High thermal conductivity/low coefficient of thermal expansion composites

    公开(公告)号:US10347559B2

    公开(公告)日:2019-07-09

    申请号:US13049498

    申请日:2011-03-16

    Abstract: A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.

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