Abstract:
A CMOS semiconductor product employs a first doped well of a first polarity and a second doped well of a second polarity opposite the first polarity, each formed laterally separated within a semiconductor substrate. The first doped well is further embedded within a third doped well of the second polarity that further separates the first doped well from the second doped well. The third doped well provides latch-up resistance for a pair of MOS transistors formed within the first doped well and the second doped well.
Abstract:
The invention describes structures and a process for providing ESD protection between multiple power supply lines or buses on an integrated circuit chip. Special diode strings are used for the protection devices whereby the diodes are constructed across the boundary of an N-well and P substrate or P-well. The unique design provides very low leakage characteristics during normal circuit operation, as well as improved trigger voltage control achieved by stacking 2 or more diodes in a series string between the power buses.
Abstract:
A multi-level metal interconnect structure and method for forming the same for improving a resistance of CMOS transistors to electrostatic discharge (ESD) transient events is disclosed. A semiconductor device including at least one NMOS transistor electrically connected along at least one circuit pathway to an input/output signal source and a reference voltage potential; and, electrically connecting at least the input/output signal source to the at least one NMOS transistor with a metal interconnect line extended in length by compacting at least a portion of the metal interconnect line length portion into a serpentine shape within a predetermined volume of the semiconductor device.
Abstract:
A decoupling capacitor with increased resistance to electrostatic discharge (ESD) is provided on an integrated circuit (IC). The capacitor may be single or multi-fingered. In one example, the capacitor includes first and second electrodes separated by a dielectric material, a source positioned proximate to the first electrode, and a floating drain positioned proximate to the first electrode and separated from the source by the first electrode. A parasitic element, modeled as a bipolar junction transistor (BJT), is formed by current interactions between the source, the floating drain, and a doped area. The floating drain provides a constant potential region at the base of the BJT, which minimizes ESD damage to the IC.
Abstract:
A low capacitance ESD protection device. The device comprises a substrate, a well of a first conductivity type in the substrate, a first and second transistor of the first conductivity type respectively on two sides of the well, a guard ring of a second conductivity type in the substrate, surrounding the well, and the first and second transistor, and a doped region of the second conductivity type in the well, wherein profiles of a drain and source region of each of the first and second transistor are un-symmetrical, and an area of the drain region is smaller than that of the source region in each of the first and second transistor.
Abstract:
The present invention provides an ESD protection component, comprising at least two MOS field effect transistors (FETs) of a first conductivity type and a first well having a first conductivity type. The two MOS FETs have two parallel gates formed on a first semiconductive layer having a second conductivity type. The first well formed on the first semiconductive layer is comprised of a connecting area formed between the MOS FETs, two parallel extension areas formed perpendicular to the gates of the MOS FETs, and a first doping area of the second conductivity type formed in the connecting area. Two SCR are formed with drains of the MOS FETs, the first semiconductive layer, the first well and the first doping region. With the combination of the SCR and NMOS FET, ESD protection efficiency can be substantially enhanced.
Abstract:
An integrated circuit voltage excursion protection apparatus and method are disclosed for sensing voltage excursions at points on the integrated circuit and utilizes the output drivers of the I/O section of the integrated circuit to dissipate charge from such events. The apparatus may be used alone or in conjunction with other conventional dissipation apparatus.
Abstract:
A new electrostatic discharge protection device is achieved. A p-well region is in a semiconductor substrate. An n+ region in the p-well region is connected to a first voltage supply. An n-well region in the p-well region is spaced from the n+ region such that a depletion region will extend therebetween during normal operation. A p+ region in the n-well region is connected to a second voltage supply of greater value than the first voltage supply during normal operation. Current is conducted through the n+ region to the p+ region during an electrostatic discharge event.
Abstract:
This invention provides a circuit and a method for protecting electronic circuits from electrostatic damage ESD. The invention teaches a dynamic floating silicon-controlled rectifier SCR for use as an ESD clamp. The n-well of the SCR is biased to the supply voltage Vdd under normal conditions to provide good latch-up performance. During ESD events, the n-well is floated to improve clamping performance. In addition, this invention utilizes a floating-well control circuit which provides better latch-up immunity during normal operation after the ESD event has passed.
Abstract:
A dynamic source coupled ESD protection circuit that dissipates an ESD voltage coupled to an electrical contact pad to protect internal circuits on an integrated circuits chip is described. The ESD protection circuit lowers the snapback voltage of the ESD protection circuit to allow a thinner gate oxide within the internal circuits of the integrated circuit chip. The dynamic substrate coupled electrostatic discharge protection circuit consists of a gated MOS transistor, a capacitor, and a resistor. The gated MOS transistor has a drain region connected to the electrical contact pad. The gate and source are connected to a power supply voltage source. The power supply voltage source will either be a substrate biasing voltage or ground reference point for a gated NMOS transistor. The power supply voltage source will be the power supply voltage source VDD for the gated PMOS transistor. The capacitor has a first plate connected to the electrical contact pad, and a second plate connected to said substrate bulk region of the MOS transistor. The resistor is a polycrystalline silicon resistor that is connected between the second plate of the capacitor and the power supply voltage source.