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公开(公告)号:US20240331769A1
公开(公告)日:2024-10-03
申请号:US18294434
申请日:2022-07-29
Inventor: Julian Pries , Matthias Wuttig , Christian Stenz
IPC: G11C13/00
CPC classification number: G11C13/0004 , G11C13/0033 , G11C13/0069
Abstract: A method of operating an electrically programmable memory cell comprising a chalcogenide for multi-level data storage, the method comprising providing a pulse signal associated with a first predetermined temperature level to the memory cell to adjust a resistance state according to the first predetermined temperature level; providing a pulse signal associated with a second predetermined temperature level to the memory cell to reset the resistance drift in the chalcogenide, which resistance drift has occurred since the providing the pulse signal associated with the first predetermined temperature level; and the first and second predetermined temperature levels are each greater than a glass transition temperature (Tg) of the chalcogenide.
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公开(公告)号:US20240321350A1
公开(公告)日:2024-09-26
申请号:US18734724
申请日:2024-06-05
Applicant: Micron Technology, Inc.
Inventor: Li-Te Chang , Murong Lang , Zhenming Zhou
CPC classification number: G11C13/0033 , G11C13/0004 , G11C13/004 , G11C13/0069 , G11C11/5678
Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a cross-point memory array includes memory cells. A media controller reads one or more first memory cells and determines a read status. The read status indicates an error when reading the first memory cells. In response to this error, the controller refreshes the first memory cells. The controller uses the read status to determine zero-to-one failures associated with the first memory cells. If a number of these failures exceeds a threshold, then a refresh is applied to neighboring memory cells of the first memory cells. The physical addresses for the neighboring memory cells are determined by the controller from the physical addresses for the first memory cells.
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公开(公告)号:US12027205B2
公开(公告)日:2024-07-02
申请号:US17828979
申请日:2022-05-31
Inventor: Zheng-Jun Lin , Chung-Cheng Chou , Yu-Der Chih
IPC: G11C13/00
CPC classification number: G11C13/0069 , G11C13/0026 , G11C13/0033 , G11C2213/79
Abstract: A memory device includes RRAM memory cells configured to form a zero-transistor and one-resistor (0T1R) array structure in which access transistors of the RRAM memory cells are bypassed or removed. Alternatively, the access transistors of the RRAM memory cells may be arranged in a parallel structure to reduce associated IR drop and thus enable reduced write voltage operation.
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公开(公告)号:US11817147B2
公开(公告)日:2023-11-14
申请号:US16998834
申请日:2020-08-20
Applicant: Micron Technology, Inc.
Inventor: Makoto Kitagawa , Adam Johnson
CPC classification number: G11C13/0069 , G11C13/0026 , G11C13/0033 , G11C11/1655 , G11C11/1675 , G11C13/0004 , G11C13/0007 , G11C13/0011 , G11C2213/79
Abstract: Memory systems and memory programming methods are described. According to one arrangement, a memory system includes a plurality of memory cells individually configured to have a plurality of different memory states, a plurality of bitlines coupled with the memory cells, access circuitry coupled with the bitlines and configured to apply a plurality of program signals to the bitlines to program the memory cells between the different memory states, a controller configured to control the access circuitry to provide a first program signal and a second program signal to one of the bitlines coupled with one of the memory cells to program the one memory cell from a first of the memory states to a second of the memory states, wherein the second program signal has an increased electrical characteristic compared with the first program signal, and selection circuitry configure to couple another of the bitlines which is immediately adjacent to the one bitline to a node having a first voltage which is different than a second voltage of the one bitline during the provision of the first and second program signals to the one bitline.
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公开(公告)号:US11798622B2
公开(公告)日:2023-10-24
申请号:US17865248
申请日:2022-07-14
Applicant: Micron Technology, Inc.
Inventor: Joemar Sinipete , John Christopher Sancon , Mingdong Cui
CPC classification number: G11C13/0097 , G11C13/0004 , G11C13/004 , G11C13/0033 , G11C13/0069 , G11C2013/0045 , G11C2013/0078
Abstract: Methods, systems, and devices for a refresh operation of a memory cell are described. A memory device may include a plurality of rows of memory cells. Each row of memory cells may undergo a quantity of access operations (e.g., read operations, write operations). During a read operation, a logic state of one or more memory cells may be determined by applying a read pulse having a first polarity. Based on the one or more memory cells storing a particular logic state (e.g., a first logic state), a refresh operation may be performed. During a refresh operation, a refresh pulse having a second polarity (e.g., a different polarity than the first polarity) may be applied to the one or more memory cells.
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公开(公告)号:US20230335190A1
公开(公告)日:2023-10-19
申请号:US18336814
申请日:2023-06-16
Applicant: TetraMem Inc.
Inventor: Ning Ge
IPC: G11C13/00
CPC classification number: G11C13/0033 , G11C13/0097 , G11C13/0069 , G11C2013/009 , G11C2213/79 , G11C2213/74
Abstract: A crossbar circuit is provided. The crossbar circuit includes one or more bit lines, one or more word lines, one or more cell devices connected between the bit lines and the word lines, one or more analog-to-digital converters (ADCs) connected to the one or more bit lines, one or more digital-to-analog converters (DACs) connected to the one or more word lines, one or more access controls connected to the one or more cell devices and configured to select a cell device in the one or more cell devices and to program the selected cell device, and a slew rate controller connected to the one or more bit lines. The first slew rate controller is configured to receive an input signal or a bias and output a slew-rate controlled signal.
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公开(公告)号:US20230207005A1
公开(公告)日:2023-06-29
申请号:US17828979
申请日:2022-05-31
Inventor: Zheng-Jun Lin , Chung-Cheng Chou , Yu-Der Chih
IPC: G11C13/00
CPC classification number: G11C13/0069 , G11C13/0026 , G11C13/0033 , G11C2213/79
Abstract: A memory device includes RRAM memory cells configured to form a zero-transistor and one-resistor (0T1R) array structure in which access transistors of the RRAM memory cells are bypassed or removed. Alternatively, the access transistors of the RRAM memory cells may be arranged in a parallel structure to reduce associated IR drop and thus enable reduced write voltage operation.
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公开(公告)号:US20230207003A1
公开(公告)日:2023-06-29
申请号:US17561340
申请日:2021-12-23
Applicant: Micron Technology, Inc.
Inventor: Li-Te Chang , Murong Lang , Zhenming Zhou
IPC: G11C13/00
CPC classification number: G11C13/0033 , G11C13/0004 , G11C13/004 , G11C13/0069 , G11C11/5678
Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a cross-point memory array includes memory cells. A media controller reads one or more first memory cells and determines a read status. The read status indicates an error when reading the first memory cells. In response to this error, the controller refreshes the first memory cells. The controller uses the read status to determine zeroto-one failures associated with the first memory cells. If a number of these failures exceeds a threshold, then a refresh is applied to neighboring memory cells of the first memory cells. The physical addresses for the neighboring memory cells are determined by the controller from the physical addresses for the first memory cells.
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公开(公告)号:US20190122728A1
公开(公告)日:2019-04-25
申请号:US16227375
申请日:2018-12-20
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Jason Brand , Jason Snodgress
CPC classification number: G11C13/0004 , G11C7/04 , G11C13/00 , G11C13/0033 , G11C13/004 , G11C29/50 , G11C2029/5002
Abstract: A phase change memory array may include at least one cell used to determine whether the array has been altered by thermal exposure over time. The cell may be the same or different from the other cells. In some embodiments, the cell is only read in response to an event. If in response to that reading, it is determined that the cell has changed state or resistance, it may deduce whether the change is a result of thermal exposure. Corrective measures may then be taken.
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公开(公告)号:US20190088869A1
公开(公告)日:2019-03-21
申请号:US15909125
申请日:2018-03-01
Applicant: TOSHIBA MEMORY CORPORATION
Inventor: Yefei HAN , Tetsu MOROOKA
CPC classification number: H01L45/06 , G11C7/06 , G11C7/12 , G11C13/0007 , G11C13/003 , G11C13/0033 , G11C29/04 , G11C29/70 , G11C2213/71 , G11C2213/76 , G11C2213/78 , G11C2213/79 , H01L27/2436 , H01L27/2481 , H01L27/249 , H01L45/08 , H01L45/1226 , H01L45/1233 , H01L45/144 , H01L45/146 , H01L45/1608
Abstract: A memory device includes a first conductive layer and a second conductive layer. A variable resistance layer is disposed between the first conductive layer and the second conductive layer and includes a first layer containing a semiconductor or a first metal oxide, and a second layer containing a second metal oxide. A phase-change layer is disposed either between the first conductive layer and the variable resistance layer or between the second conductive layer and the variable resistance layer.
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