Abstract:
Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
Abstract:
An exemplary embodiment of the present invention discloses a light emitting diode including a substrate having a first edge and a second edge opposite to each other, a light emitting structure disposed on the substrate, the light emitting structure including a first semiconductor layer and a second semiconductor layer, a plurality of first electrode pads arranged on an upper surface of the first semiconductor layer, the first electrode pads arranged in a vicinity of the first edge, a plurality of second electrode pads arranged on the second semiconductor layer, the second electrode pads arranged in a vicinity of the second edge, a plurality of first extensions, each first extension extending from a first electrode pad, and a plurality of second extensions, each second extension extending from a second electrode pad. The first extensions include intrusion parts extending in a direction from the first edge to the second edge, wherein the intrusion parts are spaced apart from each other and not connecting with the second electrode pads. Further, the second extensions include intrusion parts extending in a direction from the second edge to the first edge, wherein the first extension intrusion parts each extend into a region between two of the second extension intrusion parts.
Abstract:
An apparatus and method are provided for transmitting data in a station of a wireless local area network (LAN) system. In the apparatus, a data queue stores transmission data, and a data processor processes data output from the data queue. A radio frequency (RF) module up-converts a signal output from the data processor to a frequency band of the wireless LAN system, and transmits the up-converted signal as an RF signal. A scheduler performs scheduling such that a specific stepping index decreases each time a backoff time reaches ‘0’ so as to determine whether to transmit the data, and the data is transmitted when both the stepping index and the backoff time reach ‘0’. A backoff stepping generator determines an initial value of the stepping index within a predetermined range.
Abstract:
An apparatus for embolic treatment including a high frequency power source and at least one induction coil connected to the high frequency power source which is positioned around the vicinity of diseased vasculature of the body of a patient for generating an eddy current in the metallic coil inserted into the vascular malformation of the diseased vasculature. The eddy current in the metallic coil generates heat which coagulates and contracts the vascular malformation.