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    Low-profile electrical and mechanical connector
    21.
    发明授权
    Low-profile electrical and mechanical connector 有权

    公开(公告)号：US09761979B2

    公开(公告)日：2017-09-12

    申请号：US14446163

    申请日：2014-07-29

    Applicant: Apple Inc.

    Inventor： Dhaval N. Shah ,  Trevor J. Ness

    IPC: H01R13/24 ,  H01R12/71 ,  H01R13/52

    CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2435 ,  H01R13/521

    Abstract: A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing.

    Electronic device with mapping circuitry
    24.
    发明授权
    Electronic device with mapping circuitry 有权
    带映射电路的电子设备

    公开(公告)号：US09456307B2

    公开(公告)日：2016-09-27

    申请号：US13904838

    申请日：2013-05-29

    Applicant: Apple Inc.

    Inventor： Vivek Katiyar ,  Andrzej T. Baranski ,  Dhaval N. Shah ,  Stephen Brian Lynch

    IPC: H04M1/00 ,  H04W4/02 ,  G01C3/08 ,  G01C15/00

    CPC classification number: H04W4/026 ,  G01C3/08 ,  G01C15/002

    Abstract: An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object.

    Abstract translation: 电子设备可以设置有电子部件，例如用于测量设备的周围环境中的物体的距离，面积，体积或其他属性的映射电路。 映射电路可以包括激光传感器和设备位置检测电路。 该装置可以包括配置成使用激光传感器和装置位置检测电路来收集激光采样数据和装置位置数据的处理电路。 可以在将激光产生的激光束指向激光传感器中的一个或多个采样点的表面（例如墙壁的表面）上的同时收集激光采样数据和设备位置数据。 通过使用设备位置检测电路跟踪设备位置和方向，可以在从相对于对象的任何位置收集激光采样数据的同时映射对象。

    SELF-CLOSING BUCKLE MECHANISM
    26.
    发明申请
    SELF-CLOSING BUCKLE MECHANISM 有权
    自封扣机构

    公开(公告)号：US20160037866A1

    公开(公告)日：2016-02-11

    申请号：US14641404

    申请日：2015-03-08

    Applicant: Apple Inc.

    Inventor： Matthew D. Rohrbach ,  Peter N. Russell-Clarke ,  Dhaval N. Shah ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Ying-Liang Su ,  Teodor Dabov ,  Michael J. Webb ,  Michael T. Brickner

    IPC: A44B11/24 ,  A41D20/00

    CPC classification number: A44B11/24 ,  A44C5/14 ,  A44C5/20

    Abstract: Embodiments are directed to a wearable device including first and second band straps attached to a device body. A buckle mechanism is configured to attach the first band strap to the second band strap and includes a spring bar attached to an end of the first band strap and a buckle loop engaged to the spring bar. A tang is configured to engage a hole formed in the second band strap to secure the first band strap to the second band strap. The tang defines an aperture that receives the spring bar and is configured to pivot about an offset axis that is offset with respect to an axis of the bar. As the tang is rotated, a restoring force biases the tang toward the buckle loop.

    Abstract translation: 实施例涉及一种可穿戴设备，其包括附接到设备主体的第一和第二带束带。 带扣机构构造成将第一带束带附接到第二带束带并且包括附接到第一带束带的端部的弹簧杆和接合到弹簧杆的带扣环。 脚构造成接合形成在第二带束带中的孔，以将第一带束带固定到第二带束带。 脚限定了接收弹簧杆的孔，并且构造成围绕相对于杆的轴线偏移的偏移轴线枢转。 当柄脚旋转时，恢复力使脚朝向扣环。

    Electronic device with printed circuit board stress monitoring
    27.
    发明授权
    Electronic device with printed circuit board stress monitoring 有权
    带印刷电路板的电子元件应力监测

    公开(公告)号：US09080932B2

    公开(公告)日：2015-07-14

    申请号：US13892748

    申请日：2013-05-13

    Applicant: Apple Inc.

    Inventor： Dhaval N. Shah ,  Shayan Malek ,  Vivek Katiyar

    IPC: G01N3/30 ,  G01M99/00 ,  G01N3/303 ,  G01N33/00

    CPC classification number: G01N3/30 ,  G01L1/2262 ,  G01L1/2287 ,  G01M5/0033 ,  G01M99/00 ,  G01N3/303 ,  G01N2033/0078 ,  G01P15/0891 ,  G06F1/1633 ,  H04M1/0277 ,  H04M1/185 ,  H04M2250/12

    Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

    Abstract translation: 电子设备可以包含安装在诸如印刷电路板的一个或多个基板上的电气部件。 在跌落事件期间，印刷电路板和部件可能受到应力。 应变计可以由嵌入印刷电路板的电介质层中的金属迹线形成。 应变计可用于在板上的各个位置进行应力测量。 应答数据可以响应于来自加速度计的数据而被收集，表示该设备已被丢弃。 响应于确定设备已经撞击到外部表面，可以停止压力数据收集。 可以使用加速度计数据，应变计输出或其他传感器数据检测影响。 应力数据可以由电子设备或外部设备分析。

    LOW-PROFILE ELECTRICAL AND MECHANICAL CONNECTOR
    28.
    发明申请
    LOW-PROFILE ELECTRICAL AND MECHANICAL CONNECTOR 有权
    低型电气和机械连接器

    公开(公告)号：US20150092324A1

    公开(公告)日：2015-04-02

    申请号：US14446163

    申请日：2014-07-29

    Applicant: Apple Inc.

    Inventor： Dhaval N. Shah ,  Trevor J. Ness

    IPC: H01R13/24 ,  H01R12/71 ,  H05K5/02 ,  H01R13/52 ,  H01R4/48

    CPC classification number: H01R13/2407 ,  H01R12/714 ,  H01R13/2435 ,  H01R13/521

    Abstract: A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing.

    Abstract translation: 提供电气和机械连接的连接器和利用连接器的电子设备。 连接器包括刚体，与刚体连接的头部，以及连接到身体的柔性导体。 刚体和柔性导体限定到头部的导电路径。 电子设备包括限定至少一个侧壁，内部部件和穿过至少一个侧壁并且机械接触内部部件的连接器的壳体。 连接器限定从内部部件到外壳的外部的导电路径。

    MODULES FOR INCREASING USEABLE SPACE ON CIRCUIT BOARDS
    29.
    发明申请
    MODULES FOR INCREASING USEABLE SPACE ON CIRCUIT BOARDS 有权
    在电路板上增加可用空间的模块

    公开(公告)号：US20150060126A1

    公开(公告)日：2015-03-05

    申请号：US14015938

    申请日：2013-08-30

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

    IPC: H05K1/11

    CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

    Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

    Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

    MOLDED PARTS
    30.
    发明申请
    MOLDED PARTS 审中-公开
    模具

    公开(公告)号：US20140220320A1

    公开(公告)日：2014-08-07

    申请号：US14245834

    申请日：2014-04-04

    Applicant: Apple Inc.

    Inventor： Bryan P. Kiple ,  Michael B. Wittenberg ,  Dhaval N. Shah ,  Daniel W. Jarvis

    IPC: B29C70/62 ,  H05K7/18

    CPC classification number: B29C70/62 ,  B29C45/0013 ,  B29C45/164 ,  B29K2105/16 ,  H05K7/18 ,  Y10T428/24802 ,  Y10T428/24909 ,  Y10T428/24926

    Abstract: A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.

    Abstract translation: 描述了用于注塑塑料部件的方法和装置。 在一个实施例中，将至少两种材料同时注入模具中。 所得模制部件可以包括至少两个不同的区域。 每个区域都可以具有不同的物理性质。 可以通过控制模具内的至少两种材料的流动前沿来至少部分地控制模制部件内的区域的位置。

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