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公开(公告)号:US20080165809A1
公开(公告)日:2008-07-10
申请号:US11735570
申请日:2007-04-16
申请人: Hideto FURUYAMA
发明人: Hideto FURUYAMA
CPC分类号: H01S5/1071 , H01S5/0625 , H01S5/1032 , H01S5/2224 , H01S5/227
摘要: A laser-induced optical wiring apparatus is provided wherein optical wiring is realized by digital operations of a laser oscillator. The apparatus includes optical ring resonator formed of a loop-shaped optical waveguide on substrate. At least two optical gain sections are provided on the optical ring resonator. When each optical gain section is activated, a laser oscillator including the optical ring resonator and optical gain sections is enabled to oscillate. In this state, the gain of at least one of the optical gain sections is changed in accordance with an input signal, thereby changing the optical route gain of the optical ring resonator to change the oscillation state of the laser oscillator. A change in the laser oscillation state is detected by the optical gain section other than the at least one optical gain section, whereby an output signal is acquired.
摘要翻译: 提供一种激光诱导光线路装置,其中通过激光振荡器的数字操作实现光布线。 该装置包括由基板上的环形光波导形成的光环谐振器。 在光环谐振器上设置至少两个光增益部分。 当每个光学增益部分被激活时,包括光环谐振器和光学增益部分的激光振荡器能够振荡。 在这种状态下,根据输入信号改变至少一个光增益部分的增益,由此改变光环谐振器的光路增益以改变激光振荡器的振荡状态。 通过除了至少一个光学增益部分之外的光学增益部分检测激光振荡状态的变化,由此获取输出信号。
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公开(公告)号:US20100171141A1
公开(公告)日:2010-07-08
申请号:US12729310
申请日:2010-03-23
申请人: Hideto FURUYAMA
发明人: Hideto FURUYAMA
IPC分类号: H01L33/00
摘要: A semiconductor light emitting device includes a silicon substrate, a p-type semiconductor layer provided on the silicon substrate, a n-type semiconductor layer provided on the silicon substrate, the n-type semiconductor layer adjoining the p-type semiconductor layer, and a light emitting section formed at a p-n homojunction between the p-type semiconductor layer and the n-type semiconductor layer. The p-n homojunction is substantially perpendicular to a major surface of the silicon substrate. The p-n homojunction is corrugated with a period matched with an integer multiple of an emission wavelength at the light emitting section.
摘要翻译: 半导体发光器件包括硅衬底,设置在硅衬底上的p型半导体层,设置在硅衬底上的n型半导体层,与p型半导体层相邻的n型半导体层,以及 在p型半导体层和n型半导体层之间的pn同相结合形成的发光部。 p-n同相基本上垂直于硅衬底的主表面。 p-n同质结是在发光部分具有发射波长的整数倍的周期匹配的波纹状的。
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公开(公告)号:US20090080480A1
公开(公告)日:2009-03-26
申请号:US12188840
申请日:2008-08-08
申请人: Hideto FURUYAMA
发明人: Hideto FURUYAMA
IPC分类号: H01S3/00
CPC分类号: G02B6/12004 , H01S5/0028 , H01S5/0608 , H01S5/10 , H01S5/101 , H01S5/1025 , H01S5/1046 , H01S5/1203 , H01S5/20 , H01S5/4031 , H01S5/4056
摘要: A laser-induced optical wiring apparatus includes a substrate, first and second light-reflecting members provided on the substrate separately from each other, an optical waveguide provided on the substrate for optically coupling the first and second light-reflecting members to form an optical resonator, a first optical gain member provided across the optical waveguide and forming a laser oscillator along with the first and second light-reflecting members, and a second optical gain member provided across the optical waveguide separately from the first optical gain member, and forming another laser oscillator along with the first and second light-reflecting members.
摘要翻译: 激光诱导光线路装置包括:基板,分别设置在基板上的第一和第二光反射部件,设置在基板上的光波导,用于光耦合第一和第二光反射部件,以形成光谐振器 设置在所述光波导上并与所述第一和第二光反射部件一起形成激光振荡器的第一光学增益部件和与所述第一光学增益部件分开设置在所述光波导上的第二光学增益部件,以及形成另一激光器 振荡器以及第一和第二光反射部件。
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公开(公告)号:US20090067779A1
公开(公告)日:2009-03-12
申请号:US12204467
申请日:2008-09-04
申请人: Hideto FURUYAMA
发明人: Hideto FURUYAMA
IPC分类号: G02B6/12
CPC分类号: G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1305 , H05K1/0206 , H05K1/189 , H05K3/0061 , H05K2201/0209 , H05K2201/10121 , H01L2924/00
摘要: A flexible optoelectric interconnect includes: an optoelectric film, a driving IC, an optical semiconductor device, a heat dissipation plate and a thermally conductive material. The optoelectric film has an electrical interconnect layer made of a single layer and an optical interconnect layer including an optical waveguide core and an optical waveguide clad. The optoelectric film has a through hole extending from a major surface thereof to a rear surface opposite to the major surface. The driving IC is provided on the major surface of the optoelectric film and electrically connected to the electrical interconnect layer, and provided above the through hole in the optoelectric film. The optical semiconductor device is provided on the major surface of the optoelectric film and driven by the driving IC. The heat dissipation plate is provided on the rear surface of the optoelectric film and covering the through hole such that a part of the through hole is protruded from an outer edge of the driving IC in a view perpendicular to the major surface. The thermally conductive material is provided in the through hole and in contact with the driving IC and the heat dissipation plate.
摘要翻译: 灵活的光电互连包括:光电膜,驱动IC,光半导体器件,散热板和导热材料。 光电膜具有由单层构成的电互连层和包括光波导芯和光波导包层的光学互连层。 光电膜具有从主表面延伸到与主表面相对的后表面的通孔。 驱动IC设置在光电膜的主表面上并电连接到电互连层,并且设置在光电膜的通孔的上方。 光学半导体器件设置在光电膜的主表面上并由驱动IC驱动。 散热板设置在光电膜的后表面上并覆盖通孔,使得通孔的一部分在与主表面垂直的视图中从驱动IC的外边缘突出。 导热材料设置在通孔中并与驱动IC和散热板接触。
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