公开(公告)号：US20250153309A1

公开(公告)日：2025-05-15

申请号：US18939322

申请日：2024-11-06

Applicant: Applied Materials, Inc.

Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek

IPC: B24B49/12 ,  H02P29/00

Abstract: A notch finding apparatus includes a sensor to generate a signal that depends on an proportion of a sensing region of the sensor that is covered by a substrate, and a controller configured to cause an actuator to position a carrier head relative to the substrate with the sensing region of the sensor at an edge of the substrate, cause a motor to generate relative motion between the carrier head and the sensor such that the sensing region of the sensor scans along a circumference of the substrate, and detect an angular position of a notch in the edge of the substrate based on an initial signal from the sensor, including generating a second or higher order derivative signal from the initial signal.

公开(公告)号：US12272047B2

公开(公告)日：2025-04-08

申请号：US18496303

申请日：2023-10-27

Applicant: Applied Materials, Inc

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  B24B37/013 ,  G06T7/60

Abstract: A neural network is trained for use in a substrate residue classification system by obtaining ground truth residue level measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to residue level measurements for the top layer in the die region.

公开(公告)号：US12233505B2

公开(公告)日：2025-02-25

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/04

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US20240054634A1

公开(公告)日：2024-02-15

申请号：US18496303

申请日：2023-10-27

Applicant: Applied Materials, Inc

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  G06T7/60 ,  B24B37/013

CPC classification number: G06T7/001 ,  G06T7/60 ,  B24B37/013 ,  G06T2207/30148 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/10024 ,  G06T2207/20021

Abstract: A neural network is trained for use in a substrate residue classification system by obtaining ground truth residue level measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to residue level measurements for the top layer in the die region.

公开(公告)号：US11847776B2

公开(公告)日：2023-12-19

申请号：US17359345

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  G06T7/60 ,  B24B37/013

CPC classification number: G06T7/001 ,  B24B37/013 ,  G06T7/60 ,  G06T2207/10024 ,  G06T2207/20021 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

公开(公告)号：US20230278164A1

公开(公告)日：2023-09-07

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/04 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/042 ,  B24B37/013

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US11715193B2

公开(公告)日：2023-08-01

申请号：US16744058

申请日：2020-01-15

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Robert D. Tolles ,  Boguslaw A. Swedek ,  Abraham Ravid

IPC: G06T7/00 ,  H04N23/10 ,  B24B37/013 ,  G06F3/04842 ,  G06F3/04847 ,  G06F3/0486 ,  G06T5/00 ,  G06T5/50

CPC classification number: G06T7/0006 ,  B24B37/013 ,  G06F3/0486 ,  G06F3/04842 ,  G06F3/04847 ,  G06T5/002 ,  G06T5/50 ,  G06T7/0004 ,  H04N23/10 ,  G06T2207/10024 ,  G06T2207/20024 ,  G06T2207/20216 ,  G06T2207/30148

Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.

公开(公告)号：US20230182258A1

公开(公告)日：2023-06-15

申请号：US18163835

申请日：2023-02-02

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jun Qian ,  Nicholas A. Wiswell ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld

IPC: B24B37/013 ,  G06N3/084

CPC classification number: B24B37/013 ,  G06N3/084

Abstract: During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least the measurement spot of the substrate is generated by a second in-situ imaging system. Machine vision processing, e.g., a convolutional neural network, is used to determine a characterizing value for the measurement spot based on the image. Then a measurement value is calculated based on both the characterizing value and the signal value.

公开(公告)号：US11571786B2

公开(公告)日：2023-02-07

申请号：US16294486

申请日：2019-03-06

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  G06N3/08 ,  B24B53/017 ,  B24B37/04

Abstract: A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

公开(公告)号：US11557048B2

公开(公告)日：2023-01-17

申请号：US16388777

申请日：2019-04-18

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G06T7/40 ,  G06T7/90 ,  H04N5/247 ,  H04N5/225 ,  H04N9/04 ,  B24B37/013 ,  G06T7/00

Abstract: A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.