公开(公告)号：US08115214B2

公开(公告)日：2012-02-14

申请号：US11709764

申请日：2007-02-23

Applicant: Won-Jin Son

Inventor： Won-Jin Son

IPC: H01L27/15

CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 导线连接至少一个发光二极管芯片的电极。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。

公开(公告)号：US07956378B2

公开(公告)日：2011-06-07

申请号：US12772968

申请日：2010-05-03

Applicant: Won-Jin Son

Inventor： Won-Jin Son

IPC: H01L33/36

CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract translation: 提供一种发光二极管封装及其制造方法。 发光二极管封装包括具有空腔的封装主体，多个发光二极管芯片，导线和多个引线框架。 多个发光二极管芯片安装在空腔中。 导线连接至少一个发光二极管芯片的电极。 多个引线框架形成在空腔中，并且至少一个引线框架电连接到发光二极管芯片或多个导线。

公开(公告)号：US20080048203A1

公开(公告)日：2008-02-28

申请号：US11844837

申请日：2007-08-24

Applicant: WON JIN SON

Inventor： WON JIN SON

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/00012

Abstract: Provided are a light emitting apparatus and a light unit. The light emitting apparatus comprises a first substrate, a second substrate, and a light emitting device. The first substrate has a plurality of lead frames, and the second substrate has an opening part on the first substrate. The light emitting device is mounted on a portion of the first substrate that is below the opening part. The light unit comprises at least one light emitting apparatus and an optical member on a light emitting path of the light emitting apparatus.

Abstract translation: 提供了一种发光装置和光单元。 发光装置包括第一基板，第二基板和发光装置。 第一基板具有多个引线框架，第二基板在第一基板上具有开口部。 发光装置安装在第一基板的位于开口部下方的部分上。 光单元包括在发光装置的发光路径上的至少一个发光装置和光学构件。