公开(公告)号：US08330198B2

公开(公告)日：2012-12-11

申请号：US12758252

申请日：2010-04-12

Applicant: Shin Bin Huang ,  Chung-Lin Huang ,  Ching-Nan Hsiao ,  Tzung Han Lee

Inventor： Shin Bin Huang ,  Chung-Lin Huang ,  Ching-Nan Hsiao ,  Tzung Han Lee

IPC: H01L27/108

CPC classification number: H01L27/0259

Abstract: A device for preventing current-leakage is located between a transistor and a capacitor of a memory cell. The two terminals of the device for preventing current-leakage are respectively connected with a slave terminal of the transistor and an electric pole of the capacitor. The device for preventing current-leakage has at least two p-n junctions. The device for preventing current-leakage is a lateral silicon controlled rectifier, a diode for alternating current, or a silicon controlled rectifier. By utilizing the driving characteristic of the device for preventing current-leakage, electric charge stored in the capacitor hardly passes through the device for preventing current-leakage when the transistor is turned off to improve the current-leakage problem.

Abstract translation: 用于防止漏电的装置位于存储单元的晶体管和电容器之间。 用于防止漏电的装置的两个端子分别与晶体管的从端和电容器的电极连接。 用于防止漏电的装置具有至少两个p-n结。 用于防止漏电的装置是侧向可控硅整流器，用于交流电流的二极管或可控硅整流器。 通过利用用于防止漏电的装置的驱动特性，存储在电容器中的电荷几乎不会通过用于防止晶体管截止时漏电的装置，从而改善漏电问题。

公开(公告)号：US08288224B2

公开(公告)日：2012-10-16

申请号：US12699399

申请日：2010-02-03

Applicant: Shin-Bin Huang ,  Tzung-Han Lee ,  Chung-Lin Huang

Inventor： Shin-Bin Huang ,  Tzung-Han Lee ,  Chung-Lin Huang

IPC: H01L21/8242

CPC classification number: H01L28/92

Abstract: A method for manufacturing capacitor lower electrodes includes a dielectric layer, a first silicon nitride layer and a hard mask layer; partially etching the hard mask layer, the first silicon nitride layer and the dielectric layer to form a plurality of concave portions; depositing a second silicon nitride layer onto the hard mask layer and into the concave portions; partially etching the second silicon nitride layer, the hard mask layer and the dielectric layer to form a plurality of trenches; forming a capacitor lower electrode within each trench and partially etching the first silicon nitride layer, the second silicon nitride layer, the dielectric layer and the capacitor lower electrodes to form an etching area; and etching and removing the dielectric layer from the etching area, thereby a periphery of each capacitor lower electrode is surrounded and attached to by the second silicon nitride layer.

Abstract translation: 制造电容器下电极的方法包括电介质层，第一氮化硅层和硬掩模层; 部分地蚀刻硬掩模层，第一氮化硅层和电介质层以形成多个凹部; 在所述硬掩模层上沉积第二氮化硅层并进入所述凹部; 部分蚀刻第二氮化硅层，硬掩模层和电介质层以形成多个沟槽; 在每个沟槽内形成电容器下电极，并部分地蚀刻第一氮化硅层，第二氮化硅层，电介质层和电容器下电极以形成蚀刻区域; 并且从蚀刻区域蚀刻除去电介质层，由此每个电容器下电极的周围被第二氮化硅层包围并附着。

公开(公告)号：US07981743B2

公开(公告)日：2011-07-19

申请号：US12039744

申请日：2008-02-29

Applicant: Mao-Quan Chen ,  Ching-Nan Hsiao ,  Chung-Lin Huang

Inventor： Mao-Quan Chen ,  Ching-Nan Hsiao ,  Chung-Lin Huang

IPC: H01L21/336 ,  H01L21/302 ,  H01L21/461

CPC classification number: H01L29/7923 ,  H01L27/115 ,  H01L27/11568

Abstract: The memory cell of the present invention has two independent storage regions embedded into two opposite sidewalls of the control gate respectively. In this way, the data storage can be more reliable. Other features of the present invention are that the thickness of the dielectric layers is different, and the two independent storage regions are formed on opposite bottom sides of the opening by the etching process and form a shape like a spacer. The advantage of the aforementioned method is that the fabricating process is simplified and the difficulty of self-alignment is reduced.

Abstract translation: 本发明的存储单元具有分别嵌入控制门的两个相对的侧壁中的两个独立的存储区域。 以这种方式，数据存储可以更可靠。 本发明的其他特征是电介质层的厚度不同，并且两个独立的存储区域通过蚀刻工艺形成在开口的相对的底侧上并形成像间隔物的形状。 上述方法的优点是简化了制造工艺，并且减少了自对准的难度。

公开(公告)号：US20110127574A1

公开(公告)日：2011-06-02

申请号：US12758252

申请日：2010-04-12

Applicant: SHIN BIN HUANG ,  CHUNG-LIN HUANG ,  CHING-NAN HSIAO ,  TZUNG HAN LEE

Inventor： SHIN BIN HUANG ,  CHUNG-LIN HUANG ,  CHING-NAN HSIAO ,  TZUNG HAN LEE

IPC: H01L27/108 ,  H01L27/06

CPC classification number: H01L27/0259

Abstract: A device for preventing current-leakage is located between a transistor and a capacitor of a memory cell. The two terminals of the device for preventing current-leakage are respectively connected with a slave terminal of the transistor and an electric pole of the capacitor. The device for preventing current-leakage has at least two p-n junctions. The device for preventing current-leakage is a lateral silicon controlled rectifier, a diode for alternating current, or a silicon controlled rectifier. By utilizing the driving characteristic of the device for preventing current-leakage, electric charge stored in the capacitor hardly passes through the device for preventing current-leakage when the transistor is turned off to improve the current-leakage problem.

Abstract translation: 用于防止漏电的装置位于存储单元的晶体管和电容器之间。 用于防止漏电的装置的两个端子分别与晶体管的从端和电容器的电极连接。 用于防止漏电的装置具有至少两个p-n结。 用于防止漏电的装置是侧向可控硅整流器，用于交流电流的二极管或可控硅整流器。 通过利用用于防止漏电的装置的驱动特性，存储在电容器中的电荷几乎不会通过用于防止晶体管截止时漏电的装置，从而改善漏电问题。

公开(公告)号：US20110090617A1

公开(公告)日：2011-04-21

申请号：US12686399

申请日：2010-01-13

Applicant: Shin-Bin Huang ,  Chung-Lin Huang

Inventor： Shin-Bin Huang ,  Chung-Lin Huang

IPC: H01G4/005 ,  H01G4/00

CPC classification number: H01G4/33 ,  H01G4/005 ,  H01G4/228 ,  H01L23/50 ,  H01L27/10852 ,  H01L28/88 ,  H01L28/92 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of fabricating a capacitor electrode. A stack structure is formed on a substrate, and the stack structure includes a first conductive layer, a first sacrificial layer, and a second sacrificial layer. The stack structure includes a first sidewall and a second sidewall facing the first sidewall. A conductive sidewall is formed on the first sidewall and the second sidewall to electrically connect the first conductive layer to the second conductive layer. Finally, the first and the second sacrificial layers are removed.

Abstract translation: 一种制造电容器电极的方法。 堆叠结构形成在衬底上，堆叠结构包括第一导电层，第一牺牲层和第二牺牲层。 堆叠结构包括第一侧壁和面向第一侧壁的第二侧壁。 导电侧壁形成在第一侧壁和第二侧壁上，以将第一导电层电连接到第二导电层。 最后，去除第一和第二牺牲层。

公开(公告)号：US20100279472A1

公开(公告)日：2010-11-04

申请号：US12838495

申请日：2010-07-19

Applicant: Hung-Mine Tsai ,  Ching-Nan Hsiao ,  Chung-Lin Huang

Inventor： Hung-Mine Tsai ,  Ching-Nan Hsiao ,  Chung-Lin Huang

IPC: H01L21/8239

CPC classification number: H01L27/115 ,  H01L27/0207 ,  H01L27/11519 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/11568

Abstract: In a manufacturing method of a non-volatile memory, a substrate is provided, and strip-shaped isolation structures are formed in the substrate. A first memory array including memory cell columns is formed on the substrate. Each memory cell column includes memory cells connected in series with one another, a source/drain region disposed in the substrate outside the memory cells, select transistors disposed between the source/drain region and the memory cells, control gate lines extending across the memory cell columns and in a second direction, and first select gate lines respectively connecting the select transistors in the second direction in series. First contacts are formed on the substrate at a side of the first memory array and arranged along the second direction. Each first contact connects the source/drain regions in every two adjacent active regions.

Abstract translation: 在非易失性存储器的制造方法中，提供衬底，并且在衬底中形成条形隔离结构。 包括存储单元列的第一存储器阵列形成在衬底上。 每个存储单元列包括彼此串联连接的存储器单元，设置在存储单元外部的衬底中的源极/漏极区域，设置在源极/漏极区域和存储器单元之间的选择晶体管，跨过存储器单元延伸的控制栅极线 列和第二方向，并且首先选择分别连接第二方向上的选择晶体管的栅极线。 第一触点形成在第一存储器阵列的一侧的基板上，并沿第二方向布置。 每个第一接触件在每两个相邻有效区域中连接源极/漏极区域。

公开(公告)号：US07713820B2

公开(公告)日：2010-05-11

申请号：US11945199

申请日：2007-11-26

Applicant: Hung-Mine Tsai ,  Ching-Nan Hsiao ,  Chung-Lin Huang

Inventor： Hung-Mine Tsai ,  Ching-Nan Hsiao ,  Chung-Lin Huang

IPC: H01L21/336

CPC classification number: H01L29/7887 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324

Abstract: A method for manufacturing a non-volatile memory is provided. An isolation structure is formed in a trench formed in a substrate. A portion of the isolation structure is removed to form a recess. A first dielectric layer and a first conductive layer are formed sequentially on the substrate. Bar-shaped cap layers are formed on the substrate. The first conductive layer not covered by the bar-shaped cap layers is removed to form first gate structures. A second dielectric layer is formed on the sidewalls of the first gate structures. A third dielectric layer is formed on the substrate between the first gate structures. A second conductive layer is formed on the third dielectric layer. The bar-shaped cap layers and a portion of the first conductive layer are removed to form second gate structures. A doped region is formed in the substrate at two sides of each of the second gate structures.

Abstract translation: 提供一种用于制造非易失性存储器的方法。 在衬底中形成的沟槽中形成隔离结构。 去除隔离结构的一部分以形成凹部。 在基板上依次形成第一介电层和第一导电层。 在基板上形成棒状盖层。 未被棒状帽层覆盖的第一导电层被去除以形成第一栅极结构。 在第一栅极结构的侧壁上形成第二介电层。 在第一栅极结构之间的衬底上形成第三电介质层。 在第三电介质层上形成第二导电层。 条形盖层和第一导电层的一部分被去除以形成第二栅极结构。 在每个第二栅极结构的两侧在衬底中形成掺杂区域。

公开(公告)号：US20090032858A1

公开(公告)日：2009-02-05

申请号：US11927616

申请日：2007-10-29

Applicant: Shin-Bin Huang ,  Ching-Nan Hsiao ,  Chung-Lin Huang

Inventor： Shin-Bin Huang ,  Ching-Nan Hsiao ,  Chung-Lin Huang

IPC: H01L29/788

CPC classification number: H01L27/115 ,  H01L27/11521 ,  H01L27/11524

Abstract: A flash memory is provided. The flash memory features of having the select gate transistors to include two different channel structures, which are a recessed channel structure and a horizontal channel. Because of the design of the recessed channel structure, the space between the gate conductor lines, which are for interconnecting the select gates of the select gate transistors arranged on the same column, can be shortened. Therefore, the integration of the flash memory can be increased; and the process window of the STI process can be increased as well. In addition, at least one depletion-mode select gate transistor is at one side of the memory cell string. The select gate transistor of the depletion-mode is always turned on.

Abstract translation: 提供闪存。 具有选择栅极晶体管的闪存特征包括两个不同的沟道结构，它们是凹陷沟道结构和水平沟道。 由于凹陷沟道结构的设计，可以缩短用于互连布置在同一列上的选择栅极晶体管的选择栅极的栅极导体线之间的空间。 因此，可以增加闪存的集成; 并且可以增加STI过程的处理窗口。 此外，至少一个耗尽型选择栅极晶体管位于存储单元串的一侧。 耗尽模式的选择栅晶体管总是导通。

公开(公告)号：US20070063260A1

公开(公告)日：2007-03-22

申请号：US11603771

申请日：2006-11-22

Applicant: Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

Inventor： Ying-Cheng Chuang ,  Chung-Lin Huang ,  Chi-Hui Lin

IPC: H01L29/788

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L29/42324 ,  H01L29/7881

Abstract: A floating gate and fabrication method thereof. A semiconductor substrate is provided, on which an oxide layer, a first conducting layer, and a patterned hard mask layer having an opening are sequentially formed. A spacer is formed on the sidewall of the opening. A second conducting layer is formed on the hard mask layer. The second conducting layer is planarized to expose the surface of the patterned hard mask layer. The surface of the second conducting layer is oxidized to form an oxide layer. The patterned hard mask layer and the oxide layer and the first conducting layer underlying the patterned hard mask layer are removed.

Abstract translation: 浮栅及其制造方法。 提供了半导体衬底，其上依次形成有氧化物层，第一导电层和具有开口的图案化硬掩模层。 间隔件形成在开口的侧壁上。 在硬掩模层上形成第二导电层。 将第二导电层平坦化以暴露图案化硬掩模层的表面。 第二导电层的表面被氧化形成氧化物层。 图案化的硬掩模层和氧化物层以及图案化的硬掩模层下面的第一导电层被去除。

公开(公告)号：US06900112B2

公开(公告)日：2005-05-31

申请号：US10426348

申请日：2003-04-30

Applicant: Chi-Hui Lin ,  Chung-Lin Huang

Inventor： Chi-Hui Lin ,  Chung-Lin Huang

IPC: H01L21/762 ,  H01L21/76

CPC classification number: H01L21/76224

Abstract: A process for forming shallow trench isolation region with corner protection layer. A protection layer is formed within the opening that defines the isolation trench as part of the etching mask such that the etching rate of the protection layer is less than the mask layer and the pad insulating layer to the etchant used to remove the mask layer and pad insulating layer. The protection layer is partially removed and left adjacent to the shallow trench isolation region as a corner protection layer after removing the mask layer and pad insulating layer. Thus, the indentation next to the corner of the isolation region is avoided.

Abstract translation: 用于形成具有角保护层的浅沟槽隔离区的工艺。 在开口内形成保护层，其将隔离沟槽定义为蚀刻掩模的一部分，使得保护层的蚀刻速率小于用于去除掩模层和焊盘的掩模层和蚀刻剂的焊盘绝缘层 绝缘层。 在去除掩模层和焊盘绝缘层之后，保护层被部分地去除并且与作为转角保护层的浅沟槽隔离区相邻。 因此，避免了隔离区域的拐角附近的压痕。