公开(公告)号：US11817262B2

公开(公告)日：2023-11-14

申请号：US17172248

申请日：2021-02-10

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Carl L. Eggerding

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01G4/224 ,  H05K3/34 ,  H01G4/30 ,  H01G4/12 ,  H05K1/18

CPC分类号： H01G2/065 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H01G4/12 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/50 ,  Y10T29/51

摘要： Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

公开(公告)号：US10923277B2

公开(公告)日：2021-02-16

申请号：US16240860

申请日：2019-01-07

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Carl L. Eggerding

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01G4/224 ,  H05K3/34 ,  H01G4/30 ,  H01G4/12 ,  H05K1/18

摘要： Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

公开(公告)号：US10363425B2

公开(公告)日：2019-07-30

申请号：US15140751

申请日：2016-04-28

申请人： AVX Corporation

发明人： Andrew P. Ritter

IPC分类号： A61N1/375 ,  H01F27/33 ,  H01F27/40 ,  H01G4/228 ,  H01G4/35 ,  H01G4/38 ,  H03H7/01 ,  H01G2/04 ,  H01G4/242 ,  H03H1/00

摘要： Discrete cofired feedthrough filters are provided for medical implanted device applications. A plurality of discrete vertical feedthrough filter elements are respectively associated with a plurality of signal wires or pins otherwise supported by an insulating feedthrough and a ferrule. The resulting discrete device comprises a single-element device which is cheaper to make, and which reduces cross-talk between adjacent signal wires/pins while otherwise accommodating changes in feedthrough pitch without having to redesign the filter.

公开(公告)号：US20190123132A1

公开(公告)日：2019-04-25

申请号：US16221975

申请日：2018-12-17

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Marianne Berolini

IPC分类号： H01L49/02

摘要： A multi-layer electronic device is disclosed that comprises a ceramic layer, a first electrode layer, and a second electrode layer. The first electrode layer contains a first tab portion extending to the first lateral edge of the ceramic layer, the first electrode layer further defining a first cut-out region. The second electrode layer contains a second tab portion extending to the first lateral edge of the ceramic layer, the second electrode layer further defining a second cut-out region. The first tab portion of the first electrode layer is offset from the second tab portion of the second electrode layer in the longitudinal direction so that a first gap region is formed within which the first tab portion does not overlap the second tab portion. Further, the first cut-out region at least partially overlaps the second cut-out region.

公开(公告)号：US20170256604A1

公开(公告)日：2017-09-07

申请号：US15450063

申请日：2017-03-06

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Marianne Berolini

IPC分类号： H01L49/02

CPC分类号： H01L28/60

摘要： A multi-layer electronic device is disclosed that comprises a ceramic layer, a first electrode layer, and a second electrode layer. The first electrode layer contains a first tab portion extending to the first lateral edge of the ceramic layer, the first electrode layer further defining a first cut-out region. The second electrode layer contains a second tab portion extending to the first lateral edge of the ceramic layer, the second electrode layer further defining a second cut-out region. The first tab portion of the first electrode layer is offset from the second tab portion of the second electrode layer in the longitudinal direction so that a first gap region is formed within which the first tab portion does not overlap the second tab portion. Further, the first cut-out region at least partially overlaps the second cut-out region.

公开(公告)号：US09755609B2

公开(公告)日：2017-09-05

申请号：US15202814

申请日：2016-07-06

申请人： AVX Corporation

发明人： Gheorghe Korony ,  Andrew P. Ritter

IPC分类号： H05K7/12 ,  H03H7/01 ,  H01C1/148 ,  H01C7/00 ,  H01F5/00 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H01F27/28 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H03H1/00

CPC分类号： H03H7/17 ,  H01C1/148 ,  H01C7/006 ,  H01F5/003 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/111 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/467 ,  H05K3/4697 ,  Y10T29/49124 ,  H01L2924/00

摘要： Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

公开(公告)号：US20170162335A1

公开(公告)日：2017-06-08

申请号：US15368991

申请日：2016-12-05

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Craig W. Nies ,  Richard VanAlstine

IPC分类号： H01G7/06

CPC分类号： H01G7/06 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

摘要： A tunable multilayer capacitor is provided. The capacitor comprises first active electrodes that are in electrical contact with a first active termination and alternating second active electrodes that are in electrical contact with a second active termination. The capacitor also comprises first DC bias electrodes that are in electrical contact with a first DC bias termination and alternating second DC bias electrodes that are in electrical contact with a second DC bias termination. A plurality of dielectric layers are disposed between the alternating first and second active electrodes and between the alternating first and second bias electrodes. At least a portion of the dielectric layers contain a dielectric material that exhibits a variable dielectric constant upon the application of an applied voltage.

公开(公告)号：US20160345444A1

公开(公告)日：2016-11-24

申请号：US15202793

申请日：2016-07-06

申请人： AVX Corporation

发明人： Gheorghe Korony ,  Andrew P. Ritter

IPC分类号： H05K3/46 ,  H01G4/33 ,  H05K1/18 ,  H01F27/28 ,  H03H7/01 ,  H01C1/148 ,  H01C7/00 ,  H01G4/248 ,  H05K1/11

CPC分类号： H03H7/17 ,  H01C1/148 ,  H01C7/006 ,  H01F5/003 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G4/224 ,  H01G4/248 ,  H01G4/33 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/111 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/467 ,  H05K3/4697 ,  Y10T29/49124 ,  H01L2924/00

摘要： Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

公开(公告)号：US20200006007A1

公开(公告)日：2020-01-02

申请号：US16570052

申请日：2019-09-13

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Craig W. Nies ,  Richard VanAlstine

IPC分类号： H01G7/06

摘要： A tunable multilayer capacitor is provided. The capacitor comprises first active electrodes that are in electrical contact with a first active termination and alternating second active electrodes that are in electrical contact with a second active termination. The capacitor also comprises first DC bias electrodes that are in electrical contact with a first DC bias termination and alternating second DC bias electrodes that are in electrical contact with a second DC bias termination. A plurality of dielectric layers are disposed between the alternating first and second active electrodes and between the alternating first and second bias electrodes. At least a portion of the dielectric layers contain a dielectric material that exhibits a variable dielectric constant upon the application of an applied voltage.

公开(公告)号：US10510940B2

公开(公告)日：2019-12-17

申请号：US15010926

申请日：2016-01-29

申请人： AVX Corporation

发明人： Craig W. Nies ,  Andrew P. Ritter

IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L35/06 ,  H01L35/08 ,  H01L35/22

摘要： Disclosed are apparatus and methodology for constructing thermoelectric devices (TEDs). N-type elements are paired with P-type elements in an array of pairs between substrates. The paired elements are electrically connected in series by various techniques including brazing for hot side and/or also cold side connections, and soldering for cold side connections while being thermally connected in parallel. In selected embodiments, electrical and mechanical connections of the elements may be made solely by mechanical pressure.