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    Microelectromechnical system for tilting a platform
    4.
    发明授权
    Microelectromechnical system for tilting a platform 有权
    用于倾斜平台的微机电系统

    公开(公告)号：US06847152B2

    公开(公告)日：2005-01-25

    申请号：US10697385

    申请日：2003-10-30

    Applicant: Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    Inventor： Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    IPC: B81B3/00 ,  H02N1/00 ,  G02B26/08 ,  G02B26/10

    CPC classification number: B81B3/0062 ,  B33Y80/00 ,  H02N1/006 ,  H02N1/008

    Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts. Upon pivoting, the A-frame structures (40) act as lever arms to both lift the platform (14) and tilt the platform (14) with respect to the substrate (12) with at least one degree of freedom. Since the platform (14) lifts up from the surface of the substrate (12), it may be tilted at large angles with respect to the substrate (12).

    Abstract translation: 本发明提供了一种具有平台（14）的MEM系统（10），该平台可从其上制造并可相对于基板（12）的一个或多个自由度倾斜的基板（12）升高， 。 在一个实施例中，MEM系统（10）包括平台（14），一对A框架结构（40）和形成在基板（12）上的两对致动器（30）。 从A框架结构（40）的顶点（40A）延伸的刚性构件（46）的端部（46A）通过柔性构件（48A，48B）附接到平台（14）。 平台（14）也通过顺应构件（48C）附接到基板（12）。 A框架结构（40）可以围绕其基部（40B）分开枢转。 每对致动器（30）通过轭（32）和位移乘法器（34）耦合到A框架结构（40）中的一个，并且可单独地操作以实现A框架结构（40）相对于 通过相等或不相等的角度量到基板（12）。 在枢转时，A框架结构（40）用作杠杆臂，以提升平台（14）并且以至少一个自由度相对于基板（12）倾斜平台（14）。 由于平台（14）从基板（12）的表面上升，所以可以相对于基板（12）以大的角度倾斜。

    Micromechanical platform pivotal on a compliant member
    5.
    发明授权
    Micromechanical platform pivotal on a compliant member 有权
    微机械平台在合规成员上枢转

    公开(公告)号：US06774535B2

    公开(公告)日：2004-08-10

    申请号：US10697348

    申请日：2003-10-30

    Applicant: Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    Inventor： Samuel Lee Miller ,  Murray Steven Rodgers ,  Stephen Matthew Barnes ,  Jeffry Joseph Sniegowski ,  Paul Jackson McWhorter

    IPC: G02B2608

    CPC classification number: B81B3/0062 ,  B33Y80/00 ,  H02N1/006 ,  H02N1/008

    Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts. Upon pivoting, the A-frame structures (40) act as lever arms to both lift the platform (14) and tilt the platform (14) with respect to the substrate (12) with at least one degree of freedom. Since the platform (14) lifts up from the surface of the substrate (12), it may be tilted at large angles with respect to the substrate (12).

    Abstract translation: 本发明提供了一种具有平台（14）的MEM系统（10），该平台可从其上制造并可相对于基板（12）的一个或多个自由度倾斜的基板（12）升高， 。 在一个实施例中，MEM系统（10）包括平台（14），一对A框架结构（40）和形成在基板（12）上的两对致动器（30）。 从A框架结构（40）的顶点（40A）延伸的刚性构件（46）的端部（46A）通过柔性构件（48A，48B）附接到平台（14）。 平台（14）也通过顺应构件（48C）附接到基板（12）。 A框架结构（40）可以围绕其基部（40B）分开枢转。 每对致动器（30）通过轭（32）和位移乘法器（34）耦合到A框架结构（40）中的一个，并且可单独地操作以实现A框架结构（40）相对于 通过相等或不相等的角度量到基板（12）。 在枢转时，A框架结构（40）用作杠杆臂，以提升平台（14）并且以至少一个自由度相对于基板（12）倾斜平台（14）。 由于平台（14）从基板（12）的表面上升，所以可以相对于基板（12）以大的角度倾斜。

    Shielded multi-conductor interconnect bus for MEMS
    6.
    发明授权
    Shielded multi-conductor interconnect bus for MEMS 有权
    用于MEMS的屏蔽多导体互连总线

    公开(公告)号：US06731513B2

    公开(公告)日：2004-05-04

    申请号：US10099724

    申请日：2002-03-15

    Applicant: Murray Steven Rodgers ,  Stephen Matthew Barnes

    Inventor： Murray Steven Rodgers ,  Stephen Matthew Barnes

    IPC: H05K702

    CPC classification number: B81B7/0006 ,  G02B26/0841 ,  H01L23/147 ,  H01L23/49872 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources or the like and a method of fabricating a shielded multi-conductor interconnect bus are disclosed. In one embodiment, a shielded interconnect bus formed on a substrate (20) includes a plurality of electrically conductive lines (42) arranged in sets of one, two or more conductive lines between electrically conductive shield walls (46, 66). The electrically conductive lines (42) are surrounded by layers of dielectric material (30, 50). An electrically conductive shield (78) overlies the electrically conductive lines (42) and electrically conductive shield walls (46, 66).

    Abstract translation: 公开了一种用于将MEM器件与控制信号源等互连的屏蔽多导体互连总线以及制造屏蔽多导体互连总线的方法。 在一个实施例中，形成在衬底（20）上的屏蔽互连总线包括在导电屏蔽壁（46,66）之间布置成一组，两根或多根导电线的多个导电线（42）。 导电线（42）被介电材料层（30,50）包围。 导电屏蔽（78）覆盖在导电线（42）和导电屏蔽壁（46,66）之间。

    Multi-level shielded multi-conductor interconnect bus for MEMS
    8.
    发明授权
    Multi-level shielded multi-conductor interconnect bus for MEMS 有权
    用于MEMS的多层屏蔽多导体互连总线

    公开(公告)号：US06747340B2

    公开(公告)日：2004-06-08

    申请号：US10099720

    申请日：2002-03-15

    Applicant: Stephen Matthew Barnes ,  Samuel Lee Miller ,  Murray Steven Rodgers

    Inventor： Stephen Matthew Barnes ,  Samuel Lee Miller ,  Murray Steven Rodgers

    IPC: H01L23552

    CPC classification number: H01L23/5225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

    Abstract translation: 公开了一种用于将MEM器件与控制信号源互连的多电平屏蔽多导体互连总线和制造多电平屏蔽多导体互连总线的方法。 在一个实施例中，形成在衬底（20）上的多级屏蔽互连总线（410A）包括第一和第二级导电线（42,92），其布置成在第一和第二级之间的一条，两条或更多条导线 导电屏蔽壁（46,66,96）。 第一和第二级导电线（42,92）被各种介电材料层（30,50,80,100）包围。 第一级导电屏蔽（78）覆盖在第一级导电线（42）和屏蔽壁（46,66）之间。 第二级导电屏蔽（112）覆盖在第二级导电线（92）和屏蔽壁（96）上。

    Interconnect bus crossover for MEMS
    9.
    发明授权
    Interconnect bus crossover for MEMS 有权
    用于MEMS的互连总线交叉

    公开(公告)号：US06727436B2

    公开(公告)日：2004-04-27

    申请号：US10098886

    申请日：2002-03-15

    Applicant: Stephen Matthew Barnes ,  Murray Steven Rodgers

    Inventor： Stephen Matthew Barnes ,  Murray Steven Rodgers

    IPC: H05K103

    CPC classification number: B81B7/0006 ,  H01L23/5225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).

    Abstract translation: 公开了一种用于将MEM器件与控制信号源等互连有用的屏蔽互连总线交叉和制造这种屏蔽互连总线交叉的方法。 在一个实施例中，屏蔽互连总线跨接器（10）包括多个基座（44A-C）和从基座（44A-C）向上延伸穿过形成在互连总线中的孔的多个支撑柱 覆盖多个互连总线（42）的屏蔽（78）。 支撑柱（74）在互连总线屏蔽（78）上方以间隔的关系支撑双层升高的交叉线（92/112）。 两层升高的交叉线（92/112）横向于互连总线（42）的方向定向并且位于两层矩形交叉线屏蔽壁（96/116）的周边内。

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