/00 ,  H01L41/09 ,  H04R7/06 ,  H04R31/00 ,  H04R7/04

Abstract: In accordance with an embodiment, a microelectromechanical transducer includes a displaceable membrane having an undulated section comprising at least one undulation trough and at least one undulation peak and a plurality of piezoelectric unit cells. At least one piezoelectric unit cell is provided in each case in at least one undulation trough and at least one undulation peak, where each piezoelectric unit cell has a piezoelectric layer and at least one electrode in electrical contact with the piezoelectric layer. The membrane may be formed as a planar component having a substantially larger extent in a first and a second spatial direction, which are orthogonal to one another, than in a third spatial direction, which is orthogonal to the first and the second spatial direction and defines an axial direction of the membrane.

公开(公告)号：US10737935B2

公开(公告)日：2020-08-11

申请号：US16050795

申请日：2018-07-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Marc Fueldner ,  Andreas Wiesbauer

IPC: B81B7/02 ,  B81B3/00 ,  H04R3/06 ,  H04R19/00 ,  H04R19/04 ,  G01L9/00 ,  G01L19/06 ,  G01L19/02 ,  G01L9/12

Abstract: In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.

公开(公告)号：US20200236485A1

公开(公告)日：2020-07-23

申请号：US16787577

申请日：2020-02-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen

IPC: H04R31/00 ,  B81B3/00 ,  H04R19/00 ,  H04R1/08 ,  B81C1/00

Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

公开(公告)号：US20200216309A1

公开(公告)日：2020-07-09

申请号：US16821145

申请日：2020-03-17

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Stefan Barzen ,  Alfons Dehe ,  Gunar Lorenz

IPC: B81C1/00 ,  H04R19/00 ,  B81B3/00

Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.

公开(公告)号：US10684163B2

公开(公告)日：2020-06-16

申请号：US15679162

申请日：2017-08-17

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Manuel Dorfmeister ,  Ulrich Schmid ,  Michael Schneider

IPC: G01H11/08 ,  H04R17/02 ,  H04R31/00 ,  H01L41/083

Abstract: An acoustic wave sensor may include: a continuous membrane deflectable by acoustic waves to be detected, and a piezoelectric layer provided on the membrane and including a plurality of piezoelectric layer portions respectively equipped with at least two individual electric contact structures configured to electrically connect the respective piezoelectric layer portions. Electric contact structures associated with different piezoelectric layer portions may be separated from each other.

公开(公告)号：US10567886B2

公开(公告)日：2020-02-18

申请号：US15839546

申请日：2017-12-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.