Abstract:
A diamond die includes a diamond provided with a hole for drawing a wire material, the diamond being a CVD single-crystal diamond, an axis of the hole being inclined relative to a normal direction of a crystal plane of the diamond.
Abstract:
A shaped diamond die includes a polycrystalline diamond, the polycrystalline diamond having a machining hole, wherein a length D of a side of the machining hole is 100 μm or less, a corner R is 20 μm or less, the shaped diamond die includes a bearing portion, a surface roughness Sa of the bearing portion is 0.05 μm or less, and an average grain size of the polycrystalline diamond is 500 nm or less.
Abstract:
There is provided a vitrified bond super-abrasive grinding wheel including: a core; and a super-abrasive grain layer provided on the core, wherein the super-abrasive grain layer includes a plurality of super-abrasive grains and a vitrified bond that joins the plurality of super-abrasive grains, and the vitrified bond has a plurality of bond bridges located between the plurality of super-abrasive grains to join the plurality of super-abrasive grains, not less than 80% of the plurality of super-abrasive grains are joined to the super-abrasive grains adjacent thereto by the bond bridges, and not less than 90% of the plurality of bond bridges in a cross section of the super-abrasive grain layer have a thickness equal to or smaller than an average grain size of the super-abrasive grains, and have a length greater than the thickness.
Abstract:
An outer peripheral cutting edge located on a rear side in a rotation axis direction of the inclined cutting edge, a rotation diameter of the base metal on the rear side in the rotation axis direction of the outer peripheral cutting edge is smaller than a rotation diameter of the outer peripheral cutting edge, in a cross section perpendicular to a direction in which the inclined cutting edge extends, a cutting edge ridge of the inclined cutting edge has a roundness of a radius less than or equal to 30 μm, and a maximum height difference value of the cutting edge ridge of the inclined cutting edge is less than or equal to 20 μm.
Abstract:
There is provided a super-abrasive grain including: a body composed of cubic boron nitride or diamond; and a ceramic coating film coating at least a portion of a surface of the body.
Abstract:
A super-abrasive grinding wheel includes a core and a super-abrasive grain layer provided on a surface of the core, the super-abrasive grain layer including diamond abrasive grains and CBN abrasive grains, the diamond abrasive grains and the CBN abrasive grains being fixed to the core in a single layer by a binder.
Abstract:
A Mo—Si—B-based alloy for a heat-resistant alloy that satisfies, more than conventional, physical properties such as proof stress and hardness adapted to an increase in the melting point of 5 a welding object. The Mo—Si—B-based alloy powder is such that the full width at half maximum of (600) of Mo5SiB2 in X-ray diffraction peak data is 0.08 degrees or more and 0.7 degrees or less.
Abstract:
Provided are a method for producing sodium tungstate by supplying an oxidant made of sodium nitrate or sodium nitrite to bring a tungsten containing material and the oxidant into contact with each other in an atmosphere containing oxygen to thereby continuously produce a reaction product; a method for collecting tungsten using the method; and an apparatus for producing sodium tungstate. Also provided are a method for producing a sodium tungstate aqueous solution in which a reductant is introduced into a melt containing the above-described reaction product which is then dissolved in water; and a method for collecting tungsten using the method.
Abstract:
Provided is a Mo—Si—B-based alloy for a heat-resistant alloy that satisfies, more than conventional, physical properties such as proof stress and hardness adapted to an increase in the melting point of a welding object.A Mo—Si—B-based alloy powder of this invention is such that the full width at half maximum of (600) of Mo5SiB2 in X-ray diffraction peak data is 0.08 degrees or more and 0.7 degrees or less.