公开(公告)号：US06483726B2

公开(公告)日：2002-11-19

申请号：US09798323

申请日：2001-03-02

申请人： Wei Chen ,  Jian Jiang ,  Chau-Chun Wen

发明人： Wei Chen ,  Jian Jiang ,  Chau-Chun Wen

IPC分类号： H02M3335

CPC分类号： H02M1/16 ,  H02M3/33561

摘要： A flyback power converter includes a transformer for transferring an input voltage from a primary side to a secondary side. The secondary side includes a main output voltage loop and at least one auxiliary output loop connected with a magnetic amplifier. A pulse width modulation (PWM) controller controls a switch on the primary side of the transformer for turning on the switch and turning off the main output voltage loop and the auxiliary output voltage loop for storing a magnetizing energy on windings of the secondary side. The PWM controller further turns off the switch and turning on the main output voltage loop for providing a main voltage output and for magnetizing the magnetic amplifier connected to the auxiliary output voltage loop. The magnetic amplifier functioning as an auxiliary-loop switch for turning on the auxiliary output voltage loop when the magnetic amplifier is saturated with magnetization and turning off the main voltage output voltage loop for providing an auxiliary output voltage. A time-shared energy transfer mechanism is provided between the main output voltage loop and the auxiliary output voltage loop to fully utilize the entire duty cycle.

摘要翻译： 反激式功率转换器包括用于将输入电压从初级侧传送到次级侧的变压器。 次级侧包括主输出电压回路和至少一个与磁放大器连接的辅助输出回路。 脉冲宽度调制（PWM）控制器控制变压器初级侧的开关，用于接通开关，并关闭主输出电压回路和辅助输出电压回路，用于在次级侧的绕组上存储励磁能。 PWM控制器进一步关闭开关并接通主输出电压回路以提供主电压输出，并用于磁化连接到辅助输出电压回路的磁放大器。 磁放大器用作辅助回路开关，用于当磁放大器饱和磁化时接通辅助输出电压回路，并关闭主电压输出电压回路以提供辅助输出电压。 在主输出电压环路和辅助输出电压环路之间提供时间共享的能量传递机制，以充分利用整个占空比。

公开(公告)号：US08247891B2

公开(公告)日：2012-08-21

申请号：US12491096

申请日：2009-06-24

申请人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

发明人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC分类号： H01L23/495 ,  H01L23/10 ,  H01L23/34 ,  H01L23/28

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US07982304B2

公开(公告)日：2011-07-19

申请号：US12540021

申请日：2009-08-12

申请人： Bau-Ru Lu ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

发明人： Bau-Ru Lu ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/36 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

摘要翻译： 提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。 芯片和散热装置分别设置在基板的第一和第二表面上。 第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过 另一端面。 模塑料封装基板，芯片，散热装置的一部分和第一导电棒。 第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。

公开(公告)号：US5682302A

公开(公告)日：1997-10-28

申请号：US418488

申请日：1995-04-07

申请人： Chau-Chun Wen

发明人： Chau-Chun Wen

IPC分类号： H02M7/5387 ,  H02M1/12

CPC分类号： H02M7/53873

摘要： A power invertor system for converting a direct current (DC) input voltage to an alternate current (AC) output voltage with an output analog wave-shape. The power invertor system includes a digitized sequencing circuit for receiving a sequence of clock signals for generating a digitized up-down sequence as a function of the dock signals. The power invertor system further includes a digitized wave signal generating circuit employing the DC input voltage and the digitized up-down sequence to generate a digitized wave signal approximating the analog wave shape of the AC output voltage. The power invertor system further includes a filtering and smoothing circuit for filtering and smoothing the digitized wave signal to generate the AC output voltage with the analog wave shape.

摘要翻译： 用于将直流（DC）输入电压转换为具有输出模拟波形的交流（AC）输出电压的电力逆变器系统。 功率逆变器系统包括数字化排序电路，用于接收用于生成作为停靠信号的函数的数字化上行序列的时钟信号序列。 电力逆变器系统还包括采用直流输入电压和数字化的上变换序列的数字化波信号发生电路，以产生近似交流输出电压的模拟波形的数字化波信号。 电力逆变器系统还包括滤波和平滑电路，用于对数字化波信号进行滤波和平滑以产生具有模拟波形的AC输出电压。