Abstract:
An adjustable current mode differential sense amplifier is disposed to be in communication with a selected memory cell and a reference cell having a predetermined value. The amplifier is able to sense current and voltage changes associated with the selected memory cell and compare them to current and voltage changes associated with the reference cell. The operating point of the sensing amplifier may be changed by modifying threshold voltages related to the back gate bias applied to selected transistors in the amplifier. This adjusting capability enables currents or voltages of the sense amplifier to be set when a first bias voltage is applied to a selected memory cell in order to maximize the sensitivity of the amplifier. When a second bias voltage is applied to the memory and reference cells in order to determine the memory cell value, the amplifier is able to sense slight changes in the currents or voltages associated with the selected memory cell and the reference cell and compare them to determine the state of the memory cell. This increased sensitivity enables the amplifier to have a substantially increased dynamic range without introducing components that might adversely affect the memory circuitry parameters. The memory cell array being sensed has equi-potential isolation for all unselected memory cells, thereby minimizing sneak currents through the unselected memory cells.
Abstract:
A magnetic memory device includes a first magnetic tunnel junction having a first reference ferromagnetic layer; a second magnetic tunnel junction having a second reference ferromagnetic layer; and an electrically conductive spacer layer between the first and second reference layers. The first and second reference layers are antiferromagnetically coupled.
Abstract:
A magnetic memory includes a memory cell and a conductor wherein the memory cell is crossed by the conductor. A write pulse generator is coupled to the conductor and is configured to provide a discharge current to the conductor during a write operation of the memory cell.
Abstract:
Resistance of a memory cell element in a resistive cross point memory cell array is sensed by a read circuit including a differential amplifier, a first direct injection preamplifier and a second direct injection preamplifier. During a read operation, the first direct injection preamplifier is coupled to a first input node of the differential amplifier, and the second direct injection preamplifier is coupled to a second input node of the differential amplifier.
Abstract:
A display device and a method of driving liquid crystals in an array of pixels of the display device include providing dual port memory cells that isolate write operations to the pixels from read operations within the pixels. Preferably, each pixel has an array of integrated dual port memory cells, with the number of cells in the array being equal to the number of bits per pixel within each frame of pixel data. The dual port memory cell may be an electrical series connection of a bit-storage device having write access circuitry (e.g., a write access transistor) on one side and read access circuitry (e.g., two read access transistors) on the opposite side. Such a series connection of devices enables the rate of driving the liquid crystal to be set independently from the rate of receiving pixel data at the pixels.
Abstract:
A built-in test circuit configuration for row based static CMOS integrated circuits using a control circuit and a plurality of switching circuits, each connecting VDD to a row power buss through a large pass transistor during normal operating modes and through a low current pull up transistor during the test mode of operation. Defect induced currents are detected by the OR'd outputs of the switching circuits connected to an OR function formed in the control circuit. Additional switching circuits are provided for supplying multiple main power supplies to each integrated circuit row. The switching and additional switching circuits may be physically configured beneath row end caps.
Abstract:
A method of making a lower cost active matrix display. In a particular embodiment, the method includes providing at least one first conductor upon a substrate and depositing a gate dielectric upon the first conductor and substrate. At least one paired second conductor and a pixel electrode are deposited upon the gate dielectric, with the second conductor crossing the first conductor and with a narrow gap between the paired second conductor and the pixel electrode. A semiconductor material is deposited over the paired second conductor and pixel electrode, filling the narrow gap. The narrow gap shelters a portion of the semiconductor material, which serves as a semiconductor bridge capable of functioning either as an insulator or as a channel region of a field effect transistor. The remaining, unsheltered semiconductor material is removed. A liquid crystal layer is then deposited upon the paired second conductor, the pixel electrode and the sheltered semiconductor material, and a translucent conductor is deposited upon the liquid crystal display layer. An associated display is also provided.
Abstract:
In various embodiments of the present invention, tunable resistors are introduced at the interconnect layer of integrated circuits in order to provide a for adjusting internal voltage and/or current levels within the integrated circuit to repair defective components or to configure the integrated circuit following manufacture. For example, when certain internal components, such as transistors, do not have specified electronic characteristics due to manufacturing defects, adjustment of the variable resistances of the tunable resistors included in the interconnect layer of integrated circuits according to embodiments of the present invention can be used to adjust internal voltage and/or levels in order to ameliorate the defective components. In other cases, the tunable resistors may be used as switches to configure integrated circuit components, including individual transistors and logic gates as well as larger, hierarchically structured functional modules and domains.
Abstract:
An information storage device is provided. The information storage device may be a magnetic random access memory (MRAM) device including a resistive cross point array of spin dependent tunneling (SDT) junctions or magnetic memory elements, with word lines extending along rows of the SDT junctions and bit lines extending along the columns of the SDT junctions. The present design includes a plurality of heating elements connected in series with associated magnetic memory elements, each heating element comprising a diode. Voltage applied to a magnetic memory element and associated heating element causes reverse current to flow through the diode, thereby producing heat from the diode and heating the magnetic memory element, thereby facilitating the write function of the device.
Abstract:
The invention includes an apparatus and method for selecting a desirable magnitude of a magnetic memory cell write current. The method includes determining a minimal magnitude of write current for writing to the magnetic memory cell, determining a maximal magnitude of write current for writing to the magnetic memory cell, and calculating the selected magnitude of magnetic memory cell write current based on the minimal magnitude of write current and the maximal magnitude of write current.