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公开(公告)号:US09362853B2
公开(公告)日:2016-06-07
申请号:US13902462
申请日:2013-05-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor: Alfons Dehe
IPC: H02N99/00 , H04R7/10 , H04R31/00 , G01N21/956 , H01J37/26
CPC classification number: H02N99/00 , G01N21/956 , H01J37/26 , H02N1/08 , H04R7/10 , H04R19/04 , H04R31/003 , Y10T428/24281
Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.
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公开(公告)号:US20160096726A1
公开(公告)日:2016-04-07
申请号:US14971879
申请日:2015-12-16
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe , Martin Wurzer , Christian Herzum
CPC classification number: B81B3/007 , B81B3/0018 , B81B3/0035 , B81B3/0051 , B81B2201/0257 , B81C1/00158 , H04R7/06 , H04R19/005 , H04R19/04
Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.
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公开(公告)号:US20160094155A1
公开(公告)日:2016-03-31
申请号:US14962949
申请日:2015-12-08
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe
IPC: H02N1/08
CPC classification number: H02N99/00 , G01N21/956 , H01J37/26 , H02N1/08 , H04R7/10 , H04R19/04 , H04R31/003 , Y10T428/24281
Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.
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公开(公告)号:US20150253208A1
公开(公告)日:2015-09-10
申请号:US14198609
申请日:2014-03-06
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe , Christoph Glacer
IPC: G01L1/14
CPC classification number: G01L1/14 , G01L9/0042 , G01L9/0073 , G01R29/12
Abstract: A transducer structure including a carrier with an opening and a suspended structure mounted on the carrier which extends at least partially over the opening in the carrier is disclosed. The transducer structure may further include configuring the suspended structure to provide an electrostatic field between the suspended structure and the carrier by changing a distance between the suspended structure and the carrier. Alternatively, the suspended structure may be configured to change the distance between the suspended structure and the carrier in response to an electrostatic force provided between the suspended structure and the carrier.
Abstract translation: 一种传感器结构,其包括具有开口的载体和安装在载体上的悬挂结构,其至少部分地延伸在载体中的开口上。 换能器结构还可以包括配置悬挂结构,以通过改变悬挂结构和载体之间的距离来在悬挂结构和载体之间提供静电场。 或者,悬挂结构可以被配置为响应悬挂结构和载体之间提供的静电力而改变悬挂结构和载体之间的距离。
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235.
公开(公告)号:US20150054097A1
公开(公告)日:2015-02-26
申请号:US14010360
申请日:2013-08-26
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe , Christoph Glacer , Soenke Pirk
CPC classification number: B81C1/00539 , B81B7/0009 , B81B2201/0257 , B81B2203/0315 , B81C1/00476
Abstract: A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding into the layer. The sacrificial layer is removed by exposing the sacrificial layer to an etching agent that is introduced through the cavity.
Abstract translation: 一种用于制造MEMS器件的方法包括在与牺牲层相邻的层内提供空腔。 空腔延伸到牺牲层并且包括突出到该层中的毛细槽。 通过将牺牲层暴露于通过空腔引入的蚀刻剂来去除牺牲层。
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236.
公开(公告)号:US20150024536A1
公开(公告)日:2015-01-22
申请号:US14511652
申请日:2014-10-10
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe
IPC: B81C1/00
CPC classification number: B81C1/00269 , B81B3/001 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81C1/00166 , B81C1/00658 , H04R19/005
Abstract: MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions.
Abstract translation: 公开了具有刚性背板的MEMS装置和制造具有刚性背板的MEMS装置的方法。 在一个实施例中,装置包括基板和由基板支撑的背板。 背板包括细长突起。
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公开(公告)号:US20150021722A1
公开(公告)日:2015-01-22
申请号:US13947823
申请日:2013-07-22
Applicant: Infineon Technologies AG
Inventor: Alfons Dehe , Mohsin Nawaz
IPC: H01L29/84 , H01L21/306
CPC classification number: H01L29/84 , B81B3/0021 , B81B2201/0257 , B81B2203/0136 , B81B2203/053 , H01L21/30604 , H04R19/005 , H04R2201/003
Abstract: A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane. A deflector is configured to deflect the membrane such that the first and second plurality of fingers are displaced in a position excluding maximum overlapping of surfaces of the fingers.
Abstract translation: MEMS器件包括包括第一多个指状物的膜。 对电极装置包括与膜的第一多个指状物以交叉关系设置的第二多个指状物。 偏转器被配置成偏转膜,使得第一和第二多个指状物在除了指状物的表面的最大重叠之外的位置移位。
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公开(公告)号:US20140091408A1
公开(公告)日:2014-04-03
申请号:US14100148
申请日:2013-12-09
Applicant: Infineon Technologies AG
Inventor: Marc Fueldner , Alfons Dehe
CPC classification number: B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81C1/00158 , B81C1/0023 , H01L2224/48091 , H01L2224/48195 , H01L2224/48471 , H01L2224/73265 , H01L2924/10253 , H01L2924/3025 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A sensor module and semiconductor chip. One embodiment provides a carrier. A semiconductor chip includes a first recess and a second recess and a main surface of the semiconductor chip. The semiconductor chip is mounted to the carrier such that the first recess forms a first cavity with the carrier and the second recess forms a second cavity with the carrier. The first cavity is in fluid connection with the second cavity.
Abstract translation: 传感器模块和半导体芯片。 一个实施例提供一种载体。 半导体芯片包括半导体芯片的第一凹部和第二凹部以及主表面。 半导体芯片被安装到载体上,使得第一凹槽形成第一空腔,载体和第二凹槽与载体形成第二腔。 第一腔体与第二腔体流体连通。
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