公开(公告)号：US11272279B1

公开(公告)日：2022-03-08

申请号：US17023231

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Daniel R. Bloom

IPC: H04R1/00 ,  H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11259107B2

公开(公告)日：2022-02-22

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio ,  Timon A. Wright

IPC: H04R5/04 ,  H04R1/10 ,  H04R5/033 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11184695B2

公开(公告)日：2021-11-23

申请号：US16362386

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11134327B2

公开(公告)日：2021-09-28

申请号：US16878536

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jason J. LeBlanc ,  Daniel R. Bloom ,  Edward Siahaan ,  Phillip Qian ,  Lee M. Panecki ,  Eugene Antony Whang ,  Jared M. Kole ,  Audrey L. Sheng ,  Tian Shi Li

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20190230427A1

公开(公告)日：2019-07-25

申请号：US16335846

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20250024183A1

公开(公告)日：2025-01-16

申请号：US18801180

申请日：2024-08-12

Applicant: APPLE INC.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20240357271A1

公开(公告)日：2024-10-24

申请号：US18626112

申请日：2024-04-03

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11985463B2

公开(公告)日：2024-05-14

申请号：US18197672

申请日：2023-05-15

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20230421196A1

公开(公告)日：2023-12-28

申请号：US18367072

申请日：2023-09-12

Applicant: Apple Inc.

Inventor： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC: H04B1/3827

CPC classification number: H04B1/3827

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US20230345162A1

公开(公告)日：2023-10-26

申请号：US18212133

申请日：2023-06-20

Applicant: APPLE INC.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R5/0335 ,  H04R1/105 ,  H04R1/1075

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.