Abstract:
An apparatus for growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
An apparatus for growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
The invention addresses the area utilization and capital efficiency of systems for converting solar energy into electricity. A solid-state solar system includes photovoltaic and thermoelectric or thermionic cells. The system can be implemented in various configurations and by a solar insolation flux collection and concentration method to improve the area utilization and solar-to-electricity conversion efficiency. A thermal expansion matched multilayer board is also used to withstand ultra high concentration of solar insolation flux.
Abstract:
The invention addresses area utilization and capital efficiency of systems for converting solar energy into electricity. Methods of converting solar energy use photovoltaic cells which are arranged within a concentrated solar insolation flux path on different substrates/boards to collect different respective portions of the radiation spectrum.
Abstract:
An apparatus and method of attaching I/O pads of an integrated circuit die to package leads. The attachment is made using conventional assembly processes but without using wire bonding. A leadframe with lead fingers is formed and the lead fingers are aligned with bumps extending from the I/O pads. A connection is made by physical contact, laser spot welding, or other coupling techniques.
Abstract:
A method of growing an epitaxial semiconductor structure is disclosed. The growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
An apparatus for growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
A method of growing an epitaxial semiconductor structure is disclosed. The growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
A method of growing an epitaxial semiconductor structure is disclosed. The growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.
Abstract:
A method of growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form devices such as solar cell, light emitting diode, and other devices and assembled into higher integration of desired applications.