公开(公告)号：USD656110S1

公开(公告)日：2012-03-20

申请号：US29396487

申请日：2011-06-30

Applicant: Satoshi Shimizu ,  Mami Yamamoto ,  Kazuhisa Iwashita ,  Kazuhiro Inoue ,  Teruo Takeuchi

Designer： Satoshi Shimizu ,  Mami Yamamoto ,  Kazuhisa Iwashita ,  Kazuhiro Inoue ,  Teruo Takeuchi

公开(公告)号：USD629767S1

公开(公告)日：2010-12-28

申请号：US29366434

申请日：2010-07-26

Applicant: Satoshi Shimizu ,  Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi

Designer： Satoshi Shimizu ,  Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi

公开(公告)号：USD624034S1

公开(公告)日：2010-09-21

申请号：US29355736

申请日：2010-02-12

Applicant: Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

Designer： Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

公开(公告)号：USD623153S1

公开(公告)日：2010-09-07

申请号：US29355755

申请日：2010-02-12

Applicant: Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

Designer： Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

公开(公告)号：USD506450S1

公开(公告)日：2005-06-21

申请号：US29199357

申请日：2004-02-17

Applicant: Teruo Takeuchi

Designer： Teruo Takeuchi

公开(公告)号：US06554917B1

公开(公告)日：2003-04-29

申请号：US09744139

申请日：2001-03-19

Applicant: Nobuo Yamagami ,  Kunikazu Tomita ,  Yasuyuki Takada ,  Yoshihiko Oda ,  Chohachi Sato ,  Teruo Takeuchi ,  Ichiro Saito ,  Hiroaki Kato

Inventor： Nobuo Yamagami ,  Kunikazu Tomita ,  Yasuyuki Takada ,  Yoshihiko Oda ,  Chohachi Sato ,  Teruo Takeuchi ,  Ichiro Saito ,  Hiroaki Kato

IPC: C22C3802

CPC classification number: H01F1/14775 ,  C21D8/0226 ,  C21D8/0236 ,  C21D8/0273 ,  C21D8/12 ,  C22C38/002 ,  C22C38/004 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  H01J29/867 ,  H01J2229/003

Abstract: A steel sheet for preparing a heat shrink band effective for preventing the color drift is provided by a steel sheet having 24 kg/mm2 or higher of yield stress and 400 or higher of the product between the permeability &mgr; under a magnetic field of 0.3 Oe and the sheet thickness.

Abstract translation: 用于制备有效防止颜色漂移的热收缩带的钢板是由在0.3Oe的磁场和渗透率μμ之间的产品在屈服应力为24kg / mm2的钢板和400或更高的产品之间提供的， 片材厚度。

公开(公告)号：US6129992A

公开(公告)日：2000-10-10

申请号：US348227

申请日：1999-07-06

Applicant: Yasuharu Sakuma ,  Satoru Tanaka ,  Kazuo Koyama ,  Yujiro Miyauchi ,  Takeshi Kubota ,  Atsushi Itami ,  Hiroaki Kato ,  Chohachi Sato ,  Teruo Takeuchi

Inventor： Yasuharu Sakuma ,  Satoru Tanaka ,  Kazuo Koyama ,  Yujiro Miyauchi ,  Takeshi Kubota ,  Atsushi Itami ,  Hiroaki Kato ,  Chohachi Sato ,  Teruo Takeuchi

IPC: C21D8/02 ,  C21D8/12 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  H01F1/00

CPC classification number: C22C38/004 ,  C21D8/0236 ,  C21D8/1233 ,  C21D8/1277 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C21D8/1222 ,  C21D8/1272 ,  Y10S428/90 ,  Y10S428/928 ,  Y10S428/935 ,  Y10T428/12465 ,  Y10T428/12799 ,  Y10T428/12937 ,  Y10T428/12951

Abstract: Provided are a high strength cold rolled steel sheet and a high strength plated steel sheet possessing improved geomagnetic shielding properties, that is, having a high relative permeability in a d.c. magnetic field around 0.3 Oe, a process for producing the same, and an explosion-proof band or an outer magnetic shielding material, for television cathode-ray tubes, using the steel sheet. An ultra low carbon steel, which has a carbon content of not more than 0.0060% and has been subjected to solid solution strengthening utilizing silicon and magnesium without relying upon precipitation strengthening, is deoxidized with silicon so that aluminum is substantially absent in the steel. Alternatively, when the ultra low carbon steel is deoxidized with aluminum, boron is added to inhibit the precipitation of AlN. Next, the deoxidized steel is finish rolled at 750 to 980.degree. C., cold rolled with a reduction ratio of 60 to 90%, and then annealed in the temperature range of 750.degree. C. to the Ac.sub.3 point in a continuous annealing equipment or an in-line annealing type continuous galvanizing equipment to bring the ferrite grain diameter in the metallographic structure to 10 to 200 .mu.m.

Abstract translation: 本发明提供一种具有改善的地磁屏蔽性能的高强度冷轧钢板和高强度电镀钢板，即在直流电场中具有高的相对磁导率。 约0.3Oe的磁场，其制造方法，以及使用该钢板的电视阴极射线管的防爆带或外部磁屏蔽材料。 碳含量不大于0.0060％的超低碳钢，用硅和镁进行固溶强化而不依赖于析出强化，用硅进行脱氧，从而钢中基本上不存在铝。 或者，当超低碳钢用铝脱氧时，加入硼以抑制AlN的沉淀。 接着，将脱氧钢在750〜980℃精轧，以60〜90％的压下率进行冷轧，然后在连续退火设备中在750℃的温度范围内退火至Ac3点， 在线退火型连续镀锌设备使金相组织中的铁素体晶粒直径达到10〜200μm。

公开(公告)号：US5497937A

公开(公告)日：1996-03-12

申请号：US297519

申请日：1994-08-26

Applicant: Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Isamu Yoshino ,  Teruo Takeuchi

Inventor： Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Isamu Yoshino ,  Teruo Takeuchi

IPC: B23K1/20 ,  B23K35/36 ,  B23K35/38 ,  B23K1/00 ,  C23F11/00

CPC classification number: B23K35/38 ,  B23K1/203 ,  B23K35/3618 ,  Y10T29/49146

Abstract: A flux-free method for bonding a member which is at least partially metallic to another member is provided including preserving the at least partially metallic member in a container having a low gas permeability, together with a packet containing a rust-proof composition; and bonding the at least partially metallic member with the other member by using a filler material.

Abstract translation: 提供一种用于将至少部分金属的部件接合到另一部件的无焊剂方法，包括将至少部分金属部件保存在具有低气体渗透性的容器中，以及含有防锈组合物的包装; 以及通过使用填充材料将所述至少部分金属构件与所述另一构件结合。

公开(公告)号：US5102673A

公开(公告)日：1992-04-07

申请号：US602588

申请日：1990-10-24

Applicant: Yasuo Sugihara ,  Teruo Takeuchi ,  Hidechika Wakabayashi ,  Akira Hosomi ,  Toshio Komatsu

Inventor： Yasuo Sugihara ,  Teruo Takeuchi ,  Hidechika Wakabayashi ,  Akira Hosomi ,  Toshio Komatsu

IPC: A23L3/3418 ,  A23L3/3436 ,  B01D53/14 ,  B01J20/02 ,  B01J20/04 ,  B65D81/26

CPC classification number: B65D81/268 ,  A23L3/3418 ,  A23L3/3436 ,  B01J20/0248 ,  B01J20/041 ,  B01J20/20 ,  B01J20/2805 ,  B01J2220/42

Abstract: There are disclosed an oxygen absorbent comprising boron or a reducing boron compound, an alkaline substance and a carrier, an oxygen absorbent parcel formed by enclosing said oxygen absorbent in a permeable packaging parcel, a food package and a package of a metallic or electronic product or part containing said oxygen absorbent parcel.

公开(公告)号：US08637892B2

公开(公告)日：2014-01-28

申请号：US12886890

申请日：2010-09-21

Applicant: Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

Inventor： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC: H01L33/00

CPC classification number: H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

Abstract translation: 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。