公开(公告)号：US11482455B2

公开(公告)日：2022-10-25

申请号：US16632298

申请日：2018-07-18

Applicant: IWATANI CORPORATION ,  HAMAMATSU PHOTONICS K.K.

Inventor： Toshiki Manabe ,  Takehiko Senoo ,  Koichi Izumi ,  Tadashi Shojo ,  Takafumi Ogiwara ,  Takeshi Sakamoto

IPC: H01L21/78 ,  B23K26/0622 ,  B23K26/364 ,  B23K26/53 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  B23K26/402 ,  H01L21/268 ,  H01L21/3065 ,  B23K103/00 ,  B23K101/40

Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

公开(公告)号：US20210367351A1

公开(公告)日：2021-11-25

申请号：US17429850

申请日：2020-02-12

Applicant: The University of Tokyo ,  IWATANI CORPORATION

Inventor： Shin-ichi Ohkoshi ,  Marie Yoshikiyo ,  Asuka Namai ,  Masayuki Asanuma ,  Yukihiro Shibuya ,  Sumire Yamazaki ,  Naomasa Ueda

IPC: H01Q17/00 ,  H01Q1/50

Abstract: A circuit substrate includes a multi-layer substrate in which a plurality of dielectric layers are stacked, and a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz. An antenna element includes the circuit substrate described above, a power feeder provided inside the multi-layer substrate of the circuit substrate, and an antenna provided on a surface of the circuit substrate and connected to the power feeder. A method for reducing noise in a circuit substrate including a multi-layer substrate includes, by a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz, absorbing unnecessary electromagnetic waves diffused in the multi-layer substrate to reduce noise in the circuit substrate.

公开(公告)号：US11130092B2

公开(公告)日：2021-09-28

申请号：US16092016

申请日：2017-03-03

Applicant: IWATANI CORPORATION

Inventor： Sadaki Nakamura ,  Koichi Izumi ,  Naohisa Makihira

IPC: B01D53/053 ,  C01B13/10 ,  B01D53/04

Abstract: Provided is method for concentrating ozone gas the method including the steps of: allowing ozone gas to be adsorbed onto the adsorbent by introducing ozone gas-containing raw material mixed gas into an adsorption vessel (20) that houses an adsorbent for adsorbing ozone gas; reducing a pressure in a concentration vessel (30) in a state where the concentration vessel (30) does not communicate with the adsorption vessel (20), the concentration vessel (30) being configured to be connected to the adsorption vessel (20) so as to be interswitchable between a state where the concentration vessel (30) communicates with the adsorption vessel (20) and a state where the concentration vessel does not communicate with the adsorption vessel (20); and introducing concentrated mixed gas including ozone gas with a higher ozone gas concentration than the ozone gas concentration in the raw material mixed gas into the concentration vessel (30) by desorbing the ozone gas adsorbed onto the adsorbent using a pressure difference between the internal pressure of the concentration vessel (30) and an internal pressure of the adsorption vessel (20) in a state where the concentration vessel (30) having a reduced internal pressure communicates with the adsorption vessel (20) that houses the adsorbent onto which the ozone gas is adsorbed, and delivering the desorbed ozone gas into the concentration vessel (30). Also provided is an apparatus (1) for concentrating ozone gas for implementing the method.

公开(公告)号：US20200239995A1

公开(公告)日：2020-07-30

申请号：US16652982

申请日：2018-07-27

Applicant: IWATANI CORPORATION

Inventor： Koichi IZUMI ,  Masahiro FURUTANI ,  Tsuyoshi YAMAMOTO

IPC: C23C8/14

Abstract: A method for treating an inner wall surface of a treatment object uses a treatment object that is at least one of a container housing an ozone gas, a treatment container housing an object to be subjected to a surface treatment using an ozone gas and a pipe configured to supply an ozone gas. The method for treating an inner wall surface of a treatment object includes the steps of: determining whether an abnormal part is present in the inner wall surface of the treatment object or not; and distributing an ozone gas having a concentration of 10% by volume or more and 30% by volume or less and a temperature of 60° C. or less such that the ozone gas contacts the inner wall surface of the treatment object before the step of determining whether an abnormal part is present or not.

公开(公告)号：USD809343S1

公开(公告)日：2018-02-06

申请号：US35501949

申请日：2016-05-25

Applicant: IWATANI CORPORATION

Designer： Hiroaki Kotani

公开(公告)号：US09841143B2

公开(公告)日：2017-12-12

申请号：US14789122

申请日：2015-07-01

Applicant: IWATANI CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Yoshihiro Hori ,  Yuu Matsuno ,  Hiroaki Nemoto ,  Hideyo Omori ,  Toshiyuki Kondo

IPC: F17C5/04

CPC classification number: F17C5/04 ,  Y02E60/321

Abstract: A suction method that sucks inside of a filling nozzle used for supply of hydrogen by using a suction nozzle that is engaged with the filling nozzle, the suction method comprising: evacuating a vacuum chamber by using a vacuum pump; and sucking inside of the suction nozzle by using the evacuated vacuum chamber.

公开(公告)号：US20170268965A1

公开(公告)日：2017-09-21

申请号：US15617497

申请日：2017-06-08

Applicant: Iwatani Corporation

Inventor： Kazuto MATSUMOTO ,  Shinichi OMOTEDA ,  Ken NISHIDA ,  Goichi INOUE

IPC: G01N1/22 ,  G01N33/00

CPC classification number: G01N1/2226 ,  F17C13/00 ,  G01N33/0016 ,  G01N2001/2238

Abstract: A sampling apparatus includes a pressure-reducing safety unit, which includes a device accommodation chamber that accommodates safety devices and a cylinder connection chamber, and a cylinder unit. The cylinder unit removably accommodates a cylinder, excluding an exposed portion where a front end portion of the cylinder, a mouthpiece, and a cylinder on-off valve are exposed, in an openable/closable casing. The exposed portion of the cylinder is formed so as to be insertable from the open surface portion of the cylinder connection chamber into the cylinder connection chamber, the mouthpiece of the cylinder and a hydrogen outlet of a supply pipe of the device accommodation chamber are connected by using a flexible hose, and thereby a sample of hydrogen gas is taken into the cylinder.

公开(公告)号：US09425071B2

公开(公告)日：2016-08-23

申请号：US14698273

申请日：2015-04-28

Applicant: TOKYO ELECTRON LIMITED ,  IWATANI CORPORATION

Inventor： Kazuo Yabe ,  Akira Shimizu ,  Koichi Izumi ,  Masahiro Furutani

IPC: H01L21/02 ,  H01L21/67 ,  C23C16/40 ,  C23C16/455

CPC classification number: H01L21/67017 ,  C23C16/402 ,  C23C16/45534 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02219 ,  H01L21/02236 ,  H01L21/0228

Abstract: A film forming method for obtaining a thin film by laminating molecular layers of oxide on a surface of a substrate in a vacuum atmosphere includes performing a cycle a plurality of times. The cycle includes: supplying a source gas containing a source to the substrate in a vacuum vessel to adsorb the source onto the substrate; forming an ozone atmosphere containing ozone having a concentration not less than that where a chain decomposition reaction is caused in the vacuum vessel; and forcibly decomposing the ozone by supplying energy to the ozone atmosphere to generate active species of oxygen, and oxidizing the source adsorbed onto the surface of the substrate by the active species to obtain the oxide.

Abstract translation: 通过在真空气氛中层叠基板的表面上的氧化物的分子层来获得薄膜的成膜方法包括进行多次循环。 该循环包括：在真空容器中将含有源的源气体供应到衬底以将源吸附到衬底上; 形成含有浓度不低于在真空容器中引起链分解反应的臭氧的臭氧的臭氧气氛; 通过向臭氧气氛供给能量而强制分解臭氧，生成活性物质的氧，并且通过活性种氧化吸附在基材表面上的源，得到氧化物。

公开(公告)号：USD720181S1

公开(公告)日：2014-12-30

申请号：US29481790

申请日：2014-02-10

Applicant: Iwatani Corporation

Designer： Kenichiro Inada

公开(公告)号：US20190111379A1

公开(公告)日：2019-04-18

申请号：US16092016

申请日：2017-03-03

Applicant: IWATANI CORPORATION

Inventor： Sadaki NAKAMURA ,  Koichi IZUMI ,  Naohisa MAKIHIRA

IPC: B01D53/053 ,  C01B13/10 ,  B01D53/04

Abstract: Provided is method for concentrating ozone gas the method including the steps of: allowing ozone gas to be adsorbed onto the adsorbent by introducing ozone gas-containing raw material mixed gas into an adsorption vessel (20) that houses an adsorbent for adsorbing ozone gas; reducing a pressure in a concentration vessel (30) in a state where the concentration vessel (30) does not communicate with the adsorption vessel (20), the concentration vessel (30) being configured to be connected to the adsorption vessel (20) so as to be interswitchable between a state where the concentration vessel (30) communicates with the adsorption vessel (20) and a state where the concentration vessel does not communicate with the adsorption vessel (20); and introducing concentrated mixed gas including ozone gas with a higher ozone gas concentration than the ozone gas concentration in the raw material mixed gas into the concentration vessel (30) by desorbing the ozone gas adsorbed onto the adsorbent using a pressure difference between the internal pressure of the concentration vessel (30) and an internal pressure of the adsorption vessel (20) in a state where the concentration vessel (30) having a reduced internal pressure communicates with the adsorption vessel (20) that houses the adsorbent onto which the ozone gas is adsorbed, and delivering the desorbed ozone gas into the concentration vessel (30). Also provided is an apparatus (1) for concentrating ozone gas for implementing the method.