公开(公告)号：US20250128290A1

公开(公告)日：2025-04-24

申请号：US18990023

申请日：2024-12-20

Applicant: BFLY Operations, Inc

Inventor： Jianwei Liu ,  Lingyun Miao ,  Victor L. Pushparaj ,  Nikhil Apte

IPC: B06B1/02 ,  B81B3/00

Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.

公开(公告)号：US12172188B2

公开(公告)日：2024-12-24

申请号：US17685991

申请日：2022-03-03

Applicant: BFLY OPERATIONS, INC.

Inventor： Jianwei Liu ,  Lingyun Miao ,  Victor L. Pushparaj ,  Nikhil Apte

IPC: B06B1/02 ,  B81B3/00

Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.

公开(公告)号：US11883845B2

公开(公告)日：2024-01-30

申请号：US18093701

申请日：2023-01-05

Applicant: BFLY OPERATIONS, INC.

Inventor： Lingyun Miao ,  Keith G. Fife ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B3/001 ,  B81C1/00984 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81C2201/0109 ,  B81C2201/0125 ,  B81C2201/0176

Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.

公开(公告)号：US11766696B2

公开(公告)日：2023-09-26

申请号：US16784186

申请日：2020-02-06

Applicant: BFLY Operations, Inc.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/00 ,  B06B1/02 ,  H10N30/06

CPC classification number: B06B1/0292 ,  H10N30/06 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2201/0101 ,  B81C2201/013 ,  B81C2201/0147 ,  B81C2201/0174 ,  B81C2203/0714

Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.

公开(公告)号：US11501562B2

公开(公告)日：2022-11-15

申请号：US16859124

申请日：2020-04-27

Applicant: BFLY Operations, Inc.

Inventor： Tyler S. Ralston ,  Jonathan M. Rothberg ,  Jianwei Liu

IPC: G06V40/16 ,  A61B5/1171 ,  A61B5/00 ,  G01S7/52 ,  G01S7/539

Abstract: An electronic face-identification device, which performs face scanning with ultrasonic waves, includes a housing and an ultrasound device disposed within the housing. The ultrasound device may be configured to transmit ultrasonic waves through air to a face and scan the face with the ultrasonic waves, to receive reflected waves through the air corresponding to reflections of the ultrasonic waves from the face, and to perform a recognition process for the face based on reflections of the ultrasonic waves from the face. The ultrasound device may include a plurality of ultrasound transducers, and electronic circuitry configured to transmit signals to the ultrasound transducers and receive signals from the ultrasound transducers. The face-identification device may be incorporated into various electronic equipment, such as hand-held equipment in the form of smartphones and tablet computers, as well as in larger scale installations at airports, workplace entryways, and the like.

公开(公告)号：US12178648B2

公开(公告)日：2024-12-31

申请号：US17853835

申请日：2022-06-29

Applicant: BFLY Operations, Inc.

Inventor： Keith G. Fife ,  Jianwei Liu ,  Andrew Betts

IPC: B06B1/06 ,  A61B8/00 ,  B81B7/00 ,  B81C1/00 ,  H10N30/03

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

公开(公告)号：US12070773B2

公开(公告)日：2024-08-27

申请号：US18099456

申请日：2023-01-20

Applicant: BFLY OPERATIONS, INC.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Keith G. Fife

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B3/0021 ,  B81C1/00158 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C2201/0125 ,  B81C2201/013 ,  B81C2201/0176 ,  B81C2203/03

Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.

公开(公告)号：US12053323B2

公开(公告)日：2024-08-06

申请号：US16401870

申请日：2019-05-02

Applicant: BFLY Operations, Inc.

Inventor： Keith G. Fife ,  Jianwei Liu ,  Jungwook Yang ,  Joseph Lutsky

IPC: A61B8/12 ,  B06B1/02 ,  B06B1/06 ,  G01N29/24 ,  H10N30/20

CPC classification number: A61B8/12 ,  B06B1/0207 ,  B06B1/0292 ,  B06B1/0622 ,  G01N29/2406 ,  H10N30/204

Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

公开(公告)号：US11806747B2

公开(公告)日：2023-11-07

申请号：US17953155

申请日：2022-09-26

Applicant: BFLY OPERATIONS, INC.

Inventor： Lingyun Miao ,  Jianwei Liu

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B3/0021 ,  B81C1/00158 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/015 ,  B81B2207/07 ,  B81C2201/013 ,  B81C2201/0125 ,  B81C2203/036 ,  B81C2203/0735

Abstract: An ultrasound transducer device includes an electrode, a membrane, and vias. The membrane is separated from the electrode by a cavity between the membrane and the electrode. The vias electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane. The vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.

公开(公告)号：US20230149977A1

公开(公告)日：2023-05-18

申请号：US18099456

申请日：2023-01-20

Applicant: BFLY OPERATIONS, INC.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Keith G. Fife

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B3/0021 ,  B81C1/00158 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81C2203/03 ,  B81B2203/04 ,  B81C2201/0125 ,  B81C2201/013 ,  B81C2201/0176 ,  B81B2203/0315

Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.