Abstract:
A low-noise CMOS active pixel for image sensors comprises a photosensitive element (PD), a feedback capacitive element (CF) with a capacitance CF, and four transistors, namely a first transistor (M1), two reset transistors (M3, M4) and one pixel selection transistor (M2). These components are laid out and controlled in such a way that the first transistor (M1) is mounted as an amplifier during the pixel reset phase and as a follower during the read phase. The reset transistors (M3, M4) are parallel-connected so that one of them (M4) compensates for the negative effects of the other transistor (M3) on the node common to the two transistors.
Abstract:
A process for forming a low resistivity titanium silicide layer on the surface of a silicon semiconductor substrate. In the process, an effective amount of a metallic element such as indium, gallium, tin, or lead is implanted or deposited on the surface of the silicon substrate. A titanium layer is deposited on the surface of the silicon substrate, and a rapid thermal annealing of the titanium-coated silicon substrate is performed to form low resistivity titanium silicide. In preferred processes, the metallic element is indium or gallium, and more preferably the metallic element is indium. A semiconductor device that has a titanium silicide layer on the surface of a silicon substrate is also provided.
Abstract:
A method of manufacturing a bipolar transistor in a P-type substrate, including the steps of forming in the substrate a first N-type area; forming by epitaxy a first silicon layer; forming in this first layer, and substantially above the first area a second heavily-doped P-type area separate from the second area; forming at the periphery of this second area a third N-type area; forming by epitaxy a second silicon layer; forming a deep trench crossing the first and second silicon layers, penetrating into the substrate and laterally separating the second area from the third area; and performing an anneal such that the dopant of the third area is in continuity with that of the first area.
Abstract:
An electrically erasable and programmable memory includes at least one non-erasable secured zone. Detection and/or correction of read errors in the secured zone is provided by recording redundant bits in the secured zone and delivering an error signal and/or a bit having the majority value when the redundant bits read in the secured zone are not equal.
Abstract:
A touch-sensitive detector includes a detection surface and a conducting element, and a first and second set of electrodes, each set of electrodes including at least one electrode extending parallel to the detection surface and where each electrode is electrically isolated. A first and second interaction capacitor is formed by the conducting element with the first and second set of electrodes, respectively. The second interaction capacitor has a lower capacitance than the first interaction capacitor. The touch-sensitive detection element further includes a first and second set of detectors arranged for detecting a signal emitted by at least one electrode of the first set of electrodes and the second set of electrodes, respectively, and transmitted through an external element located at the electrode emitting the signal. The external element contacts the detection surface. A touch sensitive detection method is also provided.
Abstract:
A synchronization process may include detecting successive horizontal synchronization pulses of a video signal, and a phase comparison between the successive detected pulses and the successive transitions of the reference signal for controlling the oscillator of the phase-locked loop. The detection of each horizontal synchronization pulse may include sampling the video signal, low-pass filtering the sampled signal, thresholding the filtered signal for leaving pulses having a level below a threshold. The synchronization process may also include selecting, as a function of predetermined selection criteria, from among the residual pulses within an observation window centered on a transition of the reference signal for the one which corresponds to the horizontal synchronization pulse.
Abstract:
The component, fully integrated onto a monolithic substrate, includes a tuner, a demodulator, and a channel decoder. The overall filtering is carried out in two parts, a baseband analog filtering and a digital Nyquist filtering removing the information of adjacent channels. It outputs a stream of MPEG data.
Abstract:
A semiconductor device includes multiple layers of integrated electronic components, and at least one electrical connection strip defining a fusible strip in one of the layers. An end of the fusible strip is connected to an integrated electronic component. An intermediate electrical connection and heat dissipation structure and a screen are disposed between the fusible strip and the integrated electronic component.
Abstract:
A CMOS active pixel for image sensors has a photosensitive element, a capacitive feedback element with a capacitance CF, and four transistors, namely a first transistor, two reset transistors and a transistor for the selection of the pixel. These transistors are laid out and controlled in such a way that the first transistor is mounted as an amplifier during the pixel reset phase and as a follower during the read phase.
Abstract:
An integrated circuit includes an adjustment resistor, and at least one control transistor connected to a first voltage reference. An adjustment element is connected in parallel with the adjustment resistor for adjusting a combined electrical resistance of the adjustment element and the resistor. The adjustment element is connected to the control transistor, and includes a substrate, and a MOS transistor having a source, a drain, and a gate on the substrate. The MOS transistor defines a parasitic bipolar transistor with the substrate. The adjustment element further includes a first resistor connected between the substrate and the source, and a second resistor is connected between the substrate and the drain. A diode is connected in series with the second resistor between the substrate and the drain. The gate and the source of the MOS transistor are connected together with the MOS transistor being broken down so that the adjustable element forms an electrical resistance.