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公开(公告)号：US07059036B2
公开(公告)日：2006-06-13
申请号：US11109739
申请日：2005-04-20
IPC分类号： H05K13/04
CPC分类号： H05K13/0409 , Y10S29/044 , Y10T29/4913 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.
摘要翻译： 一种电子部件安装装置，其采用与花键轴的一端部的空气通路连接的第一空气供给装置和与所述花键轴的另一端附近的所述空气通路连接的第二供气装置。 第一和第二空气进料用于向空气通道供应空气以将其内部返回到大气压力。 通过使用两个单独的空气进料，可以缩短将空气通道中的真空压力恢复到大气压所需的时间。
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公开(公告)号：US20050283972A1
公开(公告)日：2005-12-29
申请号：US11216074
申请日：2005-09-01
申请人： Yasuharu Ueno , Shozo Minamitani , Shinji Kanayama , Takashi Shimizu , Satoshi Shida , Shunji Onobori
发明人： Yasuharu Ueno , Shozo Minamitani , Shinji Kanayama , Takashi Shimizu , Satoshi Shida , Shunji Onobori
CPC分类号： H01L21/67144 , H01L24/75 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.
摘要翻译： 组件安装系统包括第一到第三（拾取，传输和放置）站。 在部件供应处提供的部件由拾取站处的运送头拾取，然后转移到转运站的放置头。 放置头将组件携带到放置位置，其中组件被放置并安装到诸如电路板的衬底上。 当由放置头保持的部件被成像装置识别在转印站处或其附近。
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公开(公告)号：US20050183263A1
公开(公告)日：2005-08-25
申请号：US11109739
申请日：2005-04-20
CPC分类号： H05K13/0409 , Y10S29/044 , Y10T29/4913 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.
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24.发明授权Method and device for frictional connection and holding tool used for the frictional connection device 失效用于摩擦连接装置的摩擦连接和保持工具的方法和装置公开(公告)号：US06706130B1
公开(公告)日：2004-03-16
申请号：US10089843
申请日：2002-04-04
IPC分类号： B29C6506
CPC分类号： H01L24/81 , B23K20/12 , B23K20/129 , B23K2101/40 , G11B5/48 , G11B5/4806 , G11B5/4826 , G11B5/486 , G11B21/16 , H01L21/67138 , H01L21/6838 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75302 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01025 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/3011
摘要： When pressurizing and relatively moving the objects to be bonded to each other relative to each other subject their metallic bonding portions to friction bonding for the friction bonding of the metallic bonding portions, the friction bonding operation is temporarily partway reduced or stopped.
摘要翻译： 当相对于彼此接合的物体相互加压和相对移动时，金属接合部分被摩擦接合用于金属接合部分的摩擦接合，摩擦接合操作暂时地中止或停止。
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公开(公告)号：US06343415B1
公开(公告)日：2002-02-05
申请号：US09331689
申请日：1999-06-23
申请人： Osamu Okuda , Akira Kabeshita , Satoshi Shida , Makoto Sueki
发明人： Osamu Okuda , Akira Kabeshita , Satoshi Shida , Makoto Sueki
IPC分类号： H05K330
CPC分类号： H05K13/08 , H05K13/0413 , Y10S29/044 , Y10T29/4913 , Y10T29/49131 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： A voice coil motor is attached to a shaft, that is installed in a component holding head, to drive the shaft in an axial direction. Also, a detecting device is arranged to detect movement of the shaft. The supply of power to the voice coil motor is controlled on the basis of a detection result of the detecting device, whereby movement of the shaft in the axial direction is controlled. The movement of the shaft in the axial direction is accordingly correctly known.
摘要翻译： 音圈电机安装在轴上，该轴安装在部件保持头中，以沿轴向驱动轴。 此外，检测装置被布置成检测轴的运动。 基于检测装置的检测结果来控制对音圈马达的供电，从而控制轴在轴向的移动。 因此，轴沿轴向的运动是正确的。
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公开(公告)号：US20140153252A1
公开(公告)日：2014-06-05
申请号：US14237178
申请日：2012-02-15
申请人： Satoshi Shida , Kenji Takahashi , Mitsuko Shuto , Masahiro Miki , Hideo Nagai , Takaari Uemoto
发明人： Satoshi Shida , Kenji Takahashi , Mitsuko Shuto , Masahiro Miki , Hideo Nagai , Takaari Uemoto
CPC分类号： F21K9/23 , F21K9/60 , F21V3/02 , F21V3/061 , F21V3/062 , F21V7/0016 , F21V13/02 , F21V17/101 , F21V23/002 , F21V23/006 , F21V29/15 , F21V29/506 , F21V29/85 , F21Y2115/10
摘要： An LED lamp has an envelope that includes a globe (30) and a case (50), an interior space of the envelope being divided in two by a mount (20) closing an opening of the globe (30), the lamp containing, in a globe (30) side of the interior space, an LED and, in a case (50) side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount (20), and the mount (20) and the case (50) are joined to the globe (30) such that, during light emission, at least as much heat from the LED is propagated from the mount (20) to the globe (30) as from the mount (20) to the case (50).
摘要翻译： LED灯具有包围球体（30）和壳体（50）的外壳，通过关闭球体（30）的开口的安装件（20）将外壳的内部空间分成两部分， 在内部空间的球形（30）侧，LED和在内部空间的壳体（50）侧，用于使LED发光的电路单元。 LED与安装件（20）热连接，并且安装件（20）和壳体（50）与球体（30）接合，使得在发光期间，至少与LED传播的热量相同 从座（20）到壳体（50）的安装件（20）到球体（30）。
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27.发明申请Led with Phosphor Layer Having Different Thickness or Different Phosphor Concentration 有权带有不同厚度或不同磷光体浓度的磷光体层公开(公告)号：US20090001869A1
公开(公告)日：2009-01-01
申请号：US11814349
申请日：2006-05-11
CPC分类号： H01J1/62 , H01L33/507 , H01L33/508 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2933/0041 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light-emitting device (1) includes a substrate (10), a light-emitting element (12) that is mounted on the substrate (10) and includes a luminous region (12b) and a nonluminous region (12a), and a phosphor layer (13) that is formed to cover the light-emitting element (12). The thickness of the phosphor layer (13a) located on the nonluminous region (12a) is smaller than that of the phosphor layer (13b) located on the luminous region (12b). The light-emitting device (1) can suppress nonuniform luminescent color.
摘要翻译： 发光装置（1）包括基板（10），安装在基板（10）上并包括发光区域（12b）和非发光区域（12a）的发光元件（12） 形成为覆盖发光元件（12）的荧光体层（13）。 位于非发光区域（12a）上的荧光体层（13a）的厚度小于位于发光区域（12b）上的荧光体层（13b）的厚度。 发光装置（1）可以抑制发光不均匀。
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公开(公告)号：USD572388S1
公开(公告)日：2008-07-01
申请号：US29299104
申请日：2007-12-19
申请人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
设计人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
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公开(公告)号：USD569529S1
公开(公告)日：2008-05-20
申请号：US29270317
申请日：2006-12-19
申请人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
设计人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
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公开(公告)号：USD568500S1
公开(公告)日：2008-05-06
申请号：US29270332
申请日：2006-12-19
申请人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
设计人： Takaari Uemoto , Keiji Nishimoto , Yasuharu Ueno , Satoshi Shida , Yuji Omata
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