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    WAVEGUIDE CROSSINGS WITH A MULTIPLE-LEVEL NON-CONTACTING ARRANGEMENT
    213.
    发明公开
    WAVEGUIDE CROSSINGS WITH A MULTIPLE-LEVEL NON-CONTACTING ARRANGEMENT 审中-公开

    公开(公告)号：US20240027685A1

    公开(公告)日：2024-01-25

    申请号：US17869858

    申请日：2022-07-21

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/125 ,  G02B6/136

    CPC classification number: G02B6/125 ,  G02B6/136 ,  G02B2006/12119

    Abstract: Structures for a waveguide crossing and methods of fabricating a structure for a waveguide crossing. The structure comprises a first waveguide core and a second waveguide core each including a first section, a second section, and a first waveguide bend connecting the first section to the second section. The second section terminates the first waveguide core. The second section terminates the second waveguide core. The second waveguide bend has a side surface that is spaced from a side surface of the first waveguide bend by a gap. A third waveguide core is terminated by a section having an overlapping arrangement with the second section of the first waveguide core. A fourth waveguide core is terminated by a section having an overlapping arrangement with the second section of the second waveguide core.

    PHOTONICS CHIPS WITH RETICLE STITCHING BY BACK-TO-BACK TAPERED SECTIONS
    214.
    发明公开
    PHOTONICS CHIPS WITH RETICLE STITCHING BY BACK-TO-BACK TAPERED SECTIONS 审中-公开

    公开(公告)号：US20230417990A1

    公开(公告)日：2023-12-28

    申请号：US17847399

    申请日：2022-06-23

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Kevin Dezfulian ,  Yusheng Bian

    IPC: G02B6/122 ,  G02B6/42

    CPC classification number: G02B6/1228 ,  G02B6/4296 ,  G02B2006/12097

    Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a second chip region, a first waveguide core in the first chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned across the boundary from the first tapered section. The first tapered section has a first width dimension that increases with increasing distance from the boundary, and the second tapered section has a second width dimension that increases with increasing distance from the boundary.

    PIC die with optical deflector for ambient light
    216.
    发明授权
    PIC die with optical deflector for ambient light 有权

    公开(公告)号：US11837547B2

    公开(公告)日：2023-12-05

    申请号：US17450324

    申请日：2021-10-08

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Roderick Alan Augur ,  Yusheng Bian ,  Robert John Fox, III

    IPC: H01L23/532 ,  H01L23/552 ,  H01L23/522

    CPC classification number: H01L23/53295 ,  H01L23/5226 ,  H01L23/552

    Abstract: A photonic integrated circuit (PIC) die includes a silicon nitride optical component over an active region. Multiple interconnect layers are over the silicon nitride optical component, each of the multiple interconnect layers including a metal interconnect therein. At least one optical deflector is over the multiple interconnect layers and over the silicon nitride optical component. The optical deflector(s) may also include a contact passing therethrough to the interconnect layers, but do not include any other electrical interconnects. Each optical deflector may deflect light within an ambient light range of less than 570 nanometers (nm) to protect the silicon nitride optical component from light-induced degradation.

    BACK-END-OF-LINE EDGE COUPLERS WITH A TAPERED GRATING
    218.
    发明公开
    BACK-END-OF-LINE EDGE COUPLERS WITH A TAPERED GRATING 审中-公开

    公开(公告)号：US20230367067A1

    公开(公告)日：2023-11-16

    申请号：US17741684

    申请日：2022-05-11

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian ,  Rod Augur

    IPC: G02B6/124 ,  G02B6/13 ,  G02B6/122

    CPC classification number: G02B6/124 ,  G02B6/1228 ,  G02B6/13 ,  G02B2006/12107

    Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure comprises a substrate and a back-end-of-line edge coupler including a waveguide core and a grating positioned in a vertical direction between the substrate and the waveguide core. The first waveguide core includes a first longitudinal axis, the grating includes a second longitudinal axis and a plurality of segments positioned with a spaced-apart arrangement along the second longitudinal axis, and the second longitudinal axis is aligned substantially parallel to the first longitudinal axis.

    Waveguides and edge couplers with multiple-thickness waveguide cores
    219.
    发明授权
    Waveguides and edge couplers with multiple-thickness waveguide cores 有权

    公开(公告)号：US11808996B1

    公开(公告)日：2023-11-07

    申请号：US17729244

    申请日：2022-04-26

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/42

    CPC classification number: G02B6/4206 ,  G02B6/42

    Abstract: Photonics structures for a waveguide or an edge coupler and methods of fabricating a photonics structure for a waveguide or an edge coupler. The photonics structure includes a waveguide core having a first section, a second section longitudinally adjacent to the first section, first segments projecting in a vertical direction from the first section, and second segments projecting in the vertical direction from the second section. The first section of the waveguide core has a first thickness, and the second section of the waveguide core has a second thickness that is greater than the first thickness.

    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH COUPLER FOR INTERLAYER WAVEGUIDE COUPLING
    220.
    发明公开
    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH COUPLER FOR INTERLAYER WAVEGUIDE COUPLING 审中-公开

    公开(公告)号：US20230314706A1

    公开(公告)日：2023-10-05

    申请号：US17709841

    申请日：2022-03-31

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/12 ,  G02B6/125

    CPC classification number: G02B6/12016 ,  G02B6/125 ,  G02B2006/12147

    Abstract: Disclosed is a structure including a first waveguide core with a first end portion and a second waveguide core with a second end portion, which overlays and is physically separated from the first end portion. The structure includes a coupler configured for interlayer waveguide coupling. Specifically, the coupler includes an additional waveguide core stacked vertically between and physically separated from the first end portion and the second end portion. Optionally, the coupler includes multiple additional waveguide cores. The shapes of the various waveguide cores are configured in order to achieve mode matching so that optical signals pass between the first end portion of the first waveguide core and the second end portion of the second waveguide core through each additional waveguide core in sequence. Also disclosed is a structure including a crossing array implemented using couplers.

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