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    Microelectromechnical system for tilting a platform
    21.
    发明授权
    Microelectromechnical system for tilting a platform 有权
    用于倾斜平台的微机电系统

    公开(公告)号：US06794793B2

    公开(公告)日：2004-09-21

    申请号：US09966963

    申请日：2001-09-27

    Applicant: Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    Inventor： Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    IPC: H02N100

    CPC classification number: B81B3/0062 ,  B33Y80/00 ,  H02N1/006 ,  H02N1/008

    Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts. Upon pivoting, the A-frame structures (40) act as lever arms to both lift the platform (14) and tilt the platform (14) with respect to the substrate (12) with at least one degree of freedom. Since the platform (14) lifts up from the surface of the substrate (12), it may be tilted at large angles with respect to the substrate (12).

    Abstract translation: 本发明提供了一种具有平台（14）的MEM系统（10），该平台可从其上制造并可相对于基板（12）的一个或多个自由度倾斜的基板（12）升高， 。 在一个实施例中，MEM系统（10）包括平台（14），一对A框架结构（40）和形成在基板（12）上的两对致动器（30）。 从A框架结构（40）的顶点（40A）延伸的刚性构件（46）的端部（46A）通过柔性构件（48A，48B）附接到平台（14）。 平台（14）也通过顺应构件（48C）附接到基板（12）。 A框架结构（40）可以围绕其基部（40B）分开枢转。 每对致动器（30）通过轭（32）和位移乘法器（34）耦合到A框架结构（40）中的一个，并且可单独地操作以实现A框架结构（40）相对于 通过相等或不相等的角度量到基板（12）。 在枢转时，A框架结构（40）用作杠杆臂，以提升平台（14）并且以至少一个自由度相对于基板（12）倾斜平台（14）。 由于平台（14）从基板（12）的表面上升，所以可以相对于基板（12）以大的角度倾斜。

    Method for tiling unit cells
    22.
    发明授权
    Method for tiling unit cells 有权
    平铺单元格的方法

    公开(公告)号：US06706619B2

    公开(公告)日：2004-03-16

    申请号：US10099140

    申请日：2002-03-16

    Applicant: Samuel Lee Miller ,  Murray Steven Rodgers

    Inventor： Samuel Lee Miller ,  Murray Steven Rodgers

    IPC: H01L21301

    CPC classification number: H01L21/302 ,  B81B7/0006 ,  B81B7/04

    Abstract: A method for creating a layout of at least a portion of a microelectromechanical system is disclosed. In one embodiment, a plurality of die are formed on a wafer. Each die includes a plurality of rows of a plurality of mirror assemblies, a plurality of off-chip electrical contacts, and an electrical trace bus that is disposed between adjacent pairs of rows. This electrical trace bus is electrically interconnected with mirror assemblies in at least one of the rows. A plurality of these die are formed on a wafer. A chip is separated from the wafer such that a chip width is an integer multiple of the die width and such that a chip height is an integer number of the rows of mirror assemblies without requiring the chip height to be an integer multiple of the die height.

    Abstract translation: 公开了一种用于创建微机电系统的至少一部分的布局的方法。 在一个实施例中，在晶片上形成多个管芯。 每个管芯包括多行多个反射镜组件，多个片外电触点和布置在相邻的行对之间的电迹线总线。 该电迹线总线与至少一行中的反射镜组件电互连。 多个这些管芯形成在晶片上。 芯片与晶片分离，使得芯片宽度是芯片宽度的整数倍，并且使得芯片高度是整数行的反射镜组件，而不需要芯片高度为模具高度的整数倍 。

    Particle filter for partially enclosed microelectromechanical systems
    24.
    发明授权
    Particle filter for partially enclosed microelectromechanical systems 失效

    公开(公告)号：US06703675B1

    公开(公告)日：2004-03-09

    申请号：US10224179

    申请日：2002-08-20

    Applicant: Murray Steven Rodgers

    Inventor： Murray Steven Rodgers

    IPC: H01L2982

    CPC classification number: B81B7/0012

    Abstract: A particle filter for a partially enclosed microelectromechanical systems that include a substrate material having at least one micro-device formed thereon. The particle filter includes a first structural layer forming a filter bottom and a second structural layer forming a filter wall. The filter bottom and filter wall are interconnected by at least one support feature to define a particle trap between the filter wall and filter bottom. The particle trap is a gap formed by mating, but non-interconnected portions of the filter wall and filter bottom that operates to trap and prevent particles from passing beyond the filter bottom into the microelectromechanical system.

    Multi-level shielded multi-conductor interconnect bus for MEMS
    27.
    发明授权
    Multi-level shielded multi-conductor interconnect bus for MEMS 有权
    用于MEMS的多层屏蔽多导体互连总线

    公开(公告)号：US06747340B2

    公开(公告)日：2004-06-08

    申请号：US10099720

    申请日：2002-03-15

    Applicant: Stephen Matthew Barnes ,  Samuel Lee Miller ,  Murray Steven Rodgers

    Inventor： Stephen Matthew Barnes ,  Samuel Lee Miller ,  Murray Steven Rodgers

    IPC: H01L23552

    CPC classification number: H01L23/5225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

    Abstract translation: 公开了一种用于将MEM器件与控制信号源互连的多电平屏蔽多导体互连总线和制造多电平屏蔽多导体互连总线的方法。 在一个实施例中，形成在衬底（20）上的多级屏蔽互连总线（410A）包括第一和第二级导电线（42,92），其布置成在第一和第二级之间的一条，两条或更多条导线 导电屏蔽壁（46,66,96）。 第一和第二级导电线（42,92）被各种介电材料层（30,50,80,100）包围。 第一级导电屏蔽（78）覆盖在第一级导电线（42）和屏蔽壁（46,66）之间。 第二级导电屏蔽（112）覆盖在第二级导电线（92）和屏蔽壁（96）上。

    Interconnect bus crossover for MEMS
    28.
    发明授权
    Interconnect bus crossover for MEMS 有权
    用于MEMS的互连总线交叉

    公开(公告)号：US06727436B2

    公开(公告)日：2004-04-27

    申请号：US10098886

    申请日：2002-03-15

    Applicant: Stephen Matthew Barnes ,  Murray Steven Rodgers

    Inventor： Stephen Matthew Barnes ,  Murray Steven Rodgers

    IPC: H05K103

    CPC classification number: B81B7/0006 ,  H01L23/5225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

    Abstract translation: 公开了一种用于将MEM器件与控制信号源等互连有用的屏蔽互连总线交叉和制造这种屏蔽互连总线交叉的方法。 在一个实施例中，屏蔽互连总线跨接器（10）包括多个基座（44A-C）和从基座（44A-C）向上延伸穿过形成在互连总线中的孔的多个支撑柱 覆盖多个互连总线（42）的屏蔽（78）。 支撑柱（74）在互连总线屏蔽（78）上方以间隔的关系支撑双层升高的交叉线（92/112）。 两层升高的交叉线（92/112）横向于互连总线（42）的方向定向并且位于两层矩形交叉线屏蔽壁（96/116）的周边内。

    Electrically isolated support for overlying MEM structure
    29.
    发明授权
    Electrically isolated support for overlying MEM structure 有权

    公开(公告)号：US06700173B1

    公开(公告)日：2004-03-02

    申请号：US10224207

    申请日：2002-08-20

    Applicant: Murray Steven Rodgers

    Inventor： Murray Steven Rodgers

    IPC: H01L2982

    CPC classification number: B81B7/0012

    Abstract: MEM devices are fabricated with integral dust covers, cover support posts and particle filters for reduced problems relating to particle contamination. In one embodiment, a MEM device (10) includes an electrostatic actuator (12) that drives a movable frame (14), a displacement multiplier (16) for multiplying or amplifying the displacement of the movable frame (14), and a displacement output element (18) for outputting the amplified displacement. The actuator (12) is substantially encased within a housing formed by a cover (36) and related support components disposed between the cover (36) and the substrate (38). Electrically isolated support posts may be provided in connection with actuator electrodes to prevent contact between the cover and the underlying electrodes. Such a support post may also incorporate an electric filter element for filtering undesired components from a drive signal. Particle filters may be provided in connection with etch release holes or other openings in order to further protect against particle contamination.

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