COOLING DEVICE
    21.
    发明申请
    COOLING DEVICE 有权
    冷却装置

    公开(公告)号:US20090195984A1

    公开(公告)日:2009-08-06

    申请号:US12170556

    申请日:2008-07-10

    IPC分类号: H05K7/20

    摘要: A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element.

    摘要翻译: 用于散发由电子元件产生的热量的冷却装置包括固定座,冷却体和蒸气室。 固定座设置开口。 冷却体包括安装在固定座上的底板和彼此间隔并连接到底板的多个冷却翅片,其中固定孔布置在底板的一侧,并且容纳 在与固定孔对应的冷却翅片处构成空间。 蒸气室容纳在固定座的开口中,蒸气室的一侧与冷却体的底部接触,另一侧接触电子元件。

    HEAT PIPE WITH FLEXIBLE SUPPORT STRUCTURE
    22.
    发明申请
    HEAT PIPE WITH FLEXIBLE SUPPORT STRUCTURE 审中-公开
    具有柔性支撑结构的热管

    公开(公告)号:US20120325438A1

    公开(公告)日:2012-12-27

    申请号:US13169238

    申请日:2011-06-27

    IPC分类号: F28D15/04

    CPC分类号: F28D15/0241 F28D15/046

    摘要: A heat pipe with a flexible support structure includes a pipe body and a support, and the support is installed in the pipe body and includes a first row of side plates and a second row of side plates extended along the lengthwise direction of the pipe body and a plurality of support elements coupled between the first and second rows of side plates, and each support element abuts the internal side of a capillary tissue of the pipe body. Plate elements of the first and second rows of side plates are arranged with an interval apart from each other and in sections along the lengthwise direction of the pipe body, and the plate elements of the first row of side plates and the plate elements of the second row of side plates are aligned alternately with each other. The support is flexible to facilitate users to bend the heat pipe.

    摘要翻译: 具有柔性支撑结构的热管包括管体和支撑件,并且支撑件安装在管体中,并且包括第一排侧板和沿着管体的长度方向延伸的第二排侧板, 耦合在第一和第二排侧板之间的多个支撑元件,并且每个支撑元件邻接管体的毛细管组织的内侧。 第一排和第二排侧板的板状元件沿着管体的长度方向彼此间隔开,并且沿第一排侧板的板状元件和第二排侧板的板状元件 一排侧板彼此交替排列。 支撑是灵活的,方便用户弯曲热管。

    Clamp-type heat sink for memory
    24.
    发明授权
    Clamp-type heat sink for memory 失效
    夹式散热器用于记忆

    公开(公告)号:US08134834B2

    公开(公告)日:2012-03-13

    申请号:US12818341

    申请日:2010-06-18

    IPC分类号: H05K7/20

    摘要: A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.

    摘要翻译: 用于存储器的夹式散热器包括两个导热模块,枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔,使得每个散热体串联安装,并且弹性元件被套在枢轴上,并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧,以提高组装和移除过程的便利性和完整性,以实现快速组装或去除效果并防止部件丢失。

    FLAT HEAT PIPE HAVING SWIRL CORE
    25.
    发明申请
    FLAT HEAT PIPE HAVING SWIRL CORE 审中-公开
    具有SWIRL核心的平面热管

    公开(公告)号:US20120037344A1

    公开(公告)日:2012-02-16

    申请号:US12854637

    申请日:2010-08-11

    IPC分类号: F28D15/04

    摘要: A flat heat pipe having a swirl core includes a flat sealed casing having smooth inner walls, a working fluid filled within the flat sealed casing, and a swirl core disposed along a central axis of the flat sealed casing to support upper and lower inner walls of the flat sealed casing. Two airflow channels are formed between the swirl core and left and right inner walls of the flat sealed casing for allowing vapors of the working fluid to flow through. The swirl core is made by winding a metallic woven mesh in at least two circles for allowing the working fluid to flow through. A center of the swirl core is formed with a reflow channel. By this arrangement, the swirl core is used as a wick structure for allowing the working fluid to flow through, thereby saving the cost and time for manufacturing the wick structure.

    摘要翻译: 具有涡流芯的扁平热管包括平坦的密封壳体,其具有平滑的内壁,填充在平的密封壳体内的工作流体和沿扁平密封壳体的中心轴设置的涡流芯,以支撑上部和下部内壁 扁平密封外壳。 两个气流通道形成在涡流芯与扁平密封壳体的左右内壁之间,以允许工作流体的蒸气流过。 涡流芯通过在至少两个圆圈中缠绕金属编织网来制造,以允许工作流体流过。 涡流芯的中心形成有回流通道。 通过这种布置,涡流芯被用作芯体结构以允许工作流体流过,从而节省了用于制造芯结构的成本和时间。

    VAPOR CHAMBER HAVING COMPOSITE SUPPORTING STRUCTURE
    26.
    发明申请
    VAPOR CHAMBER HAVING COMPOSITE SUPPORTING STRUCTURE 审中-公开
    具有复合材料支撑结构的蒸气室

    公开(公告)号:US20110315351A1

    公开(公告)日:2011-12-29

    申请号:US12821309

    申请日:2010-06-23

    IPC分类号: F28D15/04

    CPC分类号: F28D15/046 F28D15/0233

    摘要: A vapor chamber having a composite supporting structure includes a flat sealed casing; a wick structure, a working fluid and a composite supporting structure. The composite supporting structure has a waved supporting rack and at least one supporting pillar. The waved supporting rack is configured to support upper and lower inner walls of the flat sealed casing. The waved supporting rack has plural separated channels for allowing vapor of the working fluid to flow through. Both ends of the at least one supporting pillar are respectively connected to the flat sealed casing or the wick structure. With this arrangement, compressive strength and tensile strength of the vapor chamber can be increased simultaneously without obstructing the circulation of liquid/vapor phases of the working fluid and reducing the thermal-conducting efficiency thereof.

    摘要翻译: 具有复合支撑结构的蒸气室包括平的密封壳体; 芯结构,工作流体和复合支撑结构。 复合支撑结构具有波形支撑架和至少一个支撑柱。 波形的支撑架被构造成支撑扁平密封壳体的上内壁和下内壁。 波浪支撑架具有多个分离的通道,用于使工作流体的蒸汽流过。 至少一个支撑柱的两端分别连接到扁平密封壳体或芯体结构。 通过这种布置,可以同时提高蒸汽室的抗压强度和拉伸强度,而不会阻碍工作流体的液相/汽相的循环并降低其导热效率。

    COMPACT VAPOR CHAMBER AND HEAT-DISSIPATING MODULE HAVING THE SAME
    27.
    发明申请
    COMPACT VAPOR CHAMBER AND HEAT-DISSIPATING MODULE HAVING THE SAME 审中-公开
    紧凑型蒸气室和具有该蒸发器的散热模块

    公开(公告)号:US20110232877A1

    公开(公告)日:2011-09-29

    申请号:US12729279

    申请日:2010-03-23

    IPC分类号: F28D15/04 H01L23/427

    摘要: A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporating section formed on a portion of the vapor chamber. An outer surface of the flat sealed casing on the evaporating section has a recess for covering the electronic heat-generating element. The recess is brought into thermal contact with the electronic heat-generating element. With this arrangement, when the compact vapor chamber is brought into thermal contact the electronic heat-generating element for heat dissipation, the distance of the electronic heat-generating element protruding from the compact vapor chamber is reduced, thereby facilitating the compact design of an electronic product. Further, the present invention provides a heat-dissipating module having such a compact vapor chamber.

    摘要翻译: 构造成热传导电子发热元件的小型蒸汽室包括平的密封外壳; 布置在平面密封壳体的内壁上的芯结构; 填充在平面密封壳体内的工作流体; 以及形成在所述蒸气室的一部分上的蒸发部。 蒸发部上的扁平密封壳体的外表面具有用于覆盖电子发热元件的凹部。 凹部与电子发热元件热接触。 通过这种布置,当紧凑的蒸气室与用于散热的电子发热元件热接触时,从紧凑的蒸气室突出的电子发热元件的距离减小,从而有助于电子的紧凑的设计 产品。 此外,本发明提供一种具有这种紧凑的蒸气室的散热模块。

    SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE
    28.
    发明申请
    SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE 有权
    太阳能发电系统与塔式热发电结构

    公开(公告)号:US20100242952A1

    公开(公告)日:2010-09-30

    申请号:US12411702

    申请日:2009-03-26

    IPC分类号: F24J2/08 F28F1/10

    摘要: A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs.

    摘要翻译: 应用塔式散热结构来散发太阳能发电系统的热量。 太阳能发电系统设置有具有用于将太阳光反射到太阳能电池的半球面的反射器。 散热结构包括导热板,板式热管和多个散热片。 导热板的一侧与太阳能电池连接,另一侧设置有用于嵌入板式热管的端部的凹槽。 散热翅片布置成与板式热管倾斜的角度,其能够促使间隙内的加热空气升高。 快速地进行热量以防止太阳能电池被过热破坏以降低维修成本。

    HEAT DISSIPATION DEVICE
    29.
    发明申请
    HEAT DISSIPATION DEVICE 有权
    散热装置

    公开(公告)号:US20100067194A1

    公开(公告)日:2010-03-18

    申请号:US12211957

    申请日:2008-09-17

    IPC分类号: H05K7/20

    摘要: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

    摘要翻译: 散热装置包括蒸气室,散热翅片组件,盖子和风扇。 蒸气室被构造成弯曲的形状。 散热翅片组件粘附在蒸气室的部分表面上。 盖子连接到蒸气平面。 流动通道限定在蒸气室和盖子之间。 散热片组件位于流路中。 盖子限定了与流动通道相通的开口。 风扇布置成面向盖的开口和蒸气室的其它部分表面。 因此,可以大大提高散热效率。

    COOLING MECHANISM FOR ELECTRONIC DEVICES
    30.
    发明申请
    COOLING MECHANISM FOR ELECTRONIC DEVICES 审中-公开
    电子设备冷却机构

    公开(公告)号:US20100065247A1

    公开(公告)日:2010-03-18

    申请号:US12211948

    申请日:2008-09-17

    IPC分类号: F28F7/00

    摘要: A cooling mechanism for cooling a enclosed cabinet of electronic device, which comprises a heat-conducting plate having accommodating grooves at one side. Vapor chambers disposed within accommodating grooves of the heat-conducting plate. And a cooling fin set which is arranged on an arbitrary side of the heat-conducting plate to compose a heat exchanger. Part of the heat exchanger is disposed outside of the cabinet to conduct heat inside of the cabinet to outside.

    摘要翻译: 一种用于冷却电子装置的封闭柜的冷却机构,其包括在一侧具有容纳槽的导热板。 设置在导热板的容纳槽内的蒸气室。 以及冷却翅片组,其布置在导热板的任意一侧以构成热交换器。 热交换器的一部分设置在机柜外部,以将柜内的热量传导到外部。