Abstract:
Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices in an array are provided wherein a gap between the display devices is reduced to less than or equal to ⅛th of a pixel pitch. Exemplary embodiments use wire bonding to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.
Abstract:
A method for manufacturing an optical micro-mirror including a fixed part and a moveable part, with a reflection device connected to the fixed part by an articulation mechanism. This method realizes a stack including a mechanical substrate, a first layer of thermal oxidation material, and at least one second layer of material for forming the moveable part, realizes the articulation mechanism, realizes the reflection device on the second layer, realizes the moveable part by etching of at least the second layer of material, and eliminates the thermal oxidation layer to liberate the moveable part. Such an optical micro-mirror may find possible applications to optical routing or image projection systems.
Abstract:
The mirror device has a mirror 2, and a supporting mechanism which elastically supports the mirror 2 on a substrate 1 in a state in which the mirror floats from the substrate 1, so that the mirror can be inclined in an arbitrary direction. The supporting mechanism has three supporting parts 3A, 3B and 3C that mechanically connect the substrate 1 and mirror 2. Each of the supporting parts 3A, 3B and 3C has one or more plate spring parts 5 that are constructed from a thin film consisting of one or more layers. One end portion of each plate spring part 5 is connected to the substrate 1 via a leg part 9 which has a rising part that rises from the substrate 1. The other end portion of the plate spring part 5 is mechanically connected to the mirror 2 via a connecting part which has a rising part that rises from this other end portion. The mirror 2 is supported on the substrate 1 only via the plate spring part 5 of the respective 3A, 3B and 3C. As a result, compactness and mass production characteristics can be greatly improved while maintaining superior optical characteristics.
Abstract:
The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.
Abstract:
In one embodiment, a micro device is formed by depositing a sacrificial layer over a metallic electrode, forming a moveable structure over the sacrificial layer, and then etching the sacrificial layer with a noble gas fluoride. Because the metallic electrode is comprised of a metallic material that also serves as an etch stop in the sacrificial layer etch, charge does not appreciably build up in the metallic electrode. This helps stabilize the driving characteristic of the moveable structure. In one embodiment, the moveable structure is a ribbon in a light modulator.
Abstract:
A method for making a spatial light modulator is disclosed, that comprises forming an array of micromirrors each having a hinge and a micromirror plate held via the hinge on a substrate, the micromirror plate being disposed in a plane separate from the hinge and having a hinge made of a transition metal nitride, followed by releasing the micromirrors in a spontaneous gas phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.
Abstract:
A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.
Abstract:
The etching of a sacrificial silicon portion in a microstructure such as a microelectromechanical structure by the use of etchant gases that are noble gas fluorides or halogen fluorides is performed with greater selectivity toward the silicon portion relative to other portions of the microstructure by slowing the etch rate. The etch rate is preferably 30 um/hr or less, and can be 3 um/hr or even less. The selectivity is also improved by the addition of non-etchant gaseous additives to the etchant gas. Preferably the non-etchant gaseous additives that have a molar-averaged formula weight that is below that of molecular nitrogen offer significant advantages over gaseous additives of higher formula weights by causing completion of the etch in a shorter period of time while still achieving the same improvement in selectivity. The etch process is also enhanced by the ability to accurately determine the end point of the removal step. A vapor phase etchant is used to remove a material that has been deposited on a substrate, with or without other deposited structure thereon. By creating an impedance at the exit of an etching chamber (or downstream thereof), as the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. Also, the etch selectivity can be improved by doping the sacrificial material.
Abstract:
In a microminiature moving device that has disposed, on a single-crystal silicon substrate, movable elements (a movable rod 46, a movable comb electrode 49, etc.) displaceable in parallel to the substrate surface and stationary parts (a stationary part 40a, etc.), the stationary parts are fixedly secured to the single-crystal silicon substrate 61 with an insulating layer 62 sandwiched therebetween, and depressions 64 are formed in those surface regions of the single-crystal silicon substrate 61 where no stationary parts are present, and the movable parts are positioned above the depressions 64. The depressions 64 form gaps 50 large enough to prevent foreign bodies from causing troubles such as malfunction of the movable parts and shoring.
Abstract:
A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.