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公开(公告)号：US20220395254A1
公开(公告)日：2022-12-15
申请号：US17853835
申请日：2022-06-29
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu , Andrew Betts
Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.
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公开(公告)号：US20240416385A1
公开(公告)日：2024-12-19
申请号：US18813377
申请日：2024-08-23
Applicant: BFLY Operations, Inc
Inventor： Lingyun Miao , Jianwei Liu , Keith G. Fife
Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.
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公开(公告)号：US11986349B2
公开(公告)日：2024-05-21
申请号：US16401630
申请日：2019-05-02
Applicant: BFLY OPERATIONS, INC.
Inventor： Keith G. Fife , Jianwei Liu , Joseph Lutsky , Sarp Satir , Jungwook Yang
CPC classification number: A61B8/4483 , A61B8/06 , B06B1/00 , B06B1/0292 , A61B8/4444 , A61B8/483 , A61B8/5207 , B06B2201/76
Abstract: An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
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公开(公告)号：US20240100566A1
公开(公告)日：2024-03-28
申请号：US18530629
申请日：2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US20240024917A1
公开(公告)日：2024-01-25
申请号：US18376598
申请日：2023-10-04
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu
CPC classification number: B06B1/0292 , B81B3/0021 , B81C1/00158 , B81B2201/0271 , B81B2203/0127 , B81C2203/0735 , B81B2207/015 , B81B2207/07 , B81C2201/013 , B81C2201/0125 , B81C2203/036 , B81B2203/04
Abstract: An ultrasound transducer device includes an electrode, a membrane separated from the electrode by a cavity between the membrane and the electrode, a patterned membrane support layer that defines a size and shape of the cavity and that is disposed between the electrode and the membrane, and vias that electrically connect the electrode to a substrate. The vias are disposed in the ultrasound transducer device such that less than 50% of the vias overlap with a support surface of the patterned membrane support layer, in a plan view.
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Patent Agency Ranking
26.发明公开公开(公告)号：US20230158543A1
公开(公告)日：2023-05-25
申请号：US18159983
申请日：2023-01-26
Applicant: BFLY OPERATIONS, INC.
Inventor： Keith G. Fife , Jianwei Liu
IPC: B06B1/02
CPC classification number: B06B1/0292 , B06B1/0207
Abstract: An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated circuit. A first cavity is formed in the third insulating layer. The second substrate is bonded to the first integrated circuit such that the first cavity is sealed.
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公开(公告)号：US20230149976A1
公开(公告)日：2023-05-18
申请号：US18093701
申请日：2023-01-05
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0315 , B81C2201/0176 , B81B2203/0127 , B81C2201/0109 , B81C2201/0125 , B81B2203/0392
Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US20230034707A1
公开(公告)日：2023-02-02
申请号：US17962408
申请日：2022-10-07
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Keith G. Fife
Abstract: A method of manufacturing an ultrasound imaging device involves forming an interposer structure, including forming a first metal material within openings through a substate and on top and bottom surfaces of the substrate, patterning the first metal material, forming a dielectric layer over the patterned first metal material, forming openings within the dielectric layer to expose portions of the patterned first metal material, filling the openings with a second metal material, forming a third metal material on the top and bottom surfaces of the substrate, and patterning the third metal material. The method further involves forming a packaging structure for an ultrasound-on-chip device, including attaching a multi-layer flex substrate to a carrier wafer, bonding a first side of an ultrasound-on-chip device to the multi-layer flex substrate, bonding a second side of the ultrasound-on-chip device to a first side of the interposer structure, and removing the carrier wafer.
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公开(公告)号：US11484911B2
公开(公告)日：2022-11-01
申请号：US16844857
申请日：2020-04-09
Applicant: BFLY Operations, Inc.
Inventor： Lingyun Miao , Jianwei Liu
Abstract: A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.
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公开(公告)号：US11426143B2
公开(公告)日：2022-08-30
申请号：US17088336
申请日：2020-11-03
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu
IPC: H01L29/84 , A61B8/00 , H01L41/293 , H01L41/113
Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.
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