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公开(公告)号：USD649942S1
公开(公告)日：2011-12-06
申请号：US29381737
申请日：2010-12-22
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公开(公告)号：USD629767S1
公开(公告)日：2010-12-28
申请号：US29366434
申请日：2010-07-26
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公开(公告)号：USD644191S1
公开(公告)日：2011-08-30
申请号：US29381723
申请日：2010-12-22
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公开(公告)号：USD658606S1
公开(公告)日：2012-05-01
申请号：US29381335
申请日：2010-12-17
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公开(公告)号：USD644190S1
公开(公告)日：2011-08-30
申请号：US29381314
申请日：2010-12-17
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公开(公告)号：USD626097S1
公开(公告)日：2010-10-26
申请号：US29355533
申请日：2010-02-09
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公开(公告)号：US20110186901A1
公开(公告)日：2011-08-04
申请号：US12875566
申请日：2010-09-03
申请人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
发明人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
IPC分类号： H01L33/48
CPC分类号： H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.
摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。
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公开(公告)号：US20110186868A1
公开(公告)日：2011-08-04
申请号：US12886911
申请日：2010-09-21
申请人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi , Iwao Matsumoto
发明人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi , Iwao Matsumoto
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/05599 , H01L2224/4554
摘要： According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.
摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一和第二引线框架的上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 线将一个端子连接到第一引线框架。 树脂体覆盖第一和第二引线框架，LED芯片和导线。 第一引线框架包括基部和多个延伸部分。 从上方观察，线的接合位置位于连接两个或更多个延伸部分的根部的多边形区域之一内。 树脂体的外观是LED封装的外观的一部分。
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公开(公告)号：US08497521B2
公开(公告)日：2013-07-30
申请号：US12875566
申请日：2010-09-03
申请人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
发明人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.
摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。
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公开(公告)号：USD624034S1
公开(公告)日：2010-09-21
申请号：US29355736
申请日：2010-02-12
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