公开(公告)号：US20240331961A1

公开(公告)日：2024-10-03

申请号：US18618778

申请日：2024-03-27

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Wei Wang ,  Luo Li ,  Sheng Rao ,  Jun Xiang ,  Ruixiang Zhang

IPC: H01H50/58 ,  H01H50/18 ,  H01H50/54

CPC classification number: H01H50/58 ,  H01H50/18 ,  H01H50/548

Abstract: A relay includes an electromagnet apparatus, a first transmission part, a second transmission part, a first elastic part, a first movable contact, a second static contact, a second elastic part, a first static contact, and a second movable contact. The first movable contact, the second static contact are both disposed on the first elastic part. The second movable contact and the first static contact are both disposed on the second elastic part. The first movable contact is in contact with or separated from the first static contact, and the second movable contact is in contact with or separated from the second static contact. When the first movable contact is in contact with the first static contact, the second movable contact is in contact with the second static contact, the first movable contact and the first static contact are in parallel with the second movable contact and the second static contact.

公开(公告)号：US12106919B2

公开(公告)日：2024-10-01

申请号：US17749593

申请日：2022-05-20

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zezhou Yang ,  Liqiong Yi ,  Shu Zhong ,  Yanxing Yang ,  Zhanlin Ren ,  Guobiao Li

IPC: H01H71/04 ,  H02J13/00 ,  H02H3/08

CPC classification number: H01H71/04 ,  H02J13/00 ,  H02H3/08

Abstract: A power distribution system includes a backplane communication busbar and a circuit breaker. The backplane communication busbar includes at least one slot, and a first interface is configured in each slot. Each first interface is connected to a first resistor R1 having a different resistance value. A second interface of each circuit breaker is connected to a second resistor R2, and when the second interface of the circuit breaker is plugged in any first interface, a preset voltage interval corresponding to a resistance value of the first resistor R1 is uniquely determined by using a series circuit including the first resistor R1 and the second resistor R2.

公开(公告)号：US20240321719A1

公开(公告)日：2024-09-26

申请号：US18735475

申请日：2024-06-06

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiaojing Liao

IPC: H01L23/498 ,  H01L23/28 ,  H01L23/36

CPC classification number: H01L23/49838 ,  H01L23/28 ,  H01L23/36

Abstract: An outer surface of a packaged device includes a bottom surface and a plurality of side surfaces. The bottom surface of the packaged device faces a circuit board, and an area of at least one side surface is greater than that of the bottom surface. The packaged device includes a chip module, a package body, a first interface, and a second interface. The first interface of the packaged device is configured to connect to the circuit board. The second interface of the packaged device is configured to connect to a surface-mount device, and is disposed on at least one side surface.

公开(公告)号：US20240312895A1

公开(公告)日：2024-09-19

申请号：US18672681

申请日：2024-05-23

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Huibin Chen ,  Yutao Wang ,  Haiyan Liu ,  Song Chen ,  Zhonghua Yin ,  Zhen Lv ,  Zhaoyue Wang ,  Qiliang Yang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/49838 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/26 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181

Abstract: A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.

公开(公告)号：US12095256B2

公开(公告)日：2024-09-17

申请号：US17589316

申请日：2022-01-31

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Fangpo Zhang ,  Jun Wang ,  Tiansan Lin ,  Houjian Xu

IPC: H02H7/12 ,  H02M1/32 ,  H02M3/158

CPC classification number: H02H7/1213 ,  H02M1/32 ,  H02M3/158

Abstract: A fault isolation apparatus includes a controller and a circuit breaker. When the circuit breaker is located on a bus connected to a DC/DC conversion unit, if a voltage collected by a first voltage collection terminal is a negative value, it indicates that input or output of the DC/DC conversion unit is reversely connected. In this case, if the circuit breaker is controlled to be opened, the DC/DC conversion unit can be prevented from being connected in series to other parallel DC/DC conversion units. If a voltage collected by a first voltage collection terminal is low and a current collected by a current collection terminal is large, it indicates that the DC/DC conversion unit is short-circuited. In this case, if the circuit breaker is controlled to be opened, another component connected in series to the DC/DC conversion unit can also be prevented from backfeeding energy to the DC/DC conversion unit.

公开(公告)号：US20240305109A1

公开(公告)日：2024-09-12

申请号：US18583016

申请日：2024-02-21

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Kai GUO ,  Houjian XU ,  Xiaoxiang ZHOU

IPC: H02J3/38 ,  H02M7/483 ,  H02M7/5387

CPC classification number: H02J3/388 ,  H02M7/4835 ,  H02M7/53873

Abstract: A power converter includes a power conversion circuit, a relay, and a controller. The power conversion circuit can be configured to implement conversion from a direct current to an alternating current. The relay can be configured to implement on-grid and off-grid switching. The controller can be configured to control switch-on/off of switches in the power conversion circuit and the relay. When a positive direct current bus has a short circuit to ground, the controller switches off a relay of a corresponding phase when any phase of grid voltage is negative. When a negative direct current bus has a short circuit to ground, the controller switches off a relay of a corresponding phase when any phase of grid voltage is positive.

公开(公告)号：US20240305096A1

公开(公告)日：2024-09-12

申请号：US18667399

申请日：2024-05-17

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Meiqing Zhang ,  Shuo Wang ,  Mingxuan Dong ,  Kai Xin

IPC: H02J3/00

CPC classification number: H02J3/0012

Abstract: An output end of a power converter is connected to a microgrid bus, and the microgrid bus is connected to an external power grid through a grid-tied switch. When detecting that a power grid fails, the power converter is in a first current source control mode. After a duration of the power grid failure reaches a first duration, the power converter switches from the first current source control mode to a first voltage source control mode. The first current source control mode is a current source failure ride-through control mode. The first voltage source control mode is a voltage source failure ride-through control mode. The first duration is less than a second duration, and the second duration is a time interval between a moment at which the power grid fails and a moment at which the grid-tied switch is turned off.

公开(公告)号：US12089336B2

公开(公告)日：2024-09-10

申请号：US17669142

申请日：2022-02-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhiqiang Xiang

IPC: H05K1/18 ,  H01L23/31 ,  H01L25/16

CPC classification number: H05K1/181 ,  H01L23/3121 ,  H01L25/16 ,  H05K2201/10719

Abstract: Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.

公开(公告)号：US20240297576A1

公开(公告)日：2024-09-05

申请号：US18582873

申请日：2024-02-21

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Jinxiang ZHAN ,  Kai GAO ,  Juncan WANG ,  Yongbing GAO

IPC: H02M1/32 ,  H02J3/38 ,  H02M3/158

CPC classification number: H02M1/322 ,  H02M3/158 ,  H02J3/38 ,  H02J2300/24

Abstract: A power conversion device includes a positive direct current bus, a negative direct current bus, a first capacitor, a second capacitor, a first inductor, a first discharge unit. The first capacitor is connected between the positive direct current bus and the negative direct current bus. The second capacitor is connected in series to the first inductor and then connected in parallel to the first capacitor, where a capacitance value of the second capacitor is greater than a capacitance value of the first capacitor. The first discharge unit is connected in parallel to the first inductor, and is configured to be in a conducted state when a voltage of the first inductor is greater than a first action voltage threshold. In the embodiments, a case in which a semiconductor device in the power conversion device has a risk of voltage overstress caused by a differential mode lightning strike can be avoided.

公开(公告)号：US20240291389A1

公开(公告)日：2024-08-29

申请号：US18654559

申请日：2024-05-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Jiansheng CHEN ,  Yang LIU ,  Yongfa LI

IPC: H02M3/335 ,  H02J7/00 ,  H02M3/00

CPC classification number: H02M3/33573 ,  H02M3/01 ,  H02J7/00 ,  H02J2207/20

Abstract: An LLC resonant conversion circuit includes a plurality of harmonic circuits. In each harmonic circuit, a plurality of transformers are electrically connected to each other and are electrically connected to one transformer in another harmonic circuit, so that the harmonic circuits are connected in a crossed manner. In this way, current or voltage of an electrical signal in one harmonic circuit can be distributed to another harmonic circuit. Without adding any component, this achieves the same current value for electrical signals in the harmonic circuits when the harmonic circuits are connected in parallel, and achieves the same voltage value for electrical signals in the harmonic circuits when the harmonic circuits are connected in series. This effectively reduces complexity of a control policy for the entire LLC resonant conversion circuit and also reduces costs of the LLC resonant conversion circuit.