Method for manufacturing a semiconductor device and semiconductor device with overlay mark
    21.
    发明申请
    Method for manufacturing a semiconductor device and semiconductor device with overlay mark 审中-公开
    用于制造具有覆盖标记的半导体器件和半导体器件的方法

    公开(公告)号:US20050026385A1

    公开(公告)日:2005-02-03

    申请号:US10932032

    申请日:2004-09-02

    CPC分类号: G03F7/70633

    摘要: In a method for forming a semiconductor device and a semiconductor device having an overlay mark, a first pattern for the semiconductor device is formed in a semiconductor device formation region of a semiconductor substrate and simultaneously in a first mark formation region of the semiconductor substrate. A second pattern for the semiconductor device is formed on a resultant structure in the semiconductor device formation region of the semiconductor substrate and simultaneously in a second mark formation region of the semiconductor substrate. The first and second patterns in the first and second mark formation regions, respectively, are inspected for misalignments using overlay marks formed to have shapes and sizes identical to those of real patterns in the semiconductor device formation region of the semiconductor substrate. By measuring misalignments of real patterns using the overlay marks, overlay mismatch between the semiconductor device formation region and the overlay mark may be prevented.

    摘要翻译: 在用于形成半导体器件的方法和具有覆盖标记的半导体器件中,半导体器件的第一图案形成在半导体衬底的半导体器件形成区域中,同时在半导体衬底的第一标记形成区域中形成。 在半导体衬底的半导体器件形成区域中的合成结构上形成半导体器件的第二图案,并且同时在半导体衬底的第二标记形成区域中形成半导体器件的第二图案。 使用形成为具有与半导体衬底的半导体器件形成区域中的实际图案的形状和尺寸相同的形状和尺寸的覆盖标记来分别检查第一和第二标记形成区域中的第一和第二图案的未对准。 通过使用覆盖标记测量实际图案的不对准,可以防止半导体器件形成区域和覆盖标记之间的覆盖不匹配。

    Method of measuring an overlay of an object
    22.
    发明授权
    Method of measuring an overlay of an object 有权
    测量物体重叠的方法

    公开(公告)号:US08930011B2

    公开(公告)日:2015-01-06

    申请号:US13107166

    申请日:2011-05-13

    CPC分类号: G03F7/70633

    摘要: A method of measuring an overlay of an object is provided. In the method, first information of a first structure may be obtained. A preliminary structure may be formed on the first structure. Second information of the preliminary structure may be obtained. The first information and the second information may be processed to obtain virtual information of a second structure that would be formed on the first structure if a process is performed on the preliminary structure. A virtual overlay between the first structure and the second structure may be measured using the virtual information.

    摘要翻译: 提供了一种测量物体的重叠的方法。 在该方法中,可以获得第一结构的第一信息。 可以在第一结构上形成初步结构。 可以获得初步结构的第二信息。 如果对初步结构执行处理,则可以处理第一信息和第二信息以获得将在第一结构上形成的第二结构的虚拟信息。 可以使用虚拟信息来测量第一结构和第二结构之间的虚拟覆盖。

    Photolithography method including technique of determining distribution of energy of exposure light passing through slit of exposure apparatus
    23.
    发明授权
    Photolithography method including technique of determining distribution of energy of exposure light passing through slit of exposure apparatus 有权
    光刻方法,包括确定通过曝光装置的狭缝的曝光光的能量分布的技术

    公开(公告)号:US08338063B2

    公开(公告)日:2012-12-25

    申请号:US13402902

    申请日:2012-02-23

    IPC分类号: G03F9/00

    摘要: The energy distribution of exposure light directed passing through the slit of an exposure apparatus is determined. A photoresist layer on a substrate is exposed over a plurality of shots while changing the intensity of the exposure light for each shot. Then the photoresist layer is developed to form a sample photoresist layer. An image of the developed sample photoresist layer is analyzed for color intensity. Values of the color intensity across a selected one of the shots are correlated with values of the intensity of the exposure light to produce an energy distribution of the exposure light along the length of the slit. The energy distribution is used to change the slit so that a more desirable energy distribution may be realized when the slit is used in a process of manufacturing a semiconductor device.

    摘要翻译: 确定通过曝光装置的狭缝的曝光光的能量分布。 衬底上的光致抗蚀剂层在多次照射下曝光,同时改变每次射击的曝光光的强度。 然后将光致抗蚀剂层显影以形成样品光致抗蚀剂层。 分析显影样品光致抗蚀剂层的图像的颜色强度。 所选择的一个拍摄中的颜色强度的值与曝光光的强度的值相关,以产生沿着狭缝的长度的曝光光的能量分布。 使用能量分布来改变狭缝,使得当在制造半导体器件的工艺中使用狭缝时可以实现更理想的能量分布。

    METHOD OF MEASURING AN OVERLAY OF AN OBJECT
    24.
    发明申请
    METHOD OF MEASURING AN OVERLAY OF AN OBJECT 有权
    测量对象覆盖的方法

    公开(公告)号:US20110320025A1

    公开(公告)日:2011-12-29

    申请号:US13107166

    申请日:2011-05-13

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70633

    摘要: A method of measuring an overlay of an object is provided. In the method, first information of a first structure may be obtained. A preliminary structure may be formed on the first structure. Second information of the preliminary structure may be obtained. The first information and the second information may be processed to obtain virtual information of a second structure that would be formed on the first structure if a process is performed on the preliminary structure. A virtual overlay between the first structure and the second structure may be measured using the virtual information.

    摘要翻译: 提供了一种测量物体的重叠的方法。 在该方法中,可以获得第一结构的第一信息。 可以在第一结构上形成初步结构。 可以获得初步结构的第二信息。 如果对初步结构执行处理,则可以处理第一信息和第二信息以获得将在第一结构上形成的第二结构的虚拟信息。 可以使用虚拟信息来测量第一结构和第二结构之间的虚拟覆盖。

    Methods Of Forming Photoresist Patterns
    25.
    发明申请
    Methods Of Forming Photoresist Patterns 有权
    形成光刻胶图案的方法

    公开(公告)号:US20110275020A1

    公开(公告)日:2011-11-10

    申请号:US13099910

    申请日:2011-05-03

    IPC分类号: G03F7/20 G03F7/32

    CPC分类号: G03F7/40 G03F7/322

    摘要: Methods of forming photoresist patterns may include forming a photoresist layer on a substrate, exposing the photoresist layer using an exposure mask, forming a preliminary pattern by developing the exposed photoresist layer and treating a surface of the preliminary pattern using a treatment agent that includes a coating polymer.

    摘要翻译: 形成光致抗蚀剂图案的方法可以包括在基板上形成光致抗蚀剂层,使用曝光掩模曝光光致抗蚀剂层,通过显影曝光的光致抗蚀剂层和使用包括涂层的处理剂处理初步图案的表面来形成初步图案 聚合物。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    26.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20110244689A1

    公开(公告)日:2011-10-06

    申请号:US13076856

    申请日:2011-03-31

    IPC分类号: H01L21/311

    摘要: A method of manufacturing a semiconductor device includes forming a first mask pattern on a substrate by using a material including a polymer having a protection group de-protectable by an acid, the first mask pattern having a plurality of holes; forming a capping layer on an exposed surface of the first mask pattern, the capping layer including an acid source; diffusing the acid source into the first mask pattern so that the protection group becomes de-protectable from the polymer in the first mask pattern; forming a second mask layer on the capping layer, the second mask layer separate from the first mask pattern and filling the plurality of holes in the first mask pattern; and forming a plurality of second mask patterns in the plurality of holes by removing the capping layer and the first mask pattern.

    摘要翻译: 一种制造半导体器件的方法包括:通过使用包括具有可被酸去保护的保护基的聚合物的材料在基板上形成第一掩模图案,所述第一掩模图案具有多个孔; 在所述第一掩模图案的暴露表面上形成覆盖层,所述封盖层包括酸源; 将酸源扩散到第一掩模图案中,使得保护基团在第一掩模图案中从聚合物变得不可保护; 在所述覆盖层上形成第二掩模层,所述第二掩模层与所述第一掩模图案分离并填充所述第一掩模图案中的所述多个孔; 以及通过去除所述封盖层和所述第一掩模图案,在所述多个孔中形成多个第二掩模图案。

    Multi-exposure semiconductor fabrication mask sets and methods of fabricating such multi-exposure mask sets
    28.
    发明授权
    Multi-exposure semiconductor fabrication mask sets and methods of fabricating such multi-exposure mask sets 有权
    多曝光半导体制造掩模组和制造这种多曝光掩模组的方法

    公开(公告)号:US07604907B2

    公开(公告)日:2009-10-20

    申请号:US11243401

    申请日:2005-10-04

    IPC分类号: G03F1/00

    CPC分类号: G03F7/70466 G03F1/00

    摘要: Mask sets are provided which may be used to define a first pattern region that has a first pitch pattern and a second pattern region that has a second pitch pattern during the fabrication of a semiconductor device. These mask sets may include a first mask that has a first exposure region in which a first halftone pattern defines the first pattern region and a first screen region in which a first shield layer covers the second pattern region. These mask sets may further include a second mask that has a second exposure region in which a second halftone pattern defines the second pattern region and a second screen region in which a second shield layer covers the first pattern region. The second shield layer also extends from the second screen region to cover a portion of the second halftone pattern.

    摘要翻译: 提供掩模组,其可以用于限定在制造半导体器件期间具有第一间距图案的第一图案区域和具有第二间距图案的第二图案区域。 这些掩模组可以包括具有第一曝光区域的第一掩模,其中第一半色调图案限定第一图案区域和第一屏蔽区域,其中第一屏蔽层覆盖第二图案区域。 这些掩模组还可以包括具有第二曝光区域的第二掩模,其中第二半色调图案限定第二图案区域和第二屏蔽区域,其中第二屏蔽层覆盖第一图案区域。 第二屏蔽层也从第二屏幕区域延伸以覆盖第二半色调图案的一部分。

    Backlight assembly and assembling method thereof
    29.
    发明申请
    Backlight assembly and assembling method thereof 有权
    背光组件及其组装方法

    公开(公告)号:US20090021938A1

    公开(公告)日:2009-01-22

    申请号:US12149937

    申请日:2008-05-09

    IPC分类号: F21V21/00

    CPC分类号: G02F1/133608 G02F1/133604

    摘要: A backlight assembly includes: lamps; lamp holders each holding at least one of opposite ends of a corresponding one of the lamps, the lamp holders being electrically connected with external electrodes of the lamps; and a lower frame formed to partially cover the lamp holders such that the lower frame is formed in one unified body with the lamp holders.

    摘要翻译: 背光组件包括:灯; 灯保持器,每个保持相应一个灯的相对端中的至少一个,灯座与灯的外部电极电连接; 以及下部框架,其形成为部分地覆盖灯座,使得下部框架与灯座形成在一个统一的主体中。

    Back light unit
    30.
    发明授权
    Back light unit 有权
    背光单元

    公开(公告)号:US07278754B2

    公开(公告)日:2007-10-09

    申请号:US11168535

    申请日:2005-06-29

    IPC分类号: F21S4/00

    摘要: A back light unit includes a plurality of lamps arranged at predetermined distances from each other, each lamp having a lamp tube provided with electrodes at both ends thereof. Common electrodes communicate with both ends of said plurality of lamps and contain a plurality of gripping members for accomodating each of said plurality of lamps. A plurality of releasable connectors fix the common electrodes to first and second lower structures formed below both ends of the plurality of lamps. Electrical connecting elements connect the common electrodes to an inverter.

    摘要翻译: 背光单元包括彼此以预定距离布置的多个灯,每个灯具有在其两端设置有电极的灯管。 公共电极与所述多个灯的两端连通并且包含多个用于容纳所述多个灯中的每一个的夹持构件。 多个可释放连接器将公共电极固定到形成在多个灯的两端的下方的第一和第二下部结构。 电气连接元件将公共电极连接到逆变器。