Abstract:
A circuit pattern surface curving in correspondence with the surface shape of a ball-like semiconductor device material such as a silicon ball is formed in a reticle. A resist-applied surface of the device material is so exposed as to move the ball-like semiconductor device material close to the circuit pattern surface. In this manner, a circuit pattern is formed on the surface of the ball-like device material.
Abstract:
A projection exposure apparatus for projecting a pattern formed on a first object such as a reticle upon a second object such as a semiconductor wafer by use of a projection lens system, is disclosed. In the apparatus, a light of a predetermined wavelength is used for the pattern projection, and a light having a different wavelength is used to align the first and second objects by way of the projection lens system. A dichroic mirror film is disposed inclinedly between the first object and the projection lens system so as to reflect one of the light of the predetermined wavelength and the light of the different wavelength, and also to transmit the other. By this dichroic mirror film, the light used for the alignment and reflected back from the second object is extracted out of a light path between the first and second objects. After correcting effects of chromatic aberrations of the projection lens system with respect to the different wavelength, the light for the alignment is passed through the first object. By this, accurate alignment using the light of a wavelength different from that to be used for the pattern projection, is made practically attainable. Also, use of lights of different wavelengths, other than the wavelength to be used for the pattern projection, is made practically attainable. Thus, accurate and stable alignment is attainable regardless of the configuration of the mark provided on the second object.
Abstract:
Disclosed is an apparatus for inspecting negatives which is provided with a laser beam generating source, a scanner for scanning the laser beam, a holding device for holding a negative having a pattern formed in a reflective area on a first surface of a transparent plate and transferring the negative in a direction perpendicular to the scanning direction of the laser beam, a first converging lens for converging the laser beam on said first surface, a second converging lens for converging on a first photocell the beam transmitted through the negative, a third converging lens for converging on a second photocell the beam reflected by the first surface of the negative, and a comparator for comparing a first signal stream put out from the first photocell and a second signal stream put out from the second photocell and detecting an undesirable adhering matter.
Abstract:
There is provided an imprint apparatus configured to perform an imprint in which a resin on a substrate is molded using a mold and a pattern is formed on the substrate. The apparatus includes a press unit configured to press the resin on the substrate and the mold to each other, a cure unit configured to irradiate light to the resin molded by the mold to cure the resin, and a movement unit configured to move the mold and the substrate, from a position at which the press is performed by the press unit to a position at which the light is irradiated by the cure unit, and from the position at which the light is irradiated by the cure unit to a position at which the mold is released.
Abstract:
An imprint apparatus for performing alignment between a mold and a substrate and imprinting a pattern of the mold to a layer of the substrate. A holder holds the mold. A stage holds the substrate opposite to the mold held by the holder. A microscope, including an image pickup device, detects a first alignment mark formed in the mold, via a first image pickup area of the image pickup device, and detects a second alignment mark formed in the substrate, via a second image pickup area of the image pickup device. The first and second image pickup areas do not overlap with each other. A contrast of signals obtained by the image pickup device is adjusted with respect to each of the first and second image pickup areas, and the alignment is performed by changing relative positions of the holder and the stage based on first information about a deviation of the detected first alignment mark from a predetermined position in the first image pickup area and second information about a deviation of the detected second alignment mark from a predetermined position in the second image pickup area.
Abstract:
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
Abstract:
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
Abstract:
A light transmissive mold used for imprinting a pattern onto a material applied on a semiconductor workpiece. The mold includes a first surface having an area of a pattern to be imprinted onto the material, a second surface located opposite from the first surface, and a third surface disposed between the first surface and the second surface, at a position inwardly away from the first surface. The third surface is arranged opposite to an area of the workpiece subjected to dicing. An alignment structure, provided for alignment between the mold and the workpiece, is formed in the third surface.
Abstract:
A pattern transfer apparatus transfers an imprint pattern formed on a mold, provided with an alignment mark, to a resin material on a substrate, provided with an alignment mark. A first image pickup device obtains an image of an object positioned at a first object position. A second image pickup device obtains an image of an object positioned at a second object position. The second object position is more distant from the alignment mark of the mold than the first object position. An optical system forms an image of an object positioned at the first object position and an image of an object positioned at the second object position. Alignment is performed based on first and second information obtained about positions of images of an alignment mark of a reference substrate and an alignment mark of the substrate, to transfer the imprinting pattern to the resin material.
Abstract:
An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.