公开(公告)号：US20210136483A1

公开(公告)日：2021-05-06

申请号：US16673962

申请日：2019-11-05

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R1/24 ,  B81B3/00 ,  H04R3/00

Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.

公开(公告)号：US10390145B1

公开(公告)日：2019-08-20

申请号：US15943637

申请日：2018-04-02

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R19/04 ,  H04R1/08 ,  B81C1/00

Abstract: A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.

公开(公告)号：US20180115836A1

公开(公告)日：2018-04-26

申请号：US15335420

申请日：2016-10-26

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B2201/0257 ,  B81C1/00984 ,  H04R31/003 ,  H04R2201/003

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.

公开(公告)号：US09955268B2

公开(公告)日：2018-04-24

申请号：US14328727

申请日：2014-07-11

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai ,  Jhyy-Cheng Liou

IPC: B81B7/00 ,  H04R23/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0006 ,  B81B7/0058 ,  B81B2201/0257 ,  H04R23/006 ,  H04R2201/003 ,  H04R2460/11

Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.

公开(公告)号：US20150147841A1

公开(公告)日：2015-05-28

申请号：US14092929

申请日：2013-11-28

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: B81C1/00

CPC classification number: B81C1/00928 ,  B81C1/00476

Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.

Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。

公开(公告)号：US20150132880A1

公开(公告)日：2015-05-14

申请号：US14603371

申请日：2015-01-23

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/00 ,  B81B3/0013 ,  B81B7/00 ,  B81B2201/0257 ,  B81C1/00 ,  B81C1/00952 ,  H04R19/005 ,  H04R2201/003

Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.

Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。

公开(公告)号：US20140129764A1

公开(公告)日：2014-05-08

申请号：US14156476

申请日：2014-01-16

Applicant: Solid State System Co., Ltd.

Inventor： Chih-Hung Wang ,  Chao-Han Wu ,  Ting-Chung Hu

IPC: G06F12/02

CPC classification number: G06F12/0246

Abstract: An allocation structure is used for a flash memory device. The flash memory device includes a first memory module and a second memory module. The first memory module and the second memory module respectively have a plurality of groups, and each of the groups of the first memory module has a plurality of physical blocks of the first memory module and each of the groups of the second memory module has a plurality of physical blocks of the second memory module. The allocation structure includes a first zone. The first zone is used to store a first allocation unit, and is formed by a first group of the groups of the first memory module and a first part of a second group of the groups of the second memory module.

Abstract translation: 分配结构用于闪存设备。 闪存器件包括第一存储器模块和第二存储器模块。 第一存储器模块和第二存储器模块分别具有多个组，并且第一存储器模块的每个组具有第一存储器模块的多个物理块，并且第二存储器模块的每个组具有多个 的第二存储器模块的物理块。 分配结构包括第一区域。 第一区域用于存储第一分配单元，并且由第一组存储器模块的第一组和第二存储器模块的组的第二组的第一部分形成。

公开(公告)号：US11498830B2

公开(公告)日：2022-11-15

申请号：US16812395

申请日：2020-03-09

Applicant: Solid State System Co., Ltd.

Inventor： Cheng-Wei Tsai ,  Tsung-Min Hsieh ,  Chien-Hsing Lee

IPC: H04R31/00 ,  H04R7/18 ,  B81B3/00 ,  B81C1/00

Abstract: The invention provides a MEMS microphone. The MEMS microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A diaphragm is disposed within the second opening of the dielectric layer, wherein a peripheral region of the diaphragm is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer and covering over the second opening. The backplate layer includes a plurality of acoustic holes arranged into a regular array pattern. The regular array pattern comprises a pattern unit, the pattern unit comprises one of the acoustic holes as a center hole, and peripheral holes of the acoustic holes surrounding the center hole with a same pitch to the center hole.

公开(公告)号：US10798493B2

公开(公告)日：2020-10-06

申请号：US16223124

申请日：2018-12-18

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: H04N7/00 ,  H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R31/00

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.

公开(公告)号：US20160021448A1

公开(公告)日：2016-01-21

申请号：US14533100

申请日：2014-11-05

Applicant: Solid State System Co., Ltd.

Inventor： Chien-Wen Peng ,  Chao-Ping Chuang

IPC: H04R1/08

CPC classification number: H04R3/00 ,  H04R2410/00

Abstract: A microphone system includes an acoustic control unit and a microphone unit. The acoustic control unit transmits a clock signal and receives an acoustic audio signal and determines whether or not the acoustic audio signal is a valid audio data. The microphone unit receives the clock signal from the acoustic control unit and transmits the acoustic audio signal captured by the microphone unit to the acoustic control unit. Before the acoustic audio signal is determined as the valid audio data, the acoustic control unit transmits the clock signal which is turned on and off repeatedly with an ON duration and an OFF duration.

Abstract translation: 麦克风系统包括声控单元和麦克风单元。 声控制单元发送时钟信号并接收声学音频信号，并且确定声学音频信号是否是有效的音频数据。 麦克风单元从声控单元接收时钟信号，并将由麦克风单元捕获的声音信号发送到声控单元。 在声音音频信号被确定为有效音频数据之前，声控制单元以ON持续时间和OFF持续时间重复地发送打开和关闭的时钟信号。