公开(公告)号：US08189051B2

公开(公告)日：2012-05-29

申请号：US11933335

申请日：2007-10-31

申请人： Ming-Yu Shih ,  Bwo-Chau Fu

发明人： Ming-Yu Shih ,  Bwo-Chau Fu

IPC分类号： H04N5/225

CPC分类号： G06T7/215 ,  G06T2207/10016 ,  G06T2207/30232

摘要： Disclosed is a moving object detection apparatus and method by using optical flow analysis. The apparatus includes four modules of image capturing, image aligning, pixel matching, and moving object detection. Plural images are successively inputted under a camera. Based on neighboring images, frame relationship on the neighboring images is estimated. With the frame relationship, a set of warping parameter is further estimated. Based on the wrapping parameter, the background areas of the neighboring images are aligned to obtain an aligned previous image. After the alignment, a corresponding motion vector for each pixel on the neighboring images is traced. The location in the scene of the moving object can be correctly determined by analyzing all the information generated from the optical flow.

摘要翻译： 公开了使用光流分析的移动物体检测装置和方法。 该装置包括图像捕获，图像对准，像素匹配和移动物体检测的四个模块。 在相机下连续输入多张图像。 基于相邻图像，估计相邻图像上的帧关系。 利用帧关系，进一步估计一组翘曲参数。 基于包装参数，相邻图像的背景区域对准以获得对准的先前图像。 在对准之后，跟踪相邻图像上的每个像素的对应的运动矢量。 可以通过分析从光流产生的所有信息来正确地确定移动物体的场景中的位置。

公开(公告)号：US20110275180A1

公开(公告)日：2011-11-10

申请号：US13113051

申请日：2011-05-22

申请人： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

发明人： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC分类号： H01L21/60

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 一种制造半导体芯片组件的方法包括提供柱，基底，支撑层和底层，其中柱延伸到基底之上，并且支撑层夹在基底和底层之间，将粘合剂安装在基底上，包括 将所述柱插入所述粘合剂的开口中，将导电层安装在所述粘合剂上，包括使所述柱与所述导电层中的孔对准，然后使所述粘合剂在所述柱和所述导电层之间向上流动，使所述粘合剂固化， 轨迹，其包括衬垫，端子和导电层的选定部分，提供包括柱，基底，底层的散热器和从基底穿过支撑层延伸到底层的热通孔，然后安装 在该柱上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到第二半导体器件 e散热器。