公开(公告)号：US20140030052A1

公开(公告)日：2014-01-30

申请号：US13949000

申请日：2013-07-23

申请人： Besi Switzerland AG

发明人： Hannes Kostner ,  Dietmar Lackner ,  Florian Speer ,  Martin Widauer

IPC分类号： B25J15/00

CPC分类号： B25J17/0208 ,  B25J15/0095 ,  H05K13/0015 ,  H05K13/04 ,  H05K13/0413

摘要： A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.

摘要翻译： 用于放置装置的放置头的运动保持系统包括放置头对准装置，该装置头对准装置包括至少一个长度可变的保持构件，其布置成与放置头支撑件和放置头之间的接合处一定距离。 该保持构件确定放置头相对于放置头支撑件的枢转位置。 保持构件的长度可以在放置操作期间根据由放置头抵靠着衬底的按压力而引起的放置头引导装置的变形而变化，使得放置头的轴线误差（倾斜）导致 通过放置头引导装置的变形被补偿。

公开(公告)号：US20240230552A1

公开(公告)日：2024-07-11

申请号：US18559056

申请日：2022-05-04

申请人： BESI SWITZERLAND AG

发明人： Ralf WEISE ,  Katharina SCHMEING ,  Rudolf GRÜTER ,  Marco HUG

IPC分类号： G01N21/88 ,  G01N21/95

CPC分类号： G01N21/8806 ,  G01N21/9503 ,  G01N2021/8841 ,  G01N21/9505 ,  G01N2201/0631 ,  G01N2201/0636 ,  G01N2201/067

摘要： The inventions describes an apparatus for inspection of a component comprising an adjustable optical element for image detection in two steps—with focus on the second (or bottom) face of the component and with a focus on the sides. This allows the degree of image degradation in one or more of the images to be reduced.

公开(公告)号：US20210391205A1

公开(公告)日：2021-12-16

申请号：US17285486

申请日：2019-10-15

申请人： Besi Switzerland AG

发明人： Fabian Hurschler ,  Stefan Behler ,  Brian Pulis

IPC分类号： H01L21/683

摘要： A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F′) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.

公开(公告)号：US20180317353A1

公开(公告)日：2018-11-01

申请号：US15947571

申请日：2018-04-06

申请人： BESI SWITZERLAND AG

发明人： Norbert BILEWICZ ,  Andreas MAYR ,  Hugo PRISTAUZ ,  Hubert SELHOFER

IPC分类号： H05K13/04 ,  H01L23/00 ,  H01L21/67 ,  H01L21/68

摘要： The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US09956692B2

公开(公告)日：2018-05-01

申请号：US15051583

申请日：2016-02-23

申请人： Besi Switzerland AG

发明人： Hannes Kostner ,  Dietmar Lackner ,  Florian Speer ,  Martin Widauer

IPC分类号： B23P19/00 ,  B25J17/02 ,  B25J15/00 ,  H05K13/04 ,  H05K13/00

CPC分类号： B25J17/0208 ,  B25J15/0095 ,  H05K13/0015 ,  H05K13/04 ,  H05K13/0413

摘要： A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.

公开(公告)号：US09889516B2

公开(公告)日：2018-02-13

申请号：US14323420

申请日：2014-07-03

申请人： Besi Switzerland AG

发明人： Christoffer Stroemberg ,  Heinrich Berchtold ,  Charles Galea

IPC分类号： B23K1/06 ,  B23K3/06

CPC分类号： B23K1/06 ,  B23K1/0016 ,  B23K3/063

摘要： A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

公开(公告)号：US09721819B2

公开(公告)日：2017-08-01

申请号：US15250796

申请日：2016-08-29

申请人： Besi Switzerland AG

发明人： Florian Speer

IPC分类号： H01L21/68 ,  H01L21/67 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/681 ,  H01L21/56 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81

摘要： The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.

公开(公告)号：US09666460B2

公开(公告)日：2017-05-30

申请号：US14549327

申请日：2014-11-20

申请人： Besi Switzerland AG

发明人： Guido Suter ,  Kevin Domancich ,  Daniel Andreas Scherer ,  Reto Weibel

IPC分类号： B23K3/08 ,  H01L21/67 ,  B23K3/04 ,  B23K1/00 ,  B23K1/008 ,  H01L21/677 ,  B23K101/42

CPC分类号： H01L21/67144 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/04 ,  B23K3/087 ,  B23K2101/42 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/6776

摘要： A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.

公开(公告)号：US20170062257A1

公开(公告)日：2017-03-02

申请号：US15250796

申请日：2016-08-29

申请人： Besi Switzerland AG

发明人： Florian Speer

IPC分类号： H01L21/68 ,  H01L21/67 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/681 ,  H01L21/56 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81

摘要： The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.

摘要翻译： 本发明涉及一种在衬底的衬底位置上安装具有凸起作为倒装芯片的半导体芯片的方法。 该方法包括将倒装芯片放置在以固定方式布置的空腔中，其中凸块用助熔剂润湿，并且通过照相机确定倒装芯片的位置。 该方法还包括使用允许快速和高精度安装的输送头和结合头。

公开(公告)号：US09364953B2

公开(公告)日：2016-06-14

申请号：US13949000

申请日：2013-07-23

申请人： Besi Switzerland AG

发明人： Hannes Kostner ,  Dietmar Lackner ,  Florian Speer ,  Martin Widauer

IPC分类号： B23P19/00 ,  B25J15/00 ,  B25J17/02 ,  H05K13/04

CPC分类号： B25J17/0208 ,  B25J15/0095 ,  H05K13/0015 ,  H05K13/04 ,  H05K13/0413

摘要： A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.

摘要翻译： 用于放置装置的放置头的运动保持系统包括放置头对准装置，该装置头对准装置包括至少一个长度可变的保持构件，其布置成与放置头支撑件和放置头之间的接合处一定距离。 该保持构件确定放置头相对于放置头支撑件的枢转位置。 保持构件的长度可以在放置操作期间根据由放置头抵靠着衬底的按压力而引起的放置头引导装置的变形而变化，使得放置头的轴线误差（倾斜）导致 通过放置头引导装置的变形被补偿。