Surface-mount thin-film components having terminals configured for visual inspection

    公开(公告)号:US11056444B2

    公开(公告)日:2021-07-06

    申请号:US16655280

    申请日:2019-10-17

    Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.

    Thin Film Surface Mountable High Frequency Coupler

    公开(公告)号:US20210184327A1

    公开(公告)日:2021-06-17

    申请号:US17190776

    申请日:2021-03-03

    Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

    Multilayer ceramic capacitor having ultra-broadband performance

    公开(公告)号:US11031183B2

    公开(公告)日:2021-06-08

    申请号:US16292738

    申请日:2019-03-05

    Abstract: The present invention is directed to a multilayer ceramic capacitor comprising a first external terminal disposed along a first end, a second external terminal disposed along a second end that is opposite the first end, and an active electrode region containing alternating dielectric layers and active electrode layers. At least one of the electrode layers comprises a first electrode and a second electrode. The first electrode is electrically connected with the first external terminal and has a first electrode arm comprising a main portion and a step portion. The main portion has a lateral edge extending from the first end of the multilayer capacitor and the step portion has a lateral edge offset from the lateral edge of the main portion. The second electrode is electrically connected with the second external terminal.

    Low Noise Capacitors
    26.
    发明申请

    公开(公告)号:US20210166873A1

    公开(公告)日:2021-06-03

    申请号:US17172248

    申请日:2021-02-10

    Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

    Surface-Mount Thin-Film Fuse Having Compliant Terminals

    公开(公告)号:US20200352026A1

    公开(公告)日:2020-11-05

    申请号:US16850160

    申请日:2020-04-16

    Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

    Multilayer Ceramic Capacitor Including Conductive Vias

    公开(公告)号:US20200258688A1

    公开(公告)日:2020-08-13

    申请号:US16788804

    申请日:2020-02-12

    Abstract: The present invention is directed to a multilayer ceramic capacitor. The capacitor comprises a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface. The capacitor comprises a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers. A first through-hole conductive via electrically connects the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor. A second through-hole conductive via electrically connects the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor. The at least one side surface does not include an external terminal.

    Board-to-board contact bridge system

    公开(公告)号:US10734742B2

    公开(公告)日:2020-08-04

    申请号:US16008663

    申请日:2018-06-14

    Abstract: This disclosure provides for an apparatus for connecting a first printed circuit board to a second printed circuit board. More specifically, an apparatus that includes a first receptacle assembly, a second receptacle assembly, and a contact bridge is disclosed. In an embodiment, the contact bridge conductively connects with the first receptacle assembly and the second receptacle assembly. In an embodiment, the contact bridge is disposed between sets of contact beams of the first and second receptacle assemblies.

    Electrode Assembly for an Ultracapacitor
    30.
    发明申请

    公开(公告)号:US20200219667A1

    公开(公告)日:2020-07-09

    申请号:US16627392

    申请日:2018-06-29

    Inventor: Shawn Hansen

    Abstract: An electrode assembly for an ultracapacitor is provided. The electrode assembly contains a first electrode comprising a first current collector electrically coupled to a first carbonaceous coating, a second electrode comprising a second current collector electrically coupled to a second carbonaceous coating, and a separator positioned between the first electrode and the second electrode. At least a portion of the first current collector projects beyond the first longitudinal edge to define a first projecting portion, wherein the offset ratio of the first projecting portion is from about 0.02 to about 0.3.

Patent Agency Ranking